FISCHER ELEKTRONIK V 7331E - Profile heat sink, 50x100x40mm, 1.8K/W

20.91 EUR
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Profile heat sink, suitable as a housing rear wall.
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Profile heat sink, suitable as a housing rear wall.
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products


Without perforation

Universal clamp fastening for all 35 mm support rails according to DIN EN 50 022
Fastening of relay with screws via M4 threaded holes in cooling body
Delivered with clamp fastening KL35



Universal clamp fastening for all 35 mm support rails according to DIN EN 50 022
Fastening of relay with screws via M4 threaded holes in cooling body
Delivered with clamp fastening KL35

Solderable surface

With excellent heat conductivity
Ideal for D PAK SMD components

Direct PCB mounting via solderable surface

Direct PCB mounting via solderable surface

Direct PCB mounting via solderable surface

Note
The cooling surface can be concave within the tolerance. This tolerance can be compensated via heat conducting pads/foils.

Colour: ALU natural

With excellent heat conductivity
Ideal for D PAK SMD components

for heat sink with corresponding nut. This professional fastening material streamlines the mounting of components in production.
Mounting style: snap-in fastening
for transistor housing: eSIP
suitable for heat sinks:
SK 480
SK 482
SK 483
SK 487
SK 573
SK 490
SK 492
SK 495
SK 574
SK 576
LAM 3 K
Spring force: 40 N
Material: stainless steel

23 x 23 x 12.3 mm, for IC type PGA and others

With excellent heat conductivity
Ideal for LF PAK SMD components


Matching retaining clamps are to be ordered separately, see THFU 1+2

Universal clamp fastening for all 35 mm support rails according to DIN EN 50 022
Fastening of relay with screws via M4 threaded holes in cooling body
Delivered with clamp fastening KL35


Width: 100 mm
Height: 40 mm
Floor thickness: 10 mm


Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium

Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium

Max. 14.5 mm wide
3 different lengths for varied dissipation power
Less space required than for any other clip-on heat sinks
Simple assembly by means of pushing the heatsink onto the TO 220 housing
Optimal heat transfer due to uniform pressure on the entire supporting surface of the TO 220 housing
Effective heat emission with horizontal and vertical installation


Aluminium, black anodised

With excellent heat conductivity
Ideal for LF PAK SMD components


Direct PCB mounting via solderable surface

Heatsink dimensions match the respective BGA type

With excellent heat conductivity
Ideal for D² PAK SMD components


Low type of construction
Effective heat conduction
Can be directly pasted onto the component

Enclosure: DIL-IC
For housing: 6/8-pin
Width: 6.3 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 8.5 mm
Thermal resistance, Rth: 83 K/W
Finish: black anodised

Max. 14.5 mm wide
3 different lengths for varied dissipation power
Less space required than for any other clip-on heat sinks
Simple assembly by means of pushing the heatsink onto the TO 220 housing
Optimal heat transfer due to uniform pressure on the entire supporting surface of the TO 220 housing
Effective heat emission with horizontal and vertical installation

Enclosure: DIL-IC
For housing: 18-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 23 mm
Thermal resistance, Rth: 16 K/W
Finish: black anodised