ICT 71697 - Iceberg Thermal FUZEIce thermal compound, 3.5 g
16.1 EUR
Browse the detailed sheet with complete information, compare prices and identify the features of PRODUCTNAME, proposed at the cost of PRICE CURRENCY; belongs to the CATEGORY NAME; the seller is SELLER NAME and the manufacturer is MANUFACTURER NAME.
Low temperatures with high thermal conductivity
Uniformly distributed layers of thermal compound with a high thermal conductivity of 11.25 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!
EAN: 1230000071697
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Low temperatures with high thermal conductivity
Uniformly distributed layers of thermal compound with a high thermal conductivity of 11.25 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!
EAN: 1230000071697
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
ICT 71710 - Iceberg Thermal FUZEIce Plus thermal compound, 3.5 g
20.18 EUR
Low temperatures with high thermal conductivityUniformly distributed layers of thermal compound with a high thermal conductivity of 13 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!
ICT 71727 - Iceberg Thermal FUZEIce Plus thermal compound, 7 g
17.13 EUR
Low temperatures with high thermal conductivityUniformly distributed layers of thermal compound with a high thermal conductivity of 13 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!
ICT 71703 - Iceberg Thermal FUZEIce thermal compound, 7 g
17.13 EUR
Low temperatures with high thermal conductivityUniformly distributed layers of thermal compound with a high thermal conductivity of 11.25 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!
ICT 71673 - Iceberg Thermal IceSLEET G4 Midnight CPU cooler
71.92 EUR
Fan sliding latch technologyDesigned to eliminate the need to struggle with clips to secure your fan to the heat sink. Simply slide the fan down and it's ready to use! Not only is this easy - it also improves RAM access.
Long-term adaptability
With a TDP range of 140 W - 180 W, the G4 Midnight is flexible for your future PC upgrades!
Low noise even at higher speeds
Even with 58.5 CFM airflow, our 600 - 1400 RPM fan has a maximum noise level of 22.5 dBA.
Keep your style
The transparent black fan keeps it in your colour scheme while displaying all the ARGB combinations you might want for your PC.
LGA 1700 mounting kit
The LGA 1700 mounting kit (for IceSLEET® G) is supplied free of charge with the IceSLEET® G3 or G4 series.
ICT 71659 - Iceberg Thermal IceSLEET G4 OC turquoise CPU cooler
69.85 EUR
Fan sliding latch technologyDesigned to eliminate the need to struggle with clips to secure your fan to the heat sink. Simply slide the fan down and it's ready to use! Not only is this easy - it also improves RAM access.
Long-term adaptability
With a TDP range of 140 W - 180 W, the G4 overclock is flexible for your future PC upgrades!
Low noise even at higher speeds
Even with 58.5 CFM airflow, our 600 - 1400 RPM fan has a maximum noise level of 22.5 dBA.
Optimised heat regulation
The large direct-touch socket completely covers the chipset and ensures maximum heat dissipation.
Brilliant ARGB control function
The ARGB function allows you to customise the colours that light up on your CPU cooler. The 16 ARGB LEDs provide a seamless lighting effect.
LGA 1700 mounting kit
The LGA 1700 mounting kit (for IceSLEET® G) is supplied free of charge with the IceSLEET® G3 or G4 series.
ICT 71291 - Iceberg Thermal IceSLEET X5 CPU cooler
73.98 EUR
The sensational Iceberg Shell gives your gaming PC a unique look!The artistically designed Iceberg Shell protects your cooler and creates an exclusive look for your custom rig.
Mechanical automatic start/stop
Ensures a quiet environment and reduces power consumption and heat generation to create a pleasanter working/gaming experience. When the fan is turned off, it stops until the PWM duty cycle reaches 21%.
Complete bond soldering
Complete bond soldering between the metal fins, no stacked disc arrangement. Bond soldering ensures optimal use of the cooler
2-mm air gaps between fins provide the best balance between air flow and surface contact to achieve rapid heat dissipation.
Brilliant ARGB control function
You can use the ARGB function to customise the colours that light up on your CPU cooler.
Optimised heat control
The large copper base completely covers the chipset and ensures maximum heat dissipation.
