THERMAL GRIZZLY TG-WLPA-001 - Aeronaut thermal compound 1g
15.02 EUR
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Aeronaut thermal compound is an ideal entry-level product with very good effectiveness: Aeronaut's high surface protection and good thermal conductivity are ideal for all users who want to optimise their cooling system effectively or, for example, replace the thermal compound supplied with the hardware - and all this at an outstanding price-performance ratio.
Although the proportion of metallic elements is slightly lower compared with other products in our assortment, Aeronaut also offers reliable and high-performance thermal conductivity.
EAN: 4260711990397
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Aeronaut thermal compound is an ideal entry-level product with very good effectiveness: Aeronaut's high surface protection and good thermal conductivity are ideal for all users who want to optimise their cooling system effectively or, for example, replace the thermal compound supplied with the hardware - and all this at an outstanding price-performance ratio.
- Very good thermal conductivity
- High long-term stability
- No curing
- Not electrically conductive
Although the proportion of metallic elements is slightly lower compared with other products in our assortment, Aeronaut also offers reliable and high-performance thermal conductivity.
EAN: 4260711990397
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
THERMAL GRIZZLY TG-WLPA-015 - Aeronaut thermal paste 3.9 g / 1.5 ml
16.82 EUR
The Aeronaut thermal paste is the entry-level product of the Thermal Grizzly thermal pastes. Although the proportion of metal oxides is slightly less here, it still offers good thermal conductivity. With its relatively low density and the supporting silicon-based structure, it is especially suited for achieving a small layer thickness and thus low temperatures in extensive applications. It tends not to harden and with its good price-performance ratio and lower metal content, which also protects the surface from heat sources and cooling, it is also ideal for applications where the cooling or heat source is changed often.The Aeronaut thermal paste comes as a 1.5 ml syringe with two applicators included. Using these applicators a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 15 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 1.5 ml / 3.9 g
- Thermal conductivity: 8.5 W/(m·K)
- Density: 2.6 g/cm³
- Viscosity: 110 - 160 Pa·s
- Application temperature: -150 to +200°C
THERMAL GRIZZLY TG-WLPA-100 - Aeronaut thermal paste 26 g / 10 ml
32.59 EUR
Aeronaut thermal compound is an ideal entry-level product with very good effectiveness: Aeronaut's high surface protection and good thermal conductivity are ideal for all users who want to optimise their cooling system effectively or, for example, replace the thermal compound supplied with the hardware - and all this at an outstanding price-performance ratio.- Very good thermal conductivity
- High long-term stability
- No curing
- Not electrically conductive
Although the proportion of metallic elements is slightly lower compared with other products in our assortment, Aeronaut also offers reliable and high-performance thermal conductivity.
THERMAL GRIZZLY TG-WLPH-001 - Hydronaut thermal compound, 1 g
16.05 EUR
With its excellent thermal conductivity, Hydronaut can also be used in overclocking applications, but it was designed specifically for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water cooling system, for example.- Suitable for overclocking
- Excellent thermal conductivity
- No hardening over time
- Silicone-free
- Electrically non-conductive
Hydronaut paste offers optimum thermal conductivity for large-area heat carriers, such as those found in water cooling systems.
Hydronaut thermal compound has a silicone-free carrier structure. This has the advantage of being very lightweight and highly flexible, making the thermal compound very easy to apply.
Hydronaut achieves optimum values for use on medium- and large-area heat carriers. The product, manufactured in accordance with the ROHS standard, is an easy-to-apply heat transfer medium for demanding users.
THERMAL GRIZZLY TG-WLPC-01 - Conductonaut thermal compound, 1 g
21.22 EUR
Thermal Grizzly Conductonaut is a liquid metal thermal compound based on an eutectic alloy. Due to a special mixing ratio of tin, gallium and indium among other metals, a very high thermal conductivity and excellent long-term stability is achieved.- Ultra-high thermal conductivity
- Increased indium content
- Optimum application thanks to plastic needle
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The fill quantity of one gram of liquid metal is sufficient for far more than 10 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for overclockers or anyone wanting as quiet a system as possible with optimal cooling performance.
