THERMAL GRIZZLY TG-WLPC-05 - Conductonaut thermal compound, 5 g
56.36 EUR
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Thermal Grizzly Conductonaut is a liquid metal thermal compound based on a eutectic alloy. Very high thermal conductivity and excellent long-term stability is achieved due to a special mixing ratio of tin, gallium, indium and other metals.
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The five-gram quantity of liquid metal is sufficient for well over 50 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for anyone overclocking or wanting a system as quiet as possible with optimal cooling performance!
Note: The Conductonaut thermal compound must not be used with aluminium coolers!
EAN: 0753677507463
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Thermal Grizzly Conductonaut is a liquid metal thermal compound based on a eutectic alloy. Very high thermal conductivity and excellent long-term stability is achieved due to a special mixing ratio of tin, gallium, indium and other metals.
- Ultra-high thermal conductivity
- Increased indium content
- Plastic needle for optimum application
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The five-gram quantity of liquid metal is sufficient for well over 50 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for anyone overclocking or wanting a system as quiet as possible with optimal cooling performance!
Note: The Conductonaut thermal compound must not be used with aluminium coolers!
EAN: 0753677507463
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
THERMAL GRIZZLY TG-WLPC-01 - Conductonaut thermal compound, 1 g
21.22 EUR
Thermal Grizzly Conductonaut is a liquid metal thermal compound based on an eutectic alloy. Due to a special mixing ratio of tin, gallium and indium among other metals, a very high thermal conductivity and excellent long-term stability is achieved.- Ultra-high thermal conductivity
- Increased indium content
- Optimum application thanks to plastic needle
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The fill quantity of one gram of liquid metal is sufficient for far more than 10 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for overclockers or anyone wanting as quiet a system as possible with optimal cooling performance.
THERMAL GRIZZLY TG-WLPCE-005 - Conductonaut Extreme thermal compound, 5 g
77.03 EUR
Conductonaut Extreme liquid metal thermal conductor is a further development of Conductonaut and was developed for applications with maximum power density. As a gallium-based liquid metal, Conductonaut Extreme is a metallic alloy that is liquid at room temperature, allowing for the thinnest possible layer thickness.- Optimised thermal conductivity compared to conventional liquid metal
- Increased material compatibility
- Optimal application with metal needle
- Available in 1-g or 5-g syringes
- Attention: Electrically conductive!
- Do not allow to come into contact with aluminium!
THERMAL GRIZZLY TG-WLPK-015 - Kryonaut Thermal Compound 5.55g/1.5ml
29.49 EUR
The Kryonaut thermal compound is ideal for cryogenic refrigeration such as nitrogen or compressor cooling - but it is just as comfortable between a CPU and an air or water cooler. Here, aluminium and tin oxide components, which optimally compensate for irregularities on the surfaces of the heat source and heat sink and thus offer superior thermal conductivity, are embedded in a support structure. Unlike many competitor products, Kryonaut does not require a drying process, even at 80°C.The Kryonaut thermal compound is supplied in a 1.5-ml syringe with two applicators. Using these applicators, an area measuring 27x27 mm can be coated with an approx. 3-mm drop of paste, so that the syringe lasts for around 15 applications - but of course, this depends on the individual application and skill.
Technical details:
- Quantity: 1.5 ml/5.55g
- Thermal conductivity: 12.5 W/(m·K)
- Density: 3.7g/cm³
- Viscosity: 120 - 170 Pa·s
- Operating temperature: -200 to +350°C
THERMAL GRIZZLY TG-WLPA-001 - Aeronaut thermal compound 1g
15.02 EUR
Aeronaut thermal compound is an ideal entry-level product with very good effectiveness: Aeronaut's high surface protection and good thermal conductivity are ideal for all users who want to optimise their cooling system effectively or, for example, replace the thermal compound supplied with the hardware - and all this at an outstanding price-performance ratio.- Very good thermal conductivity
- High long-term stability
- No curing
- Not electrically conductive
Although the proportion of metallic elements is slightly lower compared with other products in our assortment, Aeronaut also offers reliable and high-performance thermal conductivity.