ICT 71857 - Iceberg Thermal IceGALE Silent PWM case fan, 120 mm, pack of 3
23.18 EUR
So quiet that you won't notice itNever fear, because the IceGALE® Silent runs at a virtually silent 21.8 dBA, making it quieter than a whisper.
Innovative new fan design
Iceberg Thermal has developed a new fan design, adding improvements from the blades to the frame to achieve higher airflow and air pressure while remaining virtually silent.
Automatic START/STOP function
Creates a quiet environment and reduces power consumption and heat generation for a more comfortable work/play experience. When the fan is turned off, it goes silent until the PWM duty cycle reaches 21%.
ICT 71840 - Iceberg Thermal IceGALE Silent case fan, 120 mm, pack of 3
28.25 EUR
So quiet that you won't notice itNever fear, because the IceGALE® Silent runs at a virtually silent 12.3 dBA, making it quieter than a whisper.
Innovative new fan design
Iceberg Thermal has developed a new fan design, adding improvements from the blades to the frame to achieve higher airflow and air pressure while remaining virtually silent.
NO NT-H2-3 - Noctua thermal compound NT_H2, tube 3.5 g
22.04 EUR
NT-H2 is the further improved second generation of Noctua's award-winning hybrid thermal compound. It combines the outstanding ease of use and the proven long-term stability of the popular NT-H1 with a new, re-optimised microparticle formulation for even better thermal performance. For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.
THERMAL GRIZZLY TG-WLPK-015 - Kryonaut Thermal Compound 5.55g/1.5ml
32.11 EUR
The Kryonaut thermal compound is ideal for cryogenic refrigeration such as nitrogen or compressor cooling - but it is just as comfortable between a CPU and an air or water cooler. Here, aluminium and tin oxide components, which optimally compensate for irregularities on the surfaces of the heat source and heat sink and thus offer superior thermal conductivity, are embedded in a support structure. Unlike many competitor products, Kryonaut does not require a drying process, even at 80°C.The Kryonaut thermal compound is supplied in a 1.5-ml syringe with two applicators. Using these applicators, an area measuring 27x27 mm can be coated with an approx. 3-mm drop of paste, so that the syringe lasts for around 15 applications - but of course, this depends on the individual application and skill.
Technical details:
- Quantity: 1.5 ml/5.55g
- Thermal conductivity: 12.5 W/(m·K)
- Density: 3.7g/cm³
- Viscosity: 120 - 170 Pa·s
- Operating temperature: -200 to +350°C
NO 201512 - NOCTUA thermal compound NT-H2, AM5, 3.5 g
23.38 EUR
NT-H2 is the further improved second generation of Noctua's award-winning hybrid thermal compound. It combines the iconic NT-H1's proven features, superb ease-of-use and renowned long-term stability with a novel, fine-tuned formula of micro particles for even better thermal performance. Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results, and thanks to the included cleaning wipes, it is just as easy to remove as to apply - an enthusiast-grade paste for the highest demands.
The AM5 Edition also includes the NA-TPG1 thermal paste guard that prevents thermal paste buildup in the cut-outs of the heatspreader of AMD AM5 CPUs - a simple yet highly effective means to keep your AM5 processor clean.
ICEBERG THERMAL ICT 71321 - DRIFTIce thermal pad, 13 W/mk, 80x40x0.5 mm
15.07 EUR
Simple and precise application!DRIFTIce® from Iceberg Thermal can be applied easily and precisely and provides even contact when filling air gaps.
Iceberg thermal conductivity
The thermal conductivity of this thermal pad is a whopping 13 W/mK. We guarantee that you will be satisfied with the heat transfer of the DRIFTIce®.
Versatile use
DRIFTIce® can be used as a thermal gap filler for your VGA card, RAM and notebook PC components.
Many sizes and different thicknesses
Our thermal pads are available in different sizes and thicknesses. You select the thickness that meets your requirements. You're in control!
Always flexible
Last years, stay flexible and are guaranteed not to be hard or corrosive!
ICEBERG THERMAL ICT 71369 - DRIFTIce thermal pad, 13 W/mk, 120x40x0.5 mm
16.05 EUR
Simple and precise application!DRIFTIce® from Iceberg Thermal can be applied easily and precisely and provides even contact when filling air gaps.
