ICT 71710 - Iceberg Thermal FUZEIce Plus thermal compound, 3.5 g

20.18 EUR
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Low temperatures with high thermal conductivity
Uniformly distributed layers of thermal compound with a high thermal conductivity of 13 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!
EAN: 1230000071710
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Low temperatures with high thermal conductivity
Uniformly distributed layers of thermal compound with a high thermal conductivity of 13 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!
EAN: 1230000071710
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products

Uniformly distributed layers of thermal compound with a high thermal conductivity of 11.25 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!

Uniformly distributed layers of thermal compound with a high thermal conductivity of 13 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!

Uniformly distributed layers of thermal compound with a high thermal conductivity of 11.25 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!

The artistically designed Iceberg Shell protects your cooler and creates an exclusive look for your custom rig.
Mechanical automatic start/stop
Ensures a quiet environment and reduces power consumption and heat generation to create a pleasanter working/gaming experience. When the fan is turned off, it stops until the PWM duty cycle reaches 21%.
Complete bond soldering
Complete bond soldering between the metal fins, no stacked disc arrangement. Bond soldering ensures optimal use of the cooler
2-mm air gaps between fins provide the best balance between air flow and surface contact to achieve rapid heat dissipation.
Brilliant ARGB control function
You can use the ARGB function to customise the colours that light up on your CPU cooler.
Optimised heat control
The large copper base completely covers the chipset and ensures maximum heat dissipation.

Never fear, because the IceGALE® Silent runs at a virtually silent 21.8 dBA, making it quieter than a whisper.
Innovative new fan design
Iceberg Thermal has developed a new fan design, adding improvements from the blades to the frame to achieve higher airflow and air pressure while remaining virtually silent.
Automatic START/STOP function
Creates a quiet environment and reduces power consumption and heat generation for a more comfortable work/play experience. When the fan is turned off, it goes silent until the PWM duty cycle reaches 21%.

Never fear, because the IceGALE® Silent runs at a virtually silent 12.3 dBA, making it quieter than a whisper.
Innovative new fan design
Iceberg Thermal has developed a new fan design, adding improvements from the blades to the frame to achieve higher airflow and air pressure while remaining virtually silent.

For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.

DRIFTIce® from Iceberg Thermal can be applied easily and precisely and provides even contact when filling air gaps.
Iceberg thermal conductivity
The thermal conductivity of this thermal pad is a whopping 13 W/mK. We guarantee that you will be satisfied with the heat transfer of the DRIFTIce®.
Versatile use
DRIFTIce® can be used as a thermal gap filler for your VGA card, RAM and notebook PC components.
Many sizes and different thicknesses
Our thermal pads are available in different sizes and thicknesses. You select the thickness that meets your requirements. You're in control!
Always flexible
Last years, stay flexible and are guaranteed not to be hard or corrosive!

DRIFTIce® from Iceberg Thermal can be applied easily and precisely and provides even contact when filling air gaps.
Iceberg thermal conductivity
The thermal conductivity of this thermal pad is a whopping 13 W/mK. We guarantee that you will be satisfied with the heat transfer of the DRIFTIce®.
Versatile use
DRIFTIce® can be used as a thermal gap filler for your VGA card, RAM and notebook PC components.
Many sizes and different thicknesses
Our thermal pads are available in different sizes and thicknesses. You select the thickness that meets your requirements. You're in control!
Always flexible
Last years, stay flexible and are guaranteed not to be hard or corrosive!

DRIFTIce® from Iceberg Thermal can be applied easily and precisely and provides even contact when filling air gaps.
Iceberg thermal conductivity
The thermal conductivity of this thermal pad is a whopping 13 W/mK. We guarantee that you will be satisfied with the heat transfer of the DRIFTIce®.
Versatile use
DRIFTIce® can be used as a thermal gap filler for your VGA card, RAM and notebook PC components.
Many sizes and different thicknesses
Our thermal pads are available in different sizes and thicknesses. You select the thickness that meets your requirements. You're in control!
Always flexible
Last years, stay flexible and are guaranteed not to be hard or corrosive!

DRIFTIce® from Iceberg Thermal can be applied easily and precisely and provides even contact when filling air gaps.
Iceberg thermal conductivity
The thermal conductivity of this thermal pad is a whopping 13 W/mK. We guarantee that you will be satisfied with the heat transfer of the DRIFTIce®.
Versatile use
DRIFTIce® can be used as a thermal gap filler for your VGA card, RAM and notebook PC components.
Many sizes and different thicknesses
Our thermal pads are available in different sizes and thicknesses. You select the thickness that meets your requirements. You're in control!
Always flexible
Last years, stay flexible and are guaranteed not to be hard or corrosive!

Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results, and thanks to the included cleaning wipes, it is just as easy to remove as to apply - an enthusiast-grade paste for the highest demands.
The AM5 Edition also includes the NA-TPG1 thermal paste guard that prevents thermal paste buildup in the cut-outs of the heatspreader of AMD AM5 CPUs - a simple yet highly effective means to keep your AM5 processor clean.

Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results.
The SW (spatula & wipes) edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.

Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results.
The AM5 edition includes the NA-TPG1 thermal paste guard that prevents thermal paste buildup in the cut-outs of the heatspreader of AMD AM5 processors - a simple yet highly effective means to keep your AM5 processor clean.

The module is cast to be moisture and vibration-resistant. The sealing compound and module housing consists of a special highly thermal conductive plastic. Therefore, no additional heat sink required.
The module is electronically protected against overheating and overload.
Technical data
• Operating voltage 4.5 - 12 V/DC
• Power output max 3.5 W (music output)
• Speaker connection: 4 - 16 ohms
• Input sensitivity < 80 mV
• Frequency response 40 - 20,000 Hz
• Dimensions approx. 40 x 40 x 12 mm (without mounting brackets)