THERMAL GRIZZLY TG-WLPK-015 - Kryonaut Thermal Compound 5.55g/1.5ml
29.49 EUR
The Kryonaut thermal compound is ideal for cryogenic refrigeration such as nitrogen or compressor cooling - but it is just as comfortable between a CPU and an air or water cooler. Here, aluminium and tin oxide components, which optimally compensate for irregularities on the surfaces of the heat source and heat sink and thus offer superior thermal conductivity, are embedded in a support structure. Unlike many competitor products, Kryonaut does not require a drying process, even at 80°C.The Kryonaut thermal compound is supplied in a 1.5-ml syringe with two applicators. Using these applicators, an area measuring 27x27 mm can be coated with an approx. 3-mm drop of paste, so that the syringe lasts for around 15 applications - but of course, this depends on the individual application and skill.
Technical details:
- Quantity: 1.5 ml/5.55g
- Thermal conductivity: 12.5 W/(m·K)
- Density: 3.7g/cm³
- Viscosity: 120 - 170 Pa·s
- Operating temperature: -200 to +350°C
THERMAL GRIZZLY TG-WLPCE-001 - Conductonaut Extreme thermal compound, 1 g
28.5 EUR
Conductonaut Extreme liquid metal thermal conductor is a further development of Conductonaut and was developed for applications with maximum power density. As a gallium-based liquid metal, Conductonaut Extreme is a metallic alloy that is liquid at room temperature, allowing for the thinnest possible layer thickness.- Optimised thermal conductivity compared to conventional liquid metal
- Increased material compatibility
- Optimal application with metal needle
- Available in 1-g or 5-g syringes
- Attention: Electrically conductive!
- Do not allow to come into contact with aluminium!
THERMAL GRIZZLY TG-WLPK-030 - Kyronaut thermal paste 11.1 g / 3 ml
38.79 EUR
The Kryonaut thermal paste is ideal for low temperature cooling such as nitrogen or compressor cooling – it also goes well between a CPU and an air or water cooler. Aluminium and tin oxide components are embedded in a supporting structure that optimally evens out irregularities on the surfaces of heat sources and cooling elements and offer outstanding thermal conductivity. In contrast to many competitor products, no hardening processes start in Kyronaut products even at 80°C.The Kyronaut thermal paste comes as a 3 ml syringe with two applicators included. Using these applicators, a 27 x 27 mm large surface can be painted with a drop about 3 mm in size, here the syringe lasts for 30 applications – that, of course, depends on the individual application and on the skill.
Technical details:
- Quantity: 3 ml / 11.1 g
- Thermal conductivity: 12.5 W/(m·K)
- Density: 3.7 g/cm³
- Viscosity: 120 - 170 Pa·s
- Application temperature: -200 to +350°C
THERMAL GRIZZLY TG-WLPCE-005 - Conductonaut Extreme thermal compound, 5 g
77.03 EUR
Conductonaut Extreme liquid metal thermal conductor is a further development of Conductonaut and was developed for applications with maximum power density. As a gallium-based liquid metal, Conductonaut Extreme is a metallic alloy that is liquid at room temperature, allowing for the thinnest possible layer thickness.- Optimised thermal conductivity compared to conventional liquid metal
- Increased material compatibility
- Optimal application with metal needle
- Available in 1-g or 5-g syringes
- Attention: Electrically conductive!
- Do not allow to come into contact with aluminium!
NO NT-H1-10 - Noctua thermal compound NT_H1, tube 10 g
26.28 EUR
Noctua's NT-H1 is a renowned hybrid thermal compound that has received more than 150 recommendations and awards from international hardware websites and magazines. Thanks to excellent performance, exceptional ease of use and outstanding long-term stability, it has become a favourite of the international overclocking and enthusiast scene. Whether for air or water cooling, CPU or GPU applications, overclocking or silent systems, NT-H1 is a proven premium solution that guarantees the best results! Award-winning performance
NT-H1 has been included with Noctua's premium CPU coolers since 2007 and has been able to prove its outstanding performance in countless test reports. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.