Iceberg thermal conductivity
The thermal conductivity of this thermal pad is a whopping 13 W/mK. We guarantee that you will be satisfied with the heat transfer of the DRIFTIce®.
Versatile use
DRIFTIce® can be used as a thermal gap filler for your VGA card, RAM and notebook PC components.
Many sizes and different thicknesses
Our thermal pads are available in different sizes and thicknesses. You select the thickness that meets your requirements. You're in control!
Always flexible
Last years, stay flexible and are guaranteed not to be hard or corrosive!
ICEBERG THERMAL ICT 71383 - DRIFTIce thermal pad, 13 W/mk, 120x40x1.5 mm
20.23 EUR
Simple and precise application!DRIFTIce® from Iceberg Thermal can be applied easily and precisely and provides even contact when filling air gaps.
Iceberg thermal conductivity
The thermal conductivity of this thermal pad is a whopping 13 W/mK. We guarantee that you will be satisfied with the heat transfer of the DRIFTIce®.
Versatile use
DRIFTIce® can be used as a thermal gap filler for your VGA card, RAM and notebook PC components.
Many sizes and different thicknesses
Our thermal pads are available in different sizes and thicknesses. You select the thickness that meets your requirements. You're in control!
Always flexible
Last years, stay flexible and are guaranteed not to be hard or corrosive!
ICEBERG THERMAL ICT 71345 - DRIFTIce thermal pad, 13 W/mk, 80x40x1.5 mm
17.08 EUR
Simple and precise application!DRIFTIce® from Iceberg Thermal can be applied easily and precisely and provides even contact when filling air gaps.
Iceberg thermal conductivity
The thermal conductivity of this thermal pad is a whopping 13 W/mK. We guarantee that you will be satisfied with the heat transfer of the DRIFTIce®.
Versatile use
DRIFTIce® can be used as a thermal gap filler for your VGA card, RAM and notebook PC components.
Many sizes and different thicknesses
Our thermal pads are available in different sizes and thicknesses. You select the thickness that meets your requirements. You're in control!
Always flexible
Last years, stay flexible and are guaranteed not to be hard or corrosive!
FISCHER ELEKTRONIK WLP 500 - Thermal compound, with silicone, 500-g can
113.29 EUR
Thermal compound with silicone- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
FISCHER ELEKTRONIK WLP 004 - Thermal compound, with silicone, 4-g can
12.95 EUR
Thermal compound with silicone- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
FISCHER ELEKTRONIK WLP 500 S - Thermal compound, with silicone, 500-g cartridge
139.36 EUR
Thermal compound with silicone- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
FISCHER ELEKTRONIK WLP 035 - Thermal compound, with silicone, 35-g can
25.97 EUR
Thermal compound with silicone- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
FISCHER ELEKTRONIK WLP 300 S - Thermal compound, with silicone, 300-g cartridge
99.36 EUR
Thermal compound with silicone- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
SCTEG-1000 - Scythe Thermal Elixer G - 3.5g
23.28 EUR
- Ultra-high performance grease with graphene
- Includes application spatula and cleaning wipes
- RoHS-compliant and environmentally friendly product
- Low viscosity, easy to apply, long lasting and stable performance
- Low conductivity, no short-circuit risk and no risk of corrosion
Contents: 3.5 g
Thermal conductivity: 11 W/mK
Thermal resistance: 0.010°C-in^2/W.
Operating temperature: -20°C to 120°C
Viscosity: 600 kcps
Electrical conductivity: none
THERMAL GRIZZLY TG-WLPC-05 - Conductonaut thermal compound, 5 g
56.36 EUR
Thermal Grizzly Conductonaut is a liquid metal thermal compound based on a eutectic alloy. Very high thermal conductivity and excellent long-term stability is achieved due to a special mixing ratio of tin, gallium, indium and other metals.- Ultra-high thermal conductivity
- Increased indium content
- Plastic needle for optimum application
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The five-gram quantity of liquid metal is sufficient for well over 50 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for anyone overclocking or wanting a system as quiet as possible with optimal cooling performance!
Note: The Conductonaut thermal compound must not be used with aluminium coolers!