THERMAL GRIZZLY TG-WLPH-001 - Hydronaut thermal compound, 1 g
16.05 EUR
With its excellent thermal conductivity, Hydronaut can also be used in overclocking applications, but it was designed specifically for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water cooling system, for example.- Suitable for overclocking
- Excellent thermal conductivity
- No hardening over time
- Silicone-free
- Electrically non-conductive
Hydronaut paste offers optimum thermal conductivity for large-area heat carriers, such as those found in water cooling systems.
Hydronaut thermal compound has a silicone-free carrier structure. This has the advantage of being very lightweight and highly flexible, making the thermal compound very easy to apply.
Hydronaut achieves optimum values for use on medium- and large-area heat carriers. The product, manufactured in accordance with the ROHS standard, is an easy-to-apply heat transfer medium for demanding users.
THERMAL GRIZZLY TG-WLPD-002 - Duronaut thermal compound, 2g, retail
20.18 EUR
Duronaut is a high-end thermal compound that was developed with a focus on excellent thermal conductivity and particularly high long-term stability. The name ''Duronaut'' is derived from the term ''durability''. This exceptionally high long-term stability is achieved through a specially developed silicone oil and the combination of aluminium micro-powder and zinc oxide nano powder in various forms. The optimised particle shape and size minimise the so-called pump-out effect and ensure excellent adhesion of the paste to the surface. This results in extremely low heat transfer resistance.- Extreme long-term stability
- Outstanding thermal conductivity
- Electrically non-conductive
- No hardening over time
THERMAL GRIZZLY TG-WLPCE-001 - Conductonaut Extreme thermal compound, 1 g
28.5 EUR
Conductonaut Extreme liquid metal thermal conductor is a further development of Conductonaut and was developed for applications with maximum power density. As a gallium-based liquid metal, Conductonaut Extreme is a metallic alloy that is liquid at room temperature, allowing for the thinnest possible layer thickness.- Optimised thermal conductivity compared to conventional liquid metal
- Increased material compatibility
- Optimal application with metal needle
- Available in 1-g or 5-g syringes
- Attention: Electrically conductive!
- Do not allow to come into contact with aluminium!
THERMAL GRIZZLY TG-P-A-030-R - Putty Advance thermal compound, 30g
38.48 EUR
TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for differences in height and is therefore ideal as a replacement for thermal pads on graphics cards. Typically, several types of thermal pads at different heights are used ex works, so that when replacing the pads or when converting the cooler on a GPU water cooler, several different pads are required accordingly.The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
THERMAL GRIZZLY TG-WLPA-100 - Aeronaut thermal paste 26 g / 10 ml
33.57 EUR
Aeronaut thermal compound is an ideal entry-level product with very good effectiveness: Aeronaut's high surface protection and good thermal conductivity are ideal for all users who want to optimise their cooling system effectively or, for example, replace the thermal compound supplied with the hardware - and all this at an outstanding price-performance ratio.- Very good thermal conductivity
- High long-term stability
- No curing
- Not electrically conductive
Although the proportion of metallic elements is slightly lower compared with other products in our assortment, Aeronaut also offers reliable and high-performance thermal conductivity.
THERMAL GRIZZLY TG-WLPK-030 - Kyronaut thermal paste 11.1 g / 3 ml
40.86 EUR
The Kryonaut thermal paste is ideal for low temperature cooling such as nitrogen or compressor cooling – it also goes well between a CPU and an air or water cooler. Aluminium and tin oxide components are embedded in a supporting structure that optimally evens out irregularities on the surfaces of heat sources and cooling elements and offer outstanding thermal conductivity. In contrast to many competitor products, no hardening processes start in Kyronaut products even at 80°C.The Kyronaut thermal paste comes as a 3 ml syringe with two applicators included. Using these applicators, a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 30 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 3 ml / 11.1 g
- Thermal conductivity: 12.5 W/(m·K)
- Density: 3.7 g/cm³
- Viscosity: 120 - 170 Pa·s
- Application temperature: -200 to +350°C
THERMAL GRIZZLY TG-MP8-1-1-05-2 - Minus Pad 8 - 100x 100x 0.5 mm, pack of 2
25.4 EUR
The high-performance thermal pads of the minus pad 8 series have a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component differences can thus be very well compensated for. The easy-to-process and flexible minus pads consist of different components: They are based on a ceramic-silicone formula complex and nano-aluminium oxide. The pads therefore always ensure optimum heat transfer. Even the slightest contact pressure is sufficient for optimal attachment. All pads are environmentally friendly and RoHS-compliant.