THERMAL GRIZZLY TG-P-B-100-R - Putty Basic thermal compound, 100g
46.02 EUR
TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for differences in height and is therefore ideal as a replacement for thermal pads on graphics cards. Typically, several types of thermal pads at different heights are used ex works, so that when replacing the pads or when converting the cooler on a GPU water cooler, several different pads are required accordingly.The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
THERMAL GRIZZLY TG-CA-32-32-02 - Carbonaut 32x 32x, 0.2 mm
23.28 EUR
The high-tech carbon thermal pads of the Thermal Grizzly Carbonaut series are an excellent alternative to thermal compounds in the mid-range performance segment. They have a highly elastic and adaptable surface. Even the smallest component differences can thus be very well compensated for. Carbonaut has high thermal conductivity and extreme long-term stability.- High thermal conductivity
- Consistently high performance
- Does not dry out
- Flexible and easy to use
The Thermal Grizzly Carbonaut Pad is a thermal pad made of carbon fibre. Its specially developed polymer gives the thermal pad its flexibility and its ''soft gap filler'' properties. The carbon fibre structure ensures outstanding thermal conductivity. In addition, the Thermal Grizzly Carbonaut has high thermal conductivity, which it can develop even at very low contact pressure. The Thermal Grizzly Carbonaut pad maintains consistent heat transfer performance.
THERMAL GRIZZLY TG-KS-25-25 - KryoSheet, 25 x 25 mm
28.45 EUR
The graphene thermal pads of the Thermal Grizzly KryoSheet series are an excellent alternative to thermal compounds from the high-performance segment. Similar to Carbonaut pads, they have an adaptable surface with very high thermal conductivity. As a high-end product, KryoSheet offers significantly higher thermal conductivity compared to Carbonaut pads. This increased thermal conductivity is not only due to the choice of materials, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to the usual ageing process that occurs with traditional thermal compound. It cannot dry out.- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
THERMAL GRIZZLY TG-KS-33-33 - KryoSheet, 33x33 mm
34.65 EUR
The graphene thermal pads of the Thermal Grizzly KryoSheet series are an excellent alternative to thermal compounds from the high-performance segment. Similar to Carbonaut pads, they have an adaptable surface with very high thermal conductivity. As a high-end product, KryoSheet offers significantly higher thermal conductivity compared to Carbonaut pads. This increased thermal conductivity is not only due to the choice of materials, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to the usual ageing process that occurs with traditional thermal compound. It cannot dry out.- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
THERMAL GRIZZLY TG-MP8-120-15-1 - Minus Pad 8 – 120 x 20 x 1.5 mm
16.1 EUR
For applications where thermal paste is not an option due to unmanageable application or where distances between heat source and cooling element need to be bridged, the Thermal Grizzly minus pad 8 is the ideal choice – for example on memory chips and voltage transformers. It is based on a silicon-containing supporting complex and aluminium oxide as a heat transfer medium – as well as thermal pastes and thus it is also similar in terms of performance.The minus pad 8 is available in three different dimensions – here 120 x 20 mm – as well as in four thicknesses between 0.5 and 2 millimetres, with the pads available already functioning excellently at a very low contact pressure and the thermal conductivity only marginally influenced by the thickness. The choice of the thickness should therefore only depend on the gap to be bridged.
Technical details:
- Dimensions 120 × 20 × 1.5 mm
- Number: 1
- Thermal conductivity: 8 W/(m·K)
- Application temperature: -100 to +200°C
NO NT-H2-3 - Noctua thermal compound NT_H2, tube 3.5 g
22.04 EUR
NT-H2 is the further improved second generation of Noctua's award-winning hybrid thermal compound. It combines the outstanding ease of use and the proven long-term stability of the popular NT-H1 with a new, re-optimised microparticle formulation for even better thermal performance. For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.