NO 201345 - NOCTUA thermal compound NT-H1, SW (spatula & wipes), 3.5 g
20.18 EUR
Noctua's NT-H1 is a renowned hybrid thermal compound that has received more than 150 recommendations and awards from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiasts worldwide. Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results.
The SW (spatula & wipes) edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.
NO 201505 - NOCTUA thermal paste NT-H1, AM5, 3.5 g
20.18 EUR
Noctua's NT-H1 is a renowned hybrid thermal compound that has received more than 150 recommendations and awards from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiasts worldwide. Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results.
The AM5 edition includes the NA-TPG1 thermal paste guard that prevents thermal paste buildup in the cut-outs of the heatspreader of AMD AM5 processors - a simple yet highly effective means to keep your AM5 processor clean.
THERMAL GRIZZLY TG-WLPA-015 - Aeronaut thermal paste 3.9 g / 1.5 ml
21.52 EUR
The Aeronaut thermal paste is the entry-level product of the Thermal Grizzly thermal pastes. Although the proportion of metal oxides is slightly less here, it still offers good thermal conductivity. With its relatively low density and the supporting silicon-based structure, it is especially suited for achieving a small layer thickness and thus low temperatures in extensive applications. It tends not to harden and with its good price-performance ratio and lower metal content, which also protects the surface from heat sources and cooling, it is also ideal for applications where the cooling or heat source is changed often.The Aeronaut thermal paste comes as a 1.5 ml syringe with two applicators included. Using these applicators a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 15 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 1.5 ml / 3.9 g
- Thermal conductivity: 8.5 W/(m·K)
- Density: 2.6 g/cm³
- Viscosity: 110 - 160 Pa·s
- Application temperature: -150 to +200°C
STARTECH.COM ST SILV5-THERMAL - StarTech 5-pack thermal compound, 5x 1.5 g tube
34.71 EUR
5 Pack Resealable nozzles Thermal conductivity: 1.93 W/m-K at 25°C or higher- THERMAL PASTE 5 PACK: Metal-oxide-based compound may help to improve the heat dissipation of CPUs and other computer chips, provides better thermal conductivity than standard thermal compounds with negligible electrical conductivity
- HIGH THERMAL CONDUCTIVITY: Suitable for use at temperatures from -30°C to 180°C, this compound has a thermal conductivity of 3.07 W/m-K at 25°C or higher, ideal for maintenance of workstations or desktop CPUs/GPUs
- PRACTICAL SIZE: Each tube contains 1.5 g of paste (4-6 applications), with a resealable nozzle that prevents it from drying out. The 5 pack is ideal for application to multiple workstations and provides enough compound for 20-30 applications
- CERTIFIED: This thermal compound is CE and RoHS certified, so you can be sure it is safe for its intended use. The mixture contains 50% silicone, 30% carbon and 20% metal oxide.
THERMAL GRIZZLY TG-WLPH-015 - Hydronaut thermal paste 3.9 g / 1.5 ml
25.97 EUR
The Hydronaut thermal paste is – as its name implies – particularly suitable for water cooling systems it but also goes very well, for example, between a CPU and an air cooler. With its low density and the supporting silicon-free structure it is especially suited for achieving a small layer thickness and thus low temperatures in extensive applications. In contrast to many competitor products the Hydronaut thermal paste tends not to harden and remains flexible.The Hydronaut thermal paste comes as a 3 ml syringe with two applicators included. Using these applicators, a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 30 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 1.5 ml / 3.9 g
- Thermal conductivity: 11.8 W/(m·K)
- Density: 2.6 g/cm³
- Viscosity: 140 - 190 Pa·s
- Application temperature: -200 to +350°C
LC POWER LC-TG-4G - LC-Power LC-TG-4G thermal compound, 4 g
15.11 EUR
The LC-Power thermal compound impresses thanks to its high thermal conductivity, which dissipates heat from the CPU quickly and efficiently.The included spatula makes the thermal compound easy to apply, even for beginners.