- High thermal conductivity
- High compressibility
- Electrically insulating
THERMAL GRIZZLY TG-CF-I13G - Intel 13th/14th Gen CPU contact frame
32.59 EUR
With the Intel 13th/14th Gen CPU Contact Frame from der8auer, we have updated the well-known mounting aid for Intel motherboards with LGA1700 sockets. Compared to its predecessor, installation of the frame has been significantly simplified by the use of a revised inner contour. For example, it is no longer necessary to apply a specific torque during assembly.The Contact Frame was developed in collaboration with Roman ''der8auer'' Hartung and is manufactured in Berlin - 100% Made in Germany. Roman Hartung is a mechatronics engineer, hardware enthusiast and content creator in the PC hardware sector. He is also a well-known overclocker who has developed numerous products for overclocking PC hardware.
- Reduction of CPU temperatures
- Easy to install
- High level of compatibility
- Anodised aluminium
THERMAL GRIZZLY TG-P-P-030-R - Putty Pro thermal compound, 30g
51.19 EUR
TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for differences in height and is therefore ideal as a replacement for thermal pads on graphics cards. Typically, several types of thermal pads at different heights are used ex works, so that when replacing the pads or when converting the cooler on a GPU water cooler, several different pads are required accordingly.The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
NO NT-H2-3 - Noctua thermal compound NT_H2, tube 3.5 g
22.04 EUR
NT-H2 is the further improved second generation of Noctua's award-winning hybrid thermal compound. It combines the outstanding ease of use and the proven long-term stability of the popular NT-H1 with a new, re-optimised microparticle formulation for even better thermal performance. For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.
NO 201345 - NOCTUA thermal compound NT-H1, SW (spatula & wipes), 3.5 g
20.18 EUR
Noctua's NT-H1 is a renowned hybrid thermal compound that has received more than 150 recommendations and awards from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiasts worldwide. Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results.
The SW (spatula & wipes) edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.
THERMAL GRIZZLY TG-WLPKE-002 - Kryonaut Extreme thermal compound, 2 g
30.52 EUR
Thermal Grizzly Kryonaut extreme is a high-performance thermal compound based on our proven Kryonaut thermal compound.Maximum thermal conductivity thanks to minimal particle size and layer thickness, combined with improved low-temperature resilience, form the basis for optimum temperatures during extreme overclocking.
- Specially designed for overclocking
- No hardening over time
- High long-term stability
Thermal Grizzly Kryonaut extreme is an extremely powerful thermal compound with improved application and additional electrically non-conductive nano-aluminium oxide particles. The smallest possible particle size allows for better filling of microscopic unevenness, thus enabling better thermal conductivity.
THERMAL GRIZZLY TG-MP8-120-15-1 - Minus Pad 8 – 120 x 20 x 1.5 mm
16.1 EUR
For applications where thermal paste is not an option due to unmanageable application or where distances between heat source and cooling element need to be bridged, the Thermal Grizzly minus pad 8 is the ideal choice – for example on memory chips and voltage transformers. It is based on a silicon-containing supporting complex and aluminium oxide as a heat transfer medium – as well as thermal pastes and thus it is also similar in terms of performance.The minus pad 8 is available in three different dimensions – here 120 x 20 mm – as well as in four thicknesses between 0.5 and 2 millimetres, with the pads available already functioning excellently at a very low contact pressure and the thermal conductivity only marginally influenced by the thickness. The choice of the thickness should therefore only depend on the gap to be bridged.