NO NT-H2-10 - Noctua thermal compound NT_H2, tube 10 g
34.14 EUR
NT-H2 is the further improved second generation of Noctua's award-winning hybrid thermal compound. It combines the outstanding ease of use and the proven long-term stability of the popular NT-H1 with a new, re-optimised microparticle formulation for even better thermal performance. For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.
THERMAL GRIZZLY TG-CF-I1851-V1 - Intel 1851 CPU Contact Frame V1
35.69 EUR
The Intel 1851 CPU Contact Frame V1 is the version of the popular Intel motherboard mounting aid adapted to Intel's LGA1851 socket. Using the Intel 1851 CPU Contact Frame V1 prevents the concave curvature of the CPU's integrated heat spreader (IHS) caused by the standard Integrated Loading Mechanism (ILM). This affords CPU coolers better contact with the IHS, which improves cooling performance.- Reduction of CPU temperatures
- Easy to install
- Anodised aluminium
LVD10Z001TG8 - KIOXIA EXCERIA PLUS G4 NVMe-SSD, 1 TB, M.2 PCIe 5.0
192.75 EUR
Mit der brandneuen SSD-Serie KIOXIA EXCERIA PLUS G4 mit modernster PCIe® 5.0-Schnittstelle profitierst du von einem verbesserten PC-Erlebnis. Die EXCERIA PLUS G4-Serie bietet eine verbesserte Leistung und ein Speicherkapazität von bis zu 2 TB für Gamer und Videoeditoren und zeichnet sich durch einen geringen Stromverbrauch und eine reduzierte Wärmeentwicklung aus.Geschwindigkeiten, die nur mit PCIe® 5.0 möglich sind
Die SSD-Serie EXCERIA PLUS G4 ist mit der neuesten und besten Schnittstelle PCIe® ausgestattet und bietet hervorragende Übertragungsgeschwindigkeiten von bis zu 10.000 MB/s für sequentielle Lesevorgänge und 8.200 MB/s für sequentielle Schreibvorgänge. Unabhängig davon, ob du das neueste Spiel lädst oder das nächste virale Video bearbeitest, bietet diese neue Produktreihe die Geschwindigkeit, die du benötigst.
Effiziente Leistung hat Vorrang
Die SSD-Serie EXCERIA PLUS G4 bietet eine deutlich verbesserte Leistung ohne übermäßigen Energie- oder Kühlungsbedarf. EXCERIA PLUS G4 SSDs wurden mit Blick auf Effizienz entwickelt und bieten einen geringen Stromverbrauch, wodurch die in Ihrem System erzeugte Wärme reduziert wird. Diese SSDs bieten eine um bis zu 80 % höhere Energieeffizienz bei maximaler sequenzieller Lesegeschwindigkeit im Vergleich zur vorherigen Generation der EXCERIA PLUS G3-Serie.
Erweiterte Wärmeableitung
EXCERIA PLUS G4 SSDs verfügen über innovative Produktetiketten, die die Wärmeableitung verbessern und so für eine höhere Leistungsstabilität sorgen.
Hochmoderner 3-D-Flashspeicher
Jede EXCERIA-SSD verwendet BiCS FLASH™ und eine vertikal gestapelte Zellenkonstruktion, was eine hochmoderne Speichererfahrung erst möglich macht.
SSD-Verwaltungsdienstprogramm
Das SSD-Verwaltungsdienstprogramm wurde entwickelt, um das meiste aus Ihrem KIOXIA-Laufwerk herauszuholen und Ihnen Kontrolle über Wartung, Überwachung und mehr zu verleihen!
Wir empfehlen Ihnen dringend, die neueste Version zu installieren und zu aktualisieren, um die Leistung Ihres Laufwerks zu maximieren und die verbleibende prozentuale Lebensdauer mithilfe der Zustandsanzeige zu überprüfen.
NO 201345 - NOCTUA thermal compound NT-H1, SW (spatula & wipes), 3.5 g
20.18 EUR
Noctua's NT-H1 is a renowned hybrid thermal compound that has received more than 150 recommendations and awards from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiasts worldwide. Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results.