- Available in three different quantities: 0.5 g, 1 g and 4 g
- Thermal conductivity: 4 W/mK
- Thermal resistance of 0.095°C*cm2/w
- Viscosity of 4,800,000 mPas (22°C)
- Includes spatula
LC-TG-05G: 0.5 g
LC-TG-1G: 1 g
LC-TG-4G: 4 g
STANNOL AMA WLP-T12 5G - Amasan thermal paste T12, 5g cartridge,12.01 EUR Amasan thermal paste T12 - Efficient heat dissipation for maximum performance
When it comes to optimum cooling of semiconductors and electronic components, Amasan T12 thermal compound is the perfect choice.
This high-quality silicone paste improves heat transfer between components and heat sinks, ensures reliable operation and protects your electronics from overheating.
Features
- Effective heat conduction - With its high thermal conductivity, the paste helps to dissipate heat efficiently so that your components work longer and more stably.
- Extremely temperature resistant - Whether it's an icy -30 °C or a hot 200 °C, T12 remains reliable and does not change its consistency or performance.
- Permanent flexibility - No drying out, no melting, no leaking, the paste remains as it should be, even after long periods of use.
- Easy to use - Thanks to its smooth consistency, the paste can be applied effortlessly, whether with a brush, spatula or straight from the tube.
Ideal for many applications
Whether for diodes, transistors or other semiconductors - the T12 closes airy gaps and maximizes heat dissipation. This means you benefit from higher efficiency and a longer service life for your devices.
Specifications
- Color: White (not transparent)
- Consistency: Similar to Vaseline
- Temperature range: -30 °C to +200 °C
- Thermal conductivity: 4.185 W/mK
- Density: 2.3 g/ml
BEQUIET BQT BZ004 - be quiet! Thermal Grease DC2, 3g
18.12 EUR
The perfect addition to any coolerDC2 is the optimal thermal compound for all CPUs, GPUs and PC chips. Their very high thermal conductivity ensures ideal heat exchange between the chip and the cooler. DC2 is the thermal compound of choice for those seeking maximum cooling performance for their PC components.
- Very high thermal conductivity of 7.5 W/mK for excellent heat exchange
- Wide temperature range from -20°C to +120°C
- Package contents of 3 g is sufficient for an average of 9 applications
- Proven high-end performance as an accessory for your Dark Rock air cooler
- Easy application using the enclosed spreader
- Not electrically conductive and therefore safe under all circumstances
- German product concept, design and quality control
AMS OSRAM LR G6SP - SMD LED 3532, red, 623 nm, 3.5 ... 9 cd, 120°, PLCC-6
10.2 EUR
LR G6SP Advanced Power TOPLED®Description
Latest version of Advanced Power TOPLED with increased brightness and improved thermal management.
Features
• Package: white SMT package, colorless clear silicone resin
• Chip technology: Thinfilm
• Typ. Radiation: 120° (Lambertian emitter)
• Color: 623 nm (red)
• Corrosion Robustness Class: 3B
• Qualifications: AEC-Q102 Qualified with RV-level 1
• ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
LC POWER LC-TG-1G - LC-Power LC-TG-1G thermal compound, 1 g
13.56 EUR
The LC-Power thermal compound impresses thanks to its high thermal conductivity, which dissipates heat from the CPU quickly and efficiently.The included spatula makes the thermal compound easy to apply, even for beginners.