Technical details:
- Dimensions 120 × 20 × 1.5 mm
- Number: 1
- Thermal conductivity: 8 W/(m·K)
- Application temperature: -100 to +200°C
THERMAL GRIZZLY TG-P-A-100-R - Putty Advance thermal compound, 100g
71.86 EUR
TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for differences in height and is therefore ideal as a replacement for thermal pads on graphics cards. Typically, several types of thermal pads at different heights are used ex works, so that when replacing the pads or when converting the cooler on a GPU water cooler, several different pads are required accordingly.The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
THERMAL GRIZZLY TG-WLPKE-090 - Kryonaut Extreme thermal compound 9ml/33.84 g
97.7 EUR
Thermal Grizzly Kryonaut extreme is a high-performance thermal compound based on our proven Kryonaut thermal compound.Maximum thermal conductivity thanks to minimal particle size and layer thickness, combined with improved low-temperature resilience, form the basis for optimum temperatures during extreme overclocking.
- Specially designed for overclocking
- No curing
- High long-term stability
Thermal Grizzly Kryonaut extreme is an extremely powerful thermal compound with improved application and additional electrically non-conductive nano-aluminium oxide particles. The smallest possible particle size allows for better filling of microscopic unevenness, thus enabling better thermal conductivity.
THERMAL GRIZZLY TG-MP8-30-05-1 - Minus Pad 8 – 30 x 30 x 0.5 mm
13.57 EUR
For applications where thermal paste is not an option due to unmanageable application or where distances between heat source and cooling element need to be bridged, the Thermal Grizzly minus pad 8 is the ideal choice – for example on memory chips and voltage transformers. It is based on a silicon-containing supporting complex and aluminium oxide as a heat transfer medium – as well as thermal pastes and thus it is also similar in terms of performance.The minus pad 8 is available in three different dimensions – here 30 x 30 mm – as well as in four thicknesses between 0.5 and 2 millimetres, with the pads available already functioning excellently at a very low contact pressure and the thermal conductivity only marginally influenced by the thickness. The choice of the thickness should therefore only depend on the gap to be bridged.
Technical details:
- Dimensions 30 × 30 × 0.5 mm
- Number: 1
- Thermal conductivity: 8 W/(m·K)
- Application temperature: -100 to +200°C
THERMAL GRIZZLY TG-MP-B-1-1-05-2 - Minus Pad Basic, 100x100x0.5 mm, pack of 2
25.35 EUR
The Thermal Grizzly Minus Pad Basic thermal pads are part of the Basic, Advance and Pro series. The basic pads are easy to use and offer good thermal conductivity, slightly lower compressibility and excellent value. The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
THERMAL GRIZZLY TG-CA-32-32-02 - Carbonaut 32x 32x, 0.2 mm
23.28 EUR
The high-tech carbon thermal pads of the Thermal Grizzly Carbonaut series are an excellent alternative to thermal compounds in the mid-range performance segment. They have a highly elastic and adaptable surface. Even the smallest component differences can thus be very well compensated for. Carbonaut has high thermal conductivity and extreme long-term stability.- High thermal conductivity
- Consistently high performance
- Does not dry out
- Flexible and easy to use
The Thermal Grizzly Carbonaut Pad is a thermal pad made of carbon fibre. Its specially developed polymer gives the thermal pad its flexibility and its ''soft gap filler'' properties. The carbon fibre structure ensures outstanding thermal conductivity. In addition, the Thermal Grizzly Carbonaut has high thermal conductivity, which it can develop even at very low contact pressure. The Thermal Grizzly Carbonaut pad maintains consistent heat transfer performance.