The SW (spatula & wipes) edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.
THERMAL GRIZZLY TG-CF-I13G - Intel 13th/14th Gen CPU contact frame
30.52 EUR
With the Intel 13th/14th Gen CPU Contact Frame from der8auer, we have updated the well-known mounting aid for Intel motherboards with LGA1700 sockets. Compared to its predecessor, installation of the frame has been significantly simplified by the use of a revised inner contour. For example, it is no longer necessary to apply a specific torque during assembly.The Contact Frame was developed in collaboration with Roman ''der8auer'' Hartung and is manufactured in Berlin - 100% Made in Germany. Roman Hartung is a mechatronics engineer, hardware enthusiast and content creator in the PC hardware sector. He is also a well-known overclocker who has developed numerous products for overclocking PC hardware.
- Reduction of CPU temperatures
- Easy to install
- High level of compatibility
- Anodised aluminium
THERMAL GRIZZLY TG-WLPD-002 - Duronaut thermal compound, 2g, retail
20.18 EUR
Duronaut is a high-end thermal compound that was developed with a focus on excellent thermal conductivity and particularly high long-term stability. The name ''Duronaut'' is derived from the term ''durability''. This exceptionally high long-term stability is achieved through a specially developed silicone oil and the combination of aluminium micro-powder and zinc oxide nano powder in various forms. The optimised particle shape and size minimise the so-called pump-out effect and ensure excellent adhesion of the paste to the surface. This results in extremely low heat transfer resistance.- Extreme long-term stability
- Outstanding thermal conductivity
- Electrically non-conductive
- No hardening over time
THERMAL GRIZZLY TG-CF-I1700-LT - Intel 1700 CPU Contact Frame LT
18.12 EUR
The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the 'Lite' version of the Intel 13th/14th Gen CPU Contact Frame and is manufactured using injection moulding. The material used is an acrylonitrile butadiene styrene copolymer, which has a 15% glass fibre content for additional stability.- Lower CPU temperatures
- Simple assembly
- Glass fibre-reinforced ABS plastic
The standard Integrated Loading Mechanism (ILM) has contact points located in the centre of the elongated CPU. The resulting uneven contact pressure of the processor in the socket causes the surface of the integrated heatspreader (IHS) to bulge concavely. As a result, the base plate of the CPU cooler rests mainly on the edges of the IHS, so the thermal hotspot in the centre of the CPU is not optimally covered.
THERMAL GRIZZLY TG-MYDDPRGBIV1 - Intel Mycro Direct-Die Pro RGB V1
144.22 EUR
The Intel Mycro Direct-Die Pro RGB V1 is equipped with a jet system on the cooler surface and the cooling channel slot width has been optimised. The cooler's cold plate is made of nickel-plated copper and is mounted directly on the chip of the CPU. To do this, the integrated loading mechanism (ILM) of the motherboard is removed and the processor must be delidded. Nickel plating the cooler plate creates a barrier layer, so gallium-based liquid metal cannot diffuse into the copper and repeated application of liquid metal is usually not necessary.- Water cooler for direct-die mounting
- Micro-fin cooler made of nickel-plated copper
- Replaces ILM and heat spreader
- Cover made of acrylic glass and aluminium
THERMAL GRIZZLY TG-MP-P-1-1-15 - Minus Pad Pro, 100x100x1.5 mm
53.88 EUR
The Thermal Grizzly Minus Pad Pro thermal pads are part of the Basic, Advance and Pro series. The Pro Pads offer extremely high thermal conductivity and outstanding compressibility - at a slightly higher price. The series is based on the proven minus pad 8 and has been specifically developed to significantly improve thermal conductivity, compressibility and value for money. The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Excellent thermal conductivity
