VELLEMAN HSVM100 - Heat sink for K8060

28.87 EUR
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Heat sink suitable for use with the K8060 kit
• Pre-drilled holes for K8060
• Dimensions: 75 x 175 x 28 mm
EAN: 5410329335953
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Heat sink suitable for use with the K8060 kit
• Pre-drilled holes for K8060
• Dimensions: 75 x 175 x 28 mm
EAN: 5410329335953
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products

PCIe fork
The card requires the PCIe fork (bifurcation) function of the motherboard to split the PCIe signal if multiple ports are assigned.
Note
Without PCIe bifurcation, only the first M.2 port of the card can be used.
Specifications
- Connections:
- 4x 67-pin M.2 key M slot
- 1x PCI Express x16, V4.0
- Internal:
- Interface: PCIe
- Supports M.2 modules in formats 2280, 2260, 2242 and 2230 with key M or key B+M on PCIe basis
- Maximum height of components on the module: 1.5 mm, use of two-sided modules possible
- Supports NVM Express (NVMe)
- 4 x LED indicator
- Bootable, UEFI version 2.3.1 or higher
- Supports S.M.A.R.T.
- Supports TRIM
- Heat sink dimensions: (LxWxH): approx. 134 x 93 x 10 mm
System requirements
- Linux Kernel 5.8 or higher
- Windows 8.1/8.1-64/10/10-64
- Windows Server 2016
- PC with one free PCI Express x16/x32 slot
- Motherboard and BIOS with PCIe bifurcation (fork) support





For TO220, TO218 (TOP3)

PCIe Bifurcation
The card requires the PCIe bifurcation of the motherboard to split the PCIe signal in order to use multiple ports.
Note
Without PCIe bifurcation only the first M.2 slot of the card can be used.
Specification
- Connectors:
internal:
4 x 67 pin M.2 key M slot
1 x PCI Express x16, V4.0 - Interface: PCIe
- Supports M.2 modules in format 2280, 2260, 2242 and 2230 with key M or key B+M
based on PCIe - Maximum height of the components on the module: 1.5 mm, application of double-
sided assembled modules supported - Supports NVM Express (NVMe)
- 4 x LED indicator
- Bootable, ex UEFI version 2.3.1
- Supports S.M.A.R.T.
- Dimensions heat sink (LxWxH): ca. 238 x 95 x 8 mm
- 1 x 40 mm fan for active cooling of the M.2 modules
System requirements
- Linux Kernel 5.8 or above
- Windows 8.1/8.1-64/10/10-64/11
- Windows Server 2019
- PC with one free PCI Express x16 / x32 slot
- Motherboard and BIOS with PCIe bifurcation support
Package content
- PCI Express card with fan
- Heat sink
- M.2 mounting material
- Screwdriver
- 4 x thermal conductive pad
- User manual
Package
- Box


for heat sink with corresponding nut. This professional fastening material streamlines the mounting of components in production.
Mounting style: snap-in fastening
for transistor housing: eSIP
suitable for heat sinks:
SK 480
SK 482
SK 483
SK 487
SK 573
SK 490
SK 492
SK 495
SK 574
SK 576
LAM 3 K
Spring force: 40 N
Material: stainless steel

Width: 100 mm
Height: 40 mm
Floor thickness: 10 mm

Universal clamp fastening for all 35 mm support rails according to DIN EN 50 022
Fastening of relay with screws via M4 threaded holes in cooling body
Delivered with clamp fastening KL35





PCIe Bifurcation
The card requires the PCIe bifurcation of the motherboard to split the PCIe signal in order to use multiple ports.
Note
Without PCIe bifurcation only the first M.2 slot of the card can be used.
Technical details
- Connectors:
internal:
4 x M.2 key M slot
1 x PCI Express x16, V4.0 - Interface: PCIe
- Supports M.2 modules in format 2280, 2260, 2242 and 2230 with key M or key B+M based on PCIe
- Maximum height of the components on the module: 1.5 mm, application of double-sided assembled modules supported
- Supports NVM Express (NVMe)
- 5 x LED indicator
- Bootable, ex UEFI version 2.3.1
- Supports S.M.A.R.T.
- Supports TRIM
- Dimensions heat sink (LxWxH): ca. 144 x 95 x 8 mm
System requirements
- Linux Kernel 5.19 or above
- Windows 10/10-64/11
- Windows Server 2019
- PC with one free PCI Express x16 / x32 slot
- Motherboard and BIOS with PCIe bifurcation support
Package content
- PCI Express card
- Heat sink
- Mounting material
- 4 x thermal conductive pad
- User manual
Package
- Box

With excellent heat conductivity
Ideal for LF PAK SMD components


MC (mounting clip) version for clip mounting of the semi-conductor
Heat sink solderable with tin-plated solder pins
Width: 35 mm
Height: 12.7 mm
Length: 25.4 mm
For semi-conductor housing: TO 202, TO 218, TO 220, TOP 3
Minimal heat resistance: 6.2 K/W
Semi-conductor mounting method: Clip mounting
Heat sink mounting type: Soldering
Surface: Black anodised
Material: AlMgSi0.5

Specifications
• width: 12 mm
• height: 6.5 mm
• bottom thickness: 0.6 mm
• Material: AlMgSi 0.5
• Weight: 1.3 g/cm

Matching retaining clamps are to be ordered separately, see THFU 1+2

This ensures a high degree of safety particularly in insulated mounting by dispensing with screws and insulating bushing.
The central pressure ensures consistently good heat transfer from the semiconductor to the heat sink.
Suitable cooling profiles (with clip slot) PR101, PR116, PR118, PR119, PR127, PR233, PR290, PR292, PR293
For semiconductor housing: TO 220
Semiconductor mounting method: clip mounting
Finish: black oxide
Material: spring steel (C67)


Universal clamp fastening for all 35 mm support rails according to DIN EN 50 022
Fastening of relay with screws via M4 threaded holes in cooling body
Delivered with clamp fastening KL35





Universal clamp fastening for all 35 mm support rails according to DIN EN 50 022
Fastening of relay with screws via M4 threaded holes in cooling body
Delivered with clamp fastening KL35

Solderable surface

With M3 threaded hole and elongated hole.

Locks into board using plug-in legs.

With 3.5 mm through hole.

Ready-to-install standard version: PR18/25/SE = with M3-thread for horizontal mounting
Width: 18 mm
Height: 20 mm
Length: 25 mm
For semi-conductor housing: TO 220
Minimal heat resistance: 17 K/W
Semi-conductor mounting method: Screws
Heat sink mounting type: Screws
Surface: Black anodised
Material: AlMgSi0.5

Solderable with tin-plated wire bracket.