THERMAL GRIZZLY TG-KS-68-51 - KryoSheet, 68 x 51 mm
38.79 EUR
The graphene thermal pads of the Thermal Grizzly KryoSheet series are an excellent alternative to thermal compounds from the high-performance segment. Similar to Carbonaut pads, they have an adaptable surface with very high thermal conductivity. As a high-end product, KryoSheet offers significantly higher thermal conductivity compared to Carbonaut pads. This increased thermal conductivity is not only due to the choice of materials, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to the usual ageing process that occurs with traditional thermal compound. It cannot dry out.- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
THERMAL GRIZZLY TG-KS-33-33 - KryoSheet, 33x33 mm
34.65 EUR
The graphene thermal pads of the Thermal Grizzly KryoSheet series are an excellent alternative to thermal compounds from the high-performance segment. Similar to Carbonaut pads, they have an adaptable surface with very high thermal conductivity. As a high-end product, KryoSheet offers significantly higher thermal conductivity compared to Carbonaut pads. This increased thermal conductivity is not only due to the choice of materials, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to the usual ageing process that occurs with traditional thermal compound. It cannot dry out.- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
THERMAL GRIZZLY TG-CA-38-38-02 - Carbonaut 38x 38x, 0.2 mm
28.45 EUR
The high-tech carbon thermal pads of the Thermal Grizzly Carbonaut series are an excellent alternative to thermal compounds in the mid-range performance segment. They have a highly elastic and adaptable surface. Even the smallest component differences can thus be very well compensated for. Carbonaut has high thermal conductivity and extreme long-term stability.- High thermal conductivity
- Consistently high performance
- Does not dry out
- Flexible and easy to use
The Thermal Grizzly Carbonaut Pad is a thermal pad made of carbon fibre. Its specially developed polymer gives the thermal pad its flexibility and its ''soft gap filler'' properties. The carbon fibre structure ensures outstanding thermal conductivity. In addition, the Thermal Grizzly Carbonaut has high thermal conductivity, which it can develop even at very low contact pressure. The Thermal Grizzly Carbonaut pad maintains consistent heat transfer performance.
THERMAL GRIZZLY TG-KS-25-25 - KryoSheet, 25 x 25 mm
28.45 EUR
The graphene thermal pads of the Thermal Grizzly KryoSheet series are an excellent alternative to thermal compounds from the high-performance segment. Similar to Carbonaut pads, they have an adaptable surface with very high thermal conductivity. As a high-end product, KryoSheet offers significantly higher thermal conductivity compared to Carbonaut pads. This increased thermal conductivity is not only due to the choice of materials, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to the usual ageing process that occurs with traditional thermal compound. It cannot dry out.- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
NO 201512 - NOCTUA thermal compound NT-H2, AM5, 3.5 g
23.38 EUR
NT-H2 is the further improved second generation of Noctua's award-winning hybrid thermal compound. It combines the iconic NT-H1's proven features, superb ease-of-use and renowned long-term stability with a novel, fine-tuned formula of micro particles for even better thermal performance. Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results, and thanks to the included cleaning wipes, it is just as easy to remove as to apply - an enthusiast-grade paste for the highest demands.
The AM5 Edition also includes the NA-TPG1 thermal paste guard that prevents thermal paste buildup in the cut-outs of the heatspreader of AMD AM5 CPUs - a simple yet highly effective means to keep your AM5 processor clean.
THERMAL GRIZZLY TG-WLPD-006 - Duronaut thermal compound 6g
28.45 EUR
Duronaut is a high-end thermal compound that was developed with a focus on excellent thermal conductivity and particularly high long-term stability. The name ''Duronaut'' is derived from the term ''durability''. This exceptionally high long-term stability is achieved through a specially developed silicone oil and the combination of aluminium micro-powder and zinc oxide nano powder in various forms. The optimised particle shape and size minimise the so-called pump-out effect and ensure excellent adhesion of the paste to the surface. This results in extremely low heat transfer resistance.- Extreme long-term stability
- Outstanding thermal conductivity
- Not electrically conductive
- No curing
THERMAL GRIZZLY TG-WLPH-015 - Hydronaut thermal paste 3.9 g / 1.5 ml
21.22 EUR