- Outstanding compressibility
- Easy to use
- Electrically non-conductive
THERMAL GRIZZLY TG-BP-R7000-R - AM5 M4 backplate
29.49 EUR
The AM5 M4 backplate is an optional mounting plate that replaces the original AM5 backplate. Some CPU coolers use a mounting kit that comes with M4 threaded screws. These are not compatible with the UNC 6-32 thread used on the AM5 backplate. Corresponding CPU coolers, especially AiO water coolers, can be used with the AM5 M4 backplate.- Compatible with AM5 motherboards
- Increased compatibility with CPU coolers
- Simple assembly
- Anodised aluminium with insulation layer
THERMAL GRIZZLY TG-P-P-030-R - Putty Pro thermal compound, 30g
51.19 EUR
TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for differences in height and is therefore ideal as a replacement for thermal pads on graphics cards. Typically, several types of thermal pads at different heights are used ex works, so that when replacing the pads or when converting the cooler on a GPU water cooler, several different pads are required accordingly.The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
THERMAL GRIZZLY TG-WLPD-006 - Duronaut thermal compound 6g
28.45 EUR
Duronaut is a high-end thermal compound that was developed with a focus on excellent thermal conductivity and particularly high long-term stability. The name ''Duronaut'' is derived from the term ''durability''. This exceptionally high long-term stability is achieved through a specially developed silicone oil and the combination of aluminium micro-powder and zinc oxide nano powder in various forms. The optimised particle shape and size minimise the so-called pump-out effect and ensure excellent adhesion of the paste to the surface. This results in extremely low heat transfer resistance.- Extreme long-term stability
- Outstanding thermal conductivity
- Not electrically conductive
- No curing
LVC10Z001TG8 - KIOXIA EXCERIA G3, 1 TB, M.2 PCIe 5.0
188.25 EUR
Geschwindigkeit der Nächsten GenerationMachen Sie den ersten Schritt in die Welt der PCIe®-5.0-Performance. Die KIOXIA EXCERIA G3 SSD Series, ein Einsteigermodell mit PCIe®-5.0-Unterstützung, hebt die Leistung auf ein neues Niveau – mit bis zu 10 000 MB/s sequenzieller Lesegeschwindigkeit*¹. Sie beschleunigt nicht nur alltägliche PC-Aufgaben, sondern unterstützt auch KI-Anwendungen und sorgt für ein angenehm leistungsstarkes Gaming-Erlebnis. Dank BiCS FLASH™ 3D-Flashspeicher bietet diese weiterentwickelte SSD-Serie nun bis zu 2 TB Kapazität im M.2-2280-Formfaktor – ideal für Desktop-PCs wie auch Notebooks.
Details:
- BiCS FLASH™
- NVMe™ 2.0c-Technologie
- M.2 2280-Formfaltor
- PCIe® Gen5 x4
- SSD-Verwaltungsdienstprogramm
Der Einstieg in die PCIe®-5.0-Leistung
Mit der neuesten und leistungsstärksten PCIe®-5.0-Schnittstelle bietet die EXCERIA G3 SSD Series hervorragende Übertragungsgeschwindigkeiten von bis zu 10 000 MB/s beim sequentiellen Lesen und 9 600 MB/s beim sequentiellen Schreiben. Ob Sie das neueste Spiel laden oder ein Video bearbeiten – diese neue Serie ist die ideale Wahl für alle, die PCIe®-5.0-Performance erleben möchten.
Erweiterte Wärmeableitung
EXCERIA G3 SSDs verfügen über innovative Produktetiketten, die die Wärmeableitung verbessern und so zu einer stabilen Leistung unter anspruchsvollen Bedingungen beitragen.
NVMe™-Technologie
Mit der NVMe™-2.0c-Technologie reduzieren EXCERIA G3 SSDs die Latenz im I/O-Pfad zwischen Ihrer SSD und Ihrer CPU, was zu einer flüssigen und reaktionsschnellen Leistung führt.
Hochmoderner 3D-Flash-Speicher
Jede EXCERIA SSD wird mit BiCS FLASH™ und einer vertikal gestapelten Zellstruktur gefertigt und bietet so ein hochmodernes Speichererlebnis.