- Available in three different quantities: 0.5 g, 1 g and 4 g
- Thermal conductivity: 4 W/mK
- Thermal resistance of 0.095°C*cm2/w
- Viscosity of 4,800,000 mPas (22°C)
- Includes spatula
LC-TG-05G: 0.5 g
LC-TG-1G: 1 g
LC-TG-4G: 4 g
LAPP H07RNF 3G1,5-100 - Hose cable H07RN – 3 x 1.5 mm², 100 m, with PE
149.22 EUR
The H07RN-F is a connector and control cable made of particularly heavy-duty rubber and is particularly suitable for industry and agriculture.- Medium mechanical stress
- Oil-resistant in accordance with EN 60811-404
- Core insulation: rubber compound type EI 4
- Outer sheath: rubber compound type EM 2/li>
- Flame retardant in accordance with IEC 60332-1-2
Areas of application
- Handling equipment and power supply units in accordance with EN 50565-2
- Medium, mechanical stress
- Industrial, agricultural Use in accordance with EN 50565-2: Use in dry, damp or wet rooms as well as for fixed laying e.g. on plaster
LAPP H07RNF 3G2,5-50 - Hose cable H07RN – 3 x 2.5 mm², 50 m, with PE
112.11 EUR
The H07RN-F is a connector and control cable made of particularly heavy-duty rubber and is particularly suitable for industry and agriculture.- Medium mechanical stress
- Oil-resistant in accordance with EN 60811-404
- Core insulation: rubber compound type EI 4
- Outer sheath: rubber compound type EM 2/li>
- Flame retardant in accordance with IEC 60332-1-2
Areas of application
- Handling equipment and power supply units in accordance with EN 50565-2
- Medium, mechanical stress
- Industrial, agricultural Use in accordance with EN 50565-2: Use in dry, damp or wet rooms as well as for fixed laying e.g. on plaster
BACHMANN BACH 398.186 - sheet steel cable drum 3-f. 50m, H05RR-F 3G1.5mm, IP44
194.97 EUR
Stahlbech cable reel 3-way with thermal protection, 3x CEE 7/3 (Type F), 2-pole with protective contactSteel cable reel 3 sockets with cover with thermal protection switch, IP 44 50m H05RR-F 3G1.5mm², black
• Sockets
• 3x CEE 7/3 (Type F)
• 2-pole
• With hinged covers, red
• 16A / 250V~, IP44
BACHMANN BACH 399.004 - cable drum 4-way IP54, 40m, H07RN-F3 G1.5qmm
228.04 EUR
cable reel with 4x CEE7/3 IP54 earthed sockets and 40m H07RN-F3G1.5 CEE7/7 connection cableBACHMANN Master reel 4x earthed plug, black, IP54, incl. thermal fuse Special plastic reel, black 40m H07RN-F3G1. 5mm², black with protective contact central plug IP 44 Packed in a cardboard box DGUV-I 203-006 compliant
Sockets:
• 4x protective contact sockets with hinged cover, black
• IP54
• 16A, AC 230V
• Thermal fuse
LAPP H07RNF 3G2,5-100 - Hose cable H07RN – 3 x 2.5 mm², 100 m, with PE
209.06 EUR
The H07RN-F is a connector and control cable made of particularly heavy-duty rubber and is particularly suitable for industry and agriculture.- Medium mechanical stress
- Oil-resistant in accordance with EN 60811-404
- Core insulation: rubber compound type EI 4
- Outer sheath: rubber compound type EM 2/li>
- Flame retardant in accordance with IEC 60332-1-2
Areas of application
- Handling equipment and power supply units in accordance with EN 50565-2
- Medium, mechanical stress
- Industrial, agricultural Use in accordance with EN 50565-2: Use in dry, damp or wet rooms as well as for fixed laying e.g. on plaster
LAPP H07RNF 3G1,5-50 - Hose cable H07RN – 3 x 1.5 mm², 50 m, with PE
82.2 EUR
The H07RN-F is a connector and control cable made of particularly heavy-duty rubber and is particularly suitable for industry and agriculture.- Medium mechanical stress
- Oil-resistant in accordance with EN 60811-404
- Core insulation: rubber compound type EI 4
- Outer sheath: rubber compound type EM 2/li>
- Flame retardant in accordance with IEC 60332-1-2
Areas of application
- Handling equipment and power supply units in accordance with EN 50565-2
- Medium, mechanical stress
- Industrial, agricultural Use in accordance with EN 50565-2: Use in dry, damp or wet rooms as well as for fixed laying e.g. on plaster
DIODES INCORPORATED AP431SAN1TR-G1 - Voltage reference, 2.5V, 1%, SOT-23
10.21 EUR
The AP431S/AP431SH is a 3-terminal adjustable shunt regulator with guaranteed thermal stability over a full operation range. Itfeatures sharp turn-on characteristics, low-temperature coefficient and low output impedance, which makes it ideal substitute for Zener
diode in applications such as switching power supply, charger and other adjustable regulators.
The AP431S/AP431SH has the same electrical specifications as the industry standard 431 except that it features a low minimum cathode current for regulation. The typical value of 50µA makes the parts ideal for very low power dissipation applications.