The Hydronaut thermal paste is – as its name implies – particularly suitable for water cooling systems it but also goes very well, for example, between a CPU and an air cooler. With its low density and the supporting silicon-free structure it is especially suited for achieving a small layer thickness and thus low temperatures in extensive applications. In contrast to many competitor products the Hydronaut thermal paste tends not to harden and remains flexible.The Hydronaut thermal paste comes as a 3 ml syringe with two applicators included. Using these applicators, a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 30 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 1.5 ml / 3.9 g
- Thermal conductivity: 11.8 W/(m·K)
- Density: 2.6 g/cm³
- Viscosity: 140 - 190 Pa·s
- Application temperature: -200 to +350°C
THERMAL GRIZZLY TG-WLPA-015 - Aeronaut thermal paste 3.9 g / 1.5 ml
16.82 EUR
The Aeronaut thermal paste is the entry-level product of the Thermal Grizzly thermal pastes. Although the proportion of metal oxides is slightly less here, it still offers good thermal conductivity. With its relatively low density and the supporting silicon-based structure, it is especially suited for achieving a small layer thickness and thus low temperatures in extensive applications. It tends not to harden and with its good price-performance ratio and lower metal content, which also protects the surface from heat sources and cooling, it is also ideal for applications where the cooling or heat source is changed often.The Aeronaut thermal paste comes as a 1.5 ml syringe with two applicators included. Using these applicators a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 15 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 1.5 ml / 3.9 g
- Thermal conductivity: 8.5 W/(m·K)
- Density: 2.6 g/cm³
- Viscosity: 110 - 160 Pa·s
- Application temperature: -150 to +200°C
THERMAL GRIZZLY TG-LT-I13G - Intel Lapping Tool 13th/14th GEN
25.35 EUR
The Ryzen 7000 Lapping Tool is designed for grinding the heat spreaders of AMD's AM5 processor series. The tolerances of the Ryzen 7000 Lapping Tool allow for gradual grinding of the heat spreader by 0.4 millimetres, up to a total height of 1.6 millimetres. When using the normal AMD mounting frame (SAM), maximum grinding of 1.0 mm is intended until the middle steps are reached. An additional 0.6 mm is only possible if the CPU is mounted with the AM5 Contact & Sealing Frame, for example. The steps of the Ryzen 7000 Lapping Tool are diamond-milled to achieve high transparency. This makes it easy to see which steps have already been reached and which have not been reached during grinding.- Simplifies grinding of the AM5 CPU
- CNC-milled acrylic glass
- Complete set with sandpaper
- Single use
THERMAL GRIZZLY TG-WLPA-030 - Aeronaut thermal paste 7.8 g / 3 ml
25.44 EUR
The Aeronaut thermal paste is the entry-level product of the Thermal Grizzly thermal pastes. Although the proportion of metal oxides is slightly less here, it still offers good thermal conductivity. With its relatively low density and the supporting silicon-based structure, it is especially suited for achieving a small layer thickness and thus low temperatures in extensive applications. It tends not to harden and with its good price-performance ratio and lower metal content, which also protects the surface from heat sources and cooling, it is also ideal for applications where the cooling or heat source is changed often.The Aeronaut thermal paste comes as a 3 ml syringe with two applicators included. Using these applicators, a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 30 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 3 ml / 7.8 g
- Thermal conductivity: 8.5 W/(m·K)
- Density: 2.6 g/cm³
- Viscosity: 110 - 160 Pa·s
- Application temperature: -150 to +200°C
LC POWER LC-TG-4G - LC-Power LC-TG-4G thermal compound, 4 g
15.11 EUR
The LC-Power thermal compound impresses thanks to its high thermal conductivity, which dissipates heat from the CPU quickly and efficiently.The included spatula makes the thermal compound easy to apply, even for beginners.
- Available in three different quantities: 0.5 g, 1 g and 4 g
- Thermal conductivity: 4 W/mK
- Thermal resistance of 0.095°C*cm2/w
- Viscosity of 4,800,000 mPas (22°C)
- Includes spatula
LC-TG-05G: 0.5 g
LC-TG-1G: 1 g
LC-TG-4G: 4 g
THERMAL GRIZZLY TG-CW-10 - Cleaning Wipes, pack of 10
19.15 EUR
Clean and degreased surfaces are important to ensure that thermal conductive materials such as thermal compounds or liquid metal adhere well and thus develop their full thermal conductivity. This is where TG cleaning wipes come in: cleaning wipes for cleaning surfaces. TG cleaning wipes contain ten double packs, each with two dry wipes and two wet wipes optimised for removing thermal compound residues.- Wet wipes for removing thermal compound
- Removes grease residues (e.g. fingerprints)
- Packaged in ten double packs for easy storage
- A total of 20 dry wipes and 20 wet wipes
First, stubborn dirt is removed with a dry wipe before the surface is cleaned with the two wet wipes. In the third cleaning step, the surface is dried and wiped with a fresh dry wipe.