SSD-Verwaltungsdienstprogramm
Das SSD-Verwaltungsdienstprogramm wurde entwickelt, um Ihr KIOXIA-Laufwerk optimal zu unterstützen und Ihnen umfassende Kontrolle über Wartung, Überwachung und vieles mehr zu geben.
Wir empfehlen dringend, die neueste Version zu installieren und regelmäßig zu aktualisieren, um die Leistung Ihres Laufwerks zu maximieren und den verbleibenden Lebensprozentsatz über die Zustandsanzeige zu überprüfen.
THERMAL GRIZZLY TG-MY-DD-P-RGB-A - AMD Mycro Direct-Die Pro RGB V1
144.22 EUR
The AMD Mycro Direct-Die Pro RGB V1 features a hybrid structure with two different sizes of micro fins and a jet plate for optimised flow. The cooler's cold plate is made of nickel-plated copper and is mounted directly on the chip of the CPU. To do this, the Socket Actuation Mechanism (SAM) of the motherboard is removed and the processor must be delidded. Nickel plating the cooler plate creates a barrier layer, so gallium-based liquid metal cannot diffuse into the copper and repeated application of liquid metal is usually not necessary.- Water cooler for direct-die mounting
- Micro-fin cooler made of nickel-plated copper
- Replaces SAM and heat spreader
- Cover made of acrylic glass and aluminium
THERMAL GRIZZLY TG-P-A-100-R - Putty Advance thermal compound, 100g
71.86 EUR
TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for differences in height and is therefore ideal as a replacement for thermal pads on graphics cards. Typically, several types of thermal pads at different heights are used ex works, so that when replacing the pads or when converting the cooler on a GPU water cooler, several different pads are required accordingly.The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
THERMAL GRIZZLY TG-HPHS-I-V1 - Intel High Performance Heatspreader V1
61.53 EUR
The Intel High Performance Heatspreader V1 is an upgrade heat spreader for Intel processors. The nickel-plated copper heat spreader has a 207 percent larger, diamond-milled precision surface. This enlarged surface area compared to the original heat spreader enables maximum heat dissipation with air and water coolers, while precision milling ensures extremely low surface roughness for best contact with the heat sink.- Replaces ILM and heat spreader
- 207% larger surface area
- Made from nickel-plated copper
- Diamond-milled precision surface
- Compatible with air and water coolers
LSD10Z001TG8 - KIOXIA EXCERIA PLUS G3 SSD, 1 TB, M.2 PCIe 4.0
181.43 EUR
Holen Sie mehr aus Ihrem PC herausDie Serie EXCERIA PLUS G3 SSD von KIOXIA verfügt über eine leistungsstarke PCIe®4.0-Schnittstelle und bietet eine verbesserte Leistung für Gamer und Videobearbeiter. Mit einer Kapazität von 1 TB bis zu 2 TB eignet sich die einseitig bestückte M.2 2280-Serie hervorragend für Mainstream-Desktops und -Notebooks, die den neuesten PCIe®4.0 Standard unterstützen.
Merkmale
- BiCS FLASH™
- NVMe™ 1.4-Technologie
- M.2-2280-Formfaktor
- PCIe® Gen4 x4
Willkommen in der Welt von PCIe ® 4.0
Die EXCERIA PLUS G3 SSD-Serie wurde entwickelt, um ein verbessertes PC-Erlebnis zu bieten. Sie ist mit PCIe® 4.0 kompatibel und liefert außergewöhnliche Übertragungsgeschwindigkeiten von bis zu 5.000 MB/s bei sequentiellen Lesezugriffen und 3.900 MB/s bei sequentiellen Schreibzugriffen. Diese neue Serie bietet die nötige Leistung, sowohl für Gaming als auch für die Videobearbeitung.
Platzsparender Speicher
Mit ihrem platzsparenden, einseitig verwendbaren M.2 2280-Formfaktor ist die EXCERIA PLUS G3 SSD-Serie mit einer größeren Anzahl von Geräten kompatibel. Diese kompakten SSDs werden direkt in die Hauptplatine eingesteckt, wodurch Kabelsalat vermieden und ein schlankes und einfaches System-Upgrade ermöglicht wird.
