FISCHER ELEKTRONIK V ICK S25X25 - Pin heat sink square, 25x25x12.5mm
14.91 EUR
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Pin heat sink, square design with cooling pins
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Pin heat sink, square design with cooling pins
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
Square design with cooling pins
Black anodised surface
square design
With heat conducting foil, not included in scope of delivery, can be glued directly onto the BGA component
surface black anodized
Enclosure: DIL-IC
For housing: 28-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 37 mm
Thermal resistance, Rth: 18.5 K/W
Finish: black anodised
Suitable for free and forced convection
Easy mounting with heat-conducting adhesive film, heat-conducting adhesive or screw mounting
Aluminium, black anodised
Enclosure: DIL-IC
For housing: 14-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 18 mm
Thermal resistance, Rth: 20 K/W
Finish: black anodised
Enclosure: DIL-IC
For housing: 18-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 23 mm
Thermal resistance, Rth: 16 K/W
Finish: black anodised
square design
surface black anodized
With heat conducting foil, not included in scope of delivery, can be glued directly onto the BGA component
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
square design
With heat conducting foil, not included in scope of delivery, can be glued directly onto the BGA component
surface black anodized
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
Square design with cooling pins
Can be stuck directly onto the PGA component with heat-conducting foil
Black anodised surface
Suitable for free and forced convection
Easy mounting with heat-conducting adhesive film, heat-conducting adhesive or screw mounting
Aluminium, black anodised
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
Enclosure: DIL-IC
For housing: 14/16-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 6.3 mm
Thermal resistance, Rth: 54 K/W
Finish: black anodised
Width: 19.0 mm
Height: 4.8 mm
Base thickness: 1.0 mm
Length: 5.0 mm
Rth [K/W]: 56
Finish: back anodised / solderable
34.9 x 12.7 x 38.1 mm, screw-down assembly
- With solder pins
- For TO220, SOT32, TOP3
- Profile width: 35 mm
- Finish: black anodised
Semiconductor mounted using M3 screws (holes without thread) or using transistor retaining clip THF104 (must be ordered separately)
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
Enclosure: DIL-IC
For housing: 16-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 20.5 mm
Thermal resistance, Rth: 18 K/W
Finish: black anodised
Width: 6.3 mm
Height: 4.8 mm
Base thickness: 1.0 mm
Length: 17.0 mm
Rth [K/W]: 51
Finish: back anodised / solderable
Included:
• 5 pcs. ICK SMD A 5 SA
• 5 pcs. ICK SMD A 5 MI
• 5 pcs. ICK SMD A 8 SA
• 5 pcs. ICK SMD A 8 MI
• 5 pcs. ICK SMD A 10 SA
• 5 pcs. ICK SMD A 10 MI
• 5 pcs. ICK SMD A 13 SA
• 5 pcs. ICK SMD A 13 MI
• 5 pcs. ICK SMD A 17 SA
• 5 pcs. ICK SMD A 22 SA
• 4 pcs.ICK SMD B 5 SA
• 4 pcs.ICK SMD B 7 SA
• 4 pcs.ICK SMD B 10 SA
• 3 pcs.ICK SMD B 13 SA
• 3 pcs.ICK SMD B 19 SA
• 2 pcs. ICK SMD C 7 SA
• 2 pcs. ICK SMD C 10 SA
• 2 pcs. ICK SMD C 17 SA
• 2 pcs. ICK SMD E 15 SA
• 2 pcs. ICK SMD E 22 SA
• 5 pcs.ICK SMD F 8 SA
• 5 pcs. ICK SMD F 8 MI
• 5 pcs.ICK SMD F 10 SA
• 5 pcs. ICK SMD F 10 MI
• 3 pcs.ICK SMD F 17 SA
• 3 pcs.ICK SMD F 19 SA
• 3 pcs.ICK SMD F 21 SA
• 3 pcs.ICK SMD F 26 SA
• 1 pc. ICK R
• 3 pc. ICK PLCC 28
• 1 pc. ICK PGA 11 x 11
• 1 pc. ICK PGA 11 x 11 x 12
• 3 pcs. ICK BGA 14 x 14
• 2 pcs. ICK BGA 21 x 21
• 2 pcs. ICK BGA 23 x 23
• 1 pc. ICK BGA 27 x 27
• 1 pc. ICK BGA 35 x 35
• 1 pc. ICK BGA 40 x 40
• 1 pc. ICK SMD E 29 SA
• Thermally conductive adhesives: 1 pc WLK 5
• Thermally conductive film: 1 pc. WLFT 405 R 25 x 130 mm.
Heatsink dimensions match the respective BGA type
Width: 22.3 mm
Height: 8.0 mm
Base thickness: 3.0 mm
Length: 22.3 mm
Rth [K/W]: 21
Finish: back anodised / solderable
14 x 14 x 14 mm, for IC type PGA and others
With excellent heat conductivity
Ideal for D PAK SMD components
35 x 35 x 14 mm, for IC type PGA and others
Low type of construction
Effective heat conduction
Can be directly pasted onto the component
Width: 19.0 mm
Height: 4.8 mm
Base thickness: 1.0 mm
Length: 7.0 mm
Rth [K/W]: 47
Finish: back anodised / solderable
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
Solderable surface
With excellent heat conductivity
Ideal for LF PAK SMD components
Enclosure: DIL-IC
For housing: 36-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 47 mm
Thermal resistance, Rth: 16.5 K/W
Finish: black anodised
Width: 19.0 mm
Height: 4.8 mm
Base thickness: 1.0 mm
Length: 10.0 mm
Rth [K/W]: 35
Finish: back anodised / solderable
Width: 19.0 mm
Height: 4.8 mm
Base thickness: 1.0 mm
Length: 13.0 mm
Rth [K/W]: 29
Finish: back anodised / solderable
With excellent heat conductivity
Ideal for LF PAK SMD components