Assembly aids such as the TG Kapton Insulation Sheet or TG Shield protective lacquer also adhere better to cleaned surfaces. TG cleaning wipes are offered as a practical complete set of 40 cleaning wipes, packaged in ten double packs of two dry wipes and two wet wipes each.
THERMAL GRIZZLY TG-SB-R7000-R - AM5 Short Backplate
27.42 EUR
The AM5 Short Backplate is a shortened mounting plate that replaces the original AM5 backplate. Some CPU coolers compatible with the AM4 socket use a custom retention kit for mounting. Since the AM4 backplate is primarily used for mounting coolers, omitting this backplate is generally not a problem.With the AM5 socket, however, the Socket Actuation Mechanism (SAM) is also screwed onto the backplate and cannot simply be omitted. To use an AM4-compatible cooler with a custom retention kit, an alternative mount for the motherboard's SAM is required.
This is where the AM5 Short Backplate comes into play, serving as a mounting plate for the motherboard's SAM. This extends cooler compatibility to a wide range of CPU coolers. To protect against short circuits, the anodised aluminium plate is additionally coated with an insulating layer of polycarbonate.
THERMAL GRIZZLY TG-KS-29-25 - KryoSheet, 29 x 25 mm
28.45 EUR
The graphene thermal pads of the Thermal Grizzly KryoSheet series are an excellent alternative to thermal compounds from the high-performance segment. Similar to Carbonaut pads, they have an adaptable surface with very high thermal conductivity. As a high-end product, KryoSheet offers significantly higher thermal conductivity compared to Carbonaut pads. This increased thermal conductivity is not only due to the choice of materials, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to the usual ageing process that occurs with traditional thermal compound. It cannot dry out.- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
THERMAL GRIZZLY TG-CSF-AM5 - AM5 Contact Sealing Frame
34.24 EUR
Combination of Contact Frame and CPU GuardThe AM5 Contact Sealing Frame is a combination of a contact frame and CPU guard for AMD's Ryzen-7000 processors. As a contact frame, the AM5 Contact & Sealing Frame creates optimal contact pressure between the CPU and the socket, while an optional, included silicone foam inlay protects the exposed components on the CPU.
- Encloses the heat spreader
- Replaces the motherboard's SAM
- Made of anodised aluminium
- Includes Aeronaut thermal compound
THERMAL GRIZZLY TG-MP8-100-05-1 - Minus Pad 8 – 100 x 100 x 0.5 mm
38.37 EUR
For applications where thermal paste is not an option due to unmanageable application or where distances between heat source and cooling element need to be bridged, the Thermal Grizzly minus pad 8 is the ideal choice – for example on memory chips and voltage transformers. It is based on a silicon-containing supporting complex and aluminium oxide as a heat transfer medium – as well as thermal pastes and thus it is also similar in terms of performance.The minus pad 8 is available in three different dimensions – here 100 x 100 mm – as well as in four thicknesses between 0.5 and 2 millimetres, with the pads available already functioning excellently at a very low contact pressure and the thermal conductivity only marginally influenced by the thickness. The choice of the thickness should therefore only depend on the gap to be bridged.
Technical details:
- Dimensions 100 × 100 × 0.5 mm
- Number: 1
- Thermal conductivity: 8 W/(m·K)
- Application temperature: -100 to +200°C
THERMAL GRIZZLY TG-DDM-R7000-R - Ryzen 7000 Delid-Die-Mate
71.86 EUR
The Ryzen 7000 Delid-Die-Mate is a tool for removing the heat spreader (delidding) on AMD Ryzen 7000/8X00G/9000 processors. Removing the heat spreader allows the CPUs to be cooled, for example, via ''direct die''. With direct-die, the CPU cooler is mounted directly on the CPU dies and the I/O die of the processor. By omitting the heat spreader in the cooling circuit, significantly optimised heat transfer from the dies to the CPU cooler is possible.- Compatible with Ryzen 7000/8000G/9000 CPUs
- Delidding tool
- Made from aluminium
Why delidding and direct die method with Ryzen 7000?
Delidding involves removing the heat spreader from the processor. With unsoldered processors, delidding is typically used to replace the thermal interface material (TIM) between the CPU die and the heat spreader with high-quality thermal compound or liquid metal before the heat spreader is reinstalled.