Mit PCIe® 4.0 auf der Überholspur 4.0
Die EXCERIA PLUS G3 SSD-Serie bietet mehr Leistung ohne Abstriche. Durch die Unterstützung von PCIe® 4.0 und NVMe™ 1.4 setzen diese SSDs neue Maßstäbe im Mainstream-Bereich und bieten ein verbessertes Computererlebnis für Gamer und Videobearbeiter.
Hochmoderner 3-D-Flashspeicher
Jede EXCERIA-SSD verwendet BiCS FLASH™ und eine vertikal gestapelte Zellenkonstruktion, was eine hochmoderne Speichererfahrung erst möglich macht.
SSD-Verwaltungsdienstprogramm
Das SSD-Verwaltungsdienstprogramm wurde entwickelt, um das meiste aus Ihrem KIOXIA-Laufwerk herauszuholen und Ihnen Kontrolle über Wartung, Überwachung und mehr zu verleihen!
Wir empfehlen Ihnen dringend, die neueste Version zu installieren und zu aktualisieren, um die Leistung Ihres Laufwerks zu maximieren und die verbleibende prozentuale Lebensdauer mithilfe der Zustandsanzeige zu überprüfen.
THERMAL GRIZZLY TG-P-P-100-R - Putty Pro thermal compound, 100g
113.21 EUR
TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for differences in height and is therefore ideal as a replacement for thermal pads on graphics cards. Typically, several types of thermal pads at different heights are used ex works, so that when replacing the pads or when converting the cooler on a GPU water cooler, several different pads are required accordingly.The TG putties are applied with the supplied spatulas, which also allow application over larger surfaces. The TG putty can compensate for height differences of 0.2 to 3.0 mm.
THERMAL GRIZZLY TG-MP-B-1-1-15-2 - Minus Pad Basic, 100x100x1.5 mm, pack of 2
25.35 EUR
The Thermal Grizzly Minus Pad Basic thermal pads are part of the Basic, Advance and Pro series. The basic pads are easy to use and offer good thermal conductivity, slightly lower compressibility and excellent value. The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
STARTECH.COM ST HEATGREASE20 - 20g Tube CPU Thermal Paste Compound
17.81 EUR
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound-Ceramic-based compound containing silicone
-Thermal conductivity of more than 1.066 W/m-K
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
NO 201512 - NOCTUA thermal compound NT-H2, AM5, 3.5 g
23.38 EUR
NT-H2 is the further improved second generation of Noctua's award-winning hybrid thermal compound. It combines the iconic NT-H1's proven features, superb ease-of-use and renowned long-term stability with a novel, fine-tuned formula of micro particles for even better thermal performance. Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results, and thanks to the included cleaning wipes, it is just as easy to remove as to apply - an enthusiast-grade paste for the highest demands.
The AM5 Edition also includes the NA-TPG1 thermal paste guard that prevents thermal paste buildup in the cut-outs of the heatspreader of AMD AM5 CPUs - a simple yet highly effective means to keep your AM5 processor clean.
FISCHER ELEKTRONIK WLP 500 - Thermal compound, with silicone, 500-g can
113.29 EUR
Thermal compound with silicone- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
THERMAL GRIZZLY TG-AS-3-50 - Triple spatula
13.98 EUR
The Thermal Grizzly Spatula in the basic version for thermal compound is an indispensable tool for ensuring accurate and even distribution of thermal compound. The plastic spatulas are soft and have a low hardness compared to metallic tools. This reduces the risk of scratches or damage to the surface of the CPU or other components to which the thermal compound is applied. Plastic spatulas also have the advantage that they do not react with the metallic components of thermal compounds. Recommended for the following Thermal Grizzly pastes: Aeronaut, Hydronaut, Kryonaut and Kryonaut Extreme.
FISCHER ELEKTRONIK WLP 300 S - Thermal compound, with silicone, 300-g cartridge
99.36 EUR
Thermal compound with silicone- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties