THERMAL GRIZZLY TG-WLPH-001 - Hydronaut thermal compound, 1 g
16.05 EUR
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With its excellent thermal conductivity, Hydronaut can also be used in overclocking applications, but it was designed specifically for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water cooling system, for example.
Hydronaut paste offers optimum thermal conductivity for large-area heat carriers, such as those found in water cooling systems.
Hydronaut thermal compound has a silicone-free carrier structure. This has the advantage of being very lightweight and highly flexible, making the thermal compound very easy to apply.
Hydronaut achieves optimum values for use on medium- and large-area heat carriers. The product, manufactured in accordance with the ROHS standard, is an easy-to-apply heat transfer medium for demanding users.
EAN: 4260711990359
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
With its excellent thermal conductivity, Hydronaut can also be used in overclocking applications, but it was designed specifically for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water cooling system, for example.
- Suitable for overclocking
- Excellent thermal conductivity
- No hardening over time
- Silicone-free
- Electrically non-conductive
Hydronaut paste offers optimum thermal conductivity for large-area heat carriers, such as those found in water cooling systems.
Hydronaut thermal compound has a silicone-free carrier structure. This has the advantage of being very lightweight and highly flexible, making the thermal compound very easy to apply.
Hydronaut achieves optimum values for use on medium- and large-area heat carriers. The product, manufactured in accordance with the ROHS standard, is an easy-to-apply heat transfer medium for demanding users.
EAN: 4260711990359
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
- Very good thermal conductivity
- High long-term stability
- No curing
- Not electrically conductive
Although the proportion of metallic elements is slightly lower compared with other products in our assortment, Aeronaut also offers reliable and high-performance thermal conductivity.
- Ultra-high thermal conductivity
- Increased indium content
- Optimum application thanks to plastic needle
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The fill quantity of one gram of liquid metal is sufficient for far more than 10 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for overclockers or anyone wanting as quiet a system as possible with optimal cooling performance.
The Kryonaut thermal compound is supplied in a 1.5-ml syringe with two applicators. Using these applicators, an area measuring 27x27 mm can be coated with an approx. 3-mm drop of paste, so that the syringe lasts for around 15 applications - but of course, this depends on the individual application and skill.
Technical details:
- Quantity: 1.5 ml/5.55g
- Thermal conductivity: 12.5 W/(m·K)
- Density: 3.7g/cm³
- Viscosity: 120 - 170 Pa·s
- Operating temperature: -200 to +350°C
- Suitable for overclocking
- Excellent thermal conductivity
- No curing
- Silicone-free
- Not electrically conductive
Hydronaut paste offers optimum thermal conductivity for large-area heat carriers, such as those found in water cooling systems.
Hydronaut thermal compound has a silicone-free carrier structure. This has the advantage of being very lightweight and highly flexible, making the thermal compound very easy to apply.
Hydronaut achieves optimum values for use on medium- and large-area heat carriers. The product, manufactured in accordance with the ROHS standard, is an easy-to-apply heat transfer medium for demanding users.
- Optimised thermal conductivity compared to conventional liquid metal
- Increased material compatibility
- Optimal application with metal needle
- Available in 1-g or 5-g syringes
- Attention: Electrically conductive!
- Do not allow to come into contact with aluminium!
The Aeronaut thermal paste comes as a 1.5 ml syringe with two applicators included. Using these applicators a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 15 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 1.5 ml / 3.9 g
- Thermal conductivity: 8.5 W/(m·K)
- Density: 2.6 g/cm³
- Viscosity: 110 - 160 Pa·s
- Application temperature: -150 to +200°C
The Kyronaut thermal paste comes as a 3 ml syringe with two applicators included. Using these applicators, a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 30 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 3 ml / 11.1 g
- Thermal conductivity: 12.5 W/(m·K)
- Density: 3.7 g/cm³
- Viscosity: 120 - 170 Pa·s
- Application temperature: -200 to +350°C
- Optimised thermal conductivity compared to conventional liquid metal
- Increased material compatibility
- Optimal application with metal needle
- Available in 1-g or 5-g syringes
- Attention: Electrically conductive!
- Do not allow to come into contact with aluminium!
- Very good thermal conductivity
- High long-term stability
- No curing
- Not electrically conductive
Although the proportion of metallic elements is slightly lower compared with other products in our assortment, Aeronaut also offers reliable and high-performance thermal conductivity.
The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
Award-winning performance
NT-H1 has been included with Noctua's premium CPU coolers since 2007 and has been able to prove its outstanding performance in countless test reports. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.
The minus pad 8 is available in three different dimensions – here 120 x 20 mm – as well as in four thicknesses between 0.5 and 2 millimetres, with the pads available already functioning excellently at a very low contact pressure and the thermal conductivity only marginally influenced by the thickness. The choice of the thickness should therefore only depend on the gap to be bridged.
Technical details:
- Dimensions 120 × 20 × 1.5 mm
- Number: 1
- Thermal conductivity: 8 W/(m·K)
- Application temperature: -100 to +200°C
The Contact Frame was developed in collaboration with Roman ''der8auer'' Hartung and is manufactured in Berlin - 100% Made in Germany. Roman Hartung is a mechatronics engineer, hardware enthusiast and content creator in the PC hardware sector. He is also a well-known overclocker who has developed numerous products for overclocking PC hardware.
- Reduction of CPU temperatures
- Easy to install
- High level of compatibility
- Anodised aluminium
- Reduction of CPU temperatures
- Easy to install
- Anodised aluminium
The Hydronaut thermal paste comes as a 3 ml syringe with two applicators included. Using these applicators, a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 30 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 1.5 ml / 3.9 g
- Thermal conductivity: 11.8 W/(m·K)
- Density: 2.6 g/cm³
- Viscosity: 140 - 190 Pa·s
- Application temperature: -200 to +350°C
- Water cooler for direct-die mounting
- Micro-fin cooler made of nickel-plated copper
- Replaces ILM and heat spreader
- Cover made of acrylic glass and aluminium
- Extreme long-term stability
- Outstanding thermal conductivity
- Electrically non-conductive
- No hardening over time
The series is based on the proven minus pad 8 and has been specifically developed to significantly improve thermal conductivity, compressibility and value for money. The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Excellent thermal conductivity
- Outstanding compressibility
- Easy to use
- Electrically non-conductive
- Water cooler for direct-die mounting
- Micro-fin cooler made of nickel-plated copper
- Replaces SAM and heat spreader
- Cover made of acrylic glass and aluminium
The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
- Extreme long-term stability
- Outstanding thermal conductivity
- Not electrically conductive
- No curing
- High thermal conductivity
- Consistently high performance
- Does not dry out
- Flexible and easy to use
The Thermal Grizzly Carbonaut Pad is a thermal pad made of carbon fibre. Its specially developed polymer gives the thermal pad its flexibility and its ''soft gap filler'' properties. The carbon fibre structure ensures outstanding thermal conductivity. In addition, the Thermal Grizzly Carbonaut has high thermal conductivity, which it can develop even at very low contact pressure. The Thermal Grizzly Carbonaut pad maintains consistent heat transfer performance.
- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
- Replaces ILM and heat spreader
- 207% larger surface area
- Made from nickel-plated copper
- Diamond-milled precision surface
- Compatible with air and water coolers
For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.
For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
Geschwindigkeiten, die nur mit PCIe® 5.0 möglich sind
Die SSD-Serie EXCERIA PLUS G4 ist mit der neuesten und besten Schnittstelle PCIe® ausgestattet und bietet hervorragende Übertragungsgeschwindigkeiten von bis zu 10.000 MB/s für sequentielle Lesevorgänge und 8.200 MB/s für sequentielle Schreibvorgänge. Unabhängig davon, ob du das neueste Spiel lädst oder das nächste virale Video bearbeitest, bietet diese neue Produktreihe die Geschwindigkeit, die du benötigst.
Effiziente Leistung hat Vorrang
Die SSD-Serie EXCERIA PLUS G4 bietet eine deutlich verbesserte Leistung ohne übermäßigen Energie- oder Kühlungsbedarf. EXCERIA PLUS G4 SSDs wurden mit Blick auf Effizienz entwickelt und bieten einen geringen Stromverbrauch, wodurch die in Ihrem System erzeugte Wärme reduziert wird. Diese SSDs bieten eine um bis zu 80 % höhere Energieeffizienz bei maximaler sequenzieller Lesegeschwindigkeit im Vergleich zur vorherigen Generation der EXCERIA PLUS G3-Serie.
Erweiterte Wärmeableitung
EXCERIA PLUS G4 SSDs verfügen über innovative Produktetiketten, die die Wärmeableitung verbessern und so für eine höhere Leistungsstabilität sorgen.
Hochmoderner 3-D-Flashspeicher
Jede EXCERIA-SSD verwendet BiCS FLASH™ und eine vertikal gestapelte Zellenkonstruktion, was eine hochmoderne Speichererfahrung erst möglich macht.
SSD-Verwaltungsdienstprogramm
Das SSD-Verwaltungsdienstprogramm wurde entwickelt, um das meiste aus Ihrem KIOXIA-Laufwerk herauszuholen und Ihnen Kontrolle über Wartung, Überwachung und mehr zu verleihen!
Wir empfehlen Ihnen dringend, die neueste Version zu installieren und zu aktualisieren, um die Leistung Ihres Laufwerks zu maximieren und die verbleibende prozentuale Lebensdauer mithilfe der Zustandsanzeige zu überprüfen.
Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results.
The SW (spatula & wipes) edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.
The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
Machen Sie den ersten Schritt in die Welt der PCIe®-5.0-Performance. Die KIOXIA EXCERIA G3 SSD Series, ein Einsteigermodell mit PCIe®-5.0-Unterstützung, hebt die Leistung auf ein neues Niveau – mit bis zu 10 000 MB/s sequenzieller Lesegeschwindigkeit*¹. Sie beschleunigt nicht nur alltägliche PC-Aufgaben, sondern unterstützt auch KI-Anwendungen und sorgt für ein angenehm leistungsstarkes Gaming-Erlebnis. Dank BiCS FLASH™ 3D-Flashspeicher bietet diese weiterentwickelte SSD-Serie nun bis zu 2 TB Kapazität im M.2-2280-Formfaktor – ideal für Desktop-PCs wie auch Notebooks.
Details:
- BiCS FLASH™
- NVMe™ 2.0c-Technologie
- M.2 2280-Formfaltor
- PCIe® Gen5 x4
- SSD-Verwaltungsdienstprogramm
Der Einstieg in die PCIe®-5.0-Leistung
Mit der neuesten und leistungsstärksten PCIe®-5.0-Schnittstelle bietet die EXCERIA G3 SSD Series hervorragende Übertragungsgeschwindigkeiten von bis zu 10 000 MB/s beim sequentiellen Lesen und 9 600 MB/s beim sequentiellen Schreiben. Ob Sie das neueste Spiel laden oder ein Video bearbeiten – diese neue Serie ist die ideale Wahl für alle, die PCIe®-5.0-Performance erleben möchten.
Erweiterte Wärmeableitung
EXCERIA G3 SSDs verfügen über innovative Produktetiketten, die die Wärmeableitung verbessern und so zu einer stabilen Leistung unter anspruchsvollen Bedingungen beitragen.
NVMe™-Technologie
Mit der NVMe™-2.0c-Technologie reduzieren EXCERIA G3 SSDs die Latenz im I/O-Pfad zwischen Ihrer SSD und Ihrer CPU, was zu einer flüssigen und reaktionsschnellen Leistung führt.
Hochmoderner 3D-Flash-Speicher
Jede EXCERIA SSD wird mit BiCS FLASH™ und einer vertikal gestapelten Zellstruktur gefertigt und bietet so ein hochmodernes Speichererlebnis.
SSD-Verwaltungsdienstprogramm
Das SSD-Verwaltungsdienstprogramm wurde entwickelt, um Ihr KIOXIA-Laufwerk optimal zu unterstützen und Ihnen umfassende Kontrolle über Wartung, Überwachung und vieles mehr zu geben.
Wir empfehlen dringend, die neueste Version zu installieren und regelmäßig zu aktualisieren, um die Leistung Ihres Laufwerks zu maximieren und den verbleibenden Lebensprozentsatz über die Zustandsanzeige zu überprüfen.
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
Die Serie EXCERIA PLUS G3 SSD von KIOXIA verfügt über eine leistungsstarke PCIe®4.0-Schnittstelle und bietet eine verbesserte Leistung für Gamer und Videobearbeiter. Mit einer Kapazität von 1 TB bis zu 2 TB eignet sich die einseitig bestückte M.2 2280-Serie hervorragend für Mainstream-Desktops und -Notebooks, die den neuesten PCIe®4.0 Standard unterstützen.
Merkmale
- BiCS FLASH™
- NVMe™ 1.4-Technologie
- M.2-2280-Formfaktor
- PCIe® Gen4 x4
Willkommen in der Welt von PCIe ® 4.0
Die EXCERIA PLUS G3 SSD-Serie wurde entwickelt, um ein verbessertes PC-Erlebnis zu bieten. Sie ist mit PCIe® 4.0 kompatibel und liefert außergewöhnliche Übertragungsgeschwindigkeiten von bis zu 5.000 MB/s bei sequentiellen Lesezugriffen und 3.900 MB/s bei sequentiellen Schreibzugriffen. Diese neue Serie bietet die nötige Leistung, sowohl für Gaming als auch für die Videobearbeitung.
Platzsparender Speicher
Mit ihrem platzsparenden, einseitig verwendbaren M.2 2280-Formfaktor ist die EXCERIA PLUS G3 SSD-Serie mit einer größeren Anzahl von Geräten kompatibel. Diese kompakten SSDs werden direkt in die Hauptplatine eingesteckt, wodurch Kabelsalat vermieden und ein schlankes und einfaches System-Upgrade ermöglicht wird.
Mit PCIe® 4.0 auf der Überholspur 4.0
Die EXCERIA PLUS G3 SSD-Serie bietet mehr Leistung ohne Abstriche. Durch die Unterstützung von PCIe® 4.0 und NVMe™ 1.4 setzen diese SSDs neue Maßstäbe im Mainstream-Bereich und bieten ein verbessertes Computererlebnis für Gamer und Videobearbeiter.
Hochmoderner 3-D-Flashspeicher
Jede EXCERIA-SSD verwendet BiCS FLASH™ und eine vertikal gestapelte Zellenkonstruktion, was eine hochmoderne Speichererfahrung erst möglich macht.
SSD-Verwaltungsdienstprogramm
Das SSD-Verwaltungsdienstprogramm wurde entwickelt, um das meiste aus Ihrem KIOXIA-Laufwerk herauszuholen und Ihnen Kontrolle über Wartung, Überwachung und mehr zu verleihen!
Wir empfehlen Ihnen dringend, die neueste Version zu installieren und zu aktualisieren, um die Leistung Ihres Laufwerks zu maximieren und die verbleibende prozentuale Lebensdauer mithilfe der Zustandsanzeige zu überprüfen.
Kryonaut is also recommended as a top product for critical cooling systems in the industrial sector.
- Specially designed for overclocking
- Excellent thermal conductivity
- No curing
- High long-term stability
- Not electrically conductive
-Ceramic-based compound containing silicone
-Thermal conductivity of more than 1.066 W/m-K
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
