THERMAL GRIZZLY TG-CW-10 - Cleaning Wipes, pack of 10
19.15 EUR
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Clean and degreased surfaces are important to ensure that thermal conductive materials such as thermal compounds or liquid metal adhere well and thus develop their full thermal conductivity. This is where TG cleaning wipes come in: cleaning wipes for cleaning surfaces. TG cleaning wipes contain ten double packs, each with two dry wipes and two wet wipes optimised for removing thermal compound residues.
First, stubborn dirt is removed with a dry wipe before the surface is cleaned with the two wet wipes. In the third cleaning step, the surface is dried and wiped with a fresh dry wipe.
Assembly aids such as the TG Kapton Insulation Sheet or TG Shield protective lacquer also adhere better to cleaned surfaces. TG cleaning wipes are offered as a practical complete set of 40 cleaning wipes, packaged in ten double packs of two dry wipes and two wet wipes each.
EAN: 4260711991042
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Clean and degreased surfaces are important to ensure that thermal conductive materials such as thermal compounds or liquid metal adhere well and thus develop their full thermal conductivity. This is where TG cleaning wipes come in: cleaning wipes for cleaning surfaces. TG cleaning wipes contain ten double packs, each with two dry wipes and two wet wipes optimised for removing thermal compound residues.
- Wet wipes for removing thermal compound
- Removes grease residues (e.g. fingerprints)
- Packaged in ten double packs for easy storage
- A total of 20 dry wipes and 20 wet wipes
First, stubborn dirt is removed with a dry wipe before the surface is cleaned with the two wet wipes. In the third cleaning step, the surface is dried and wiped with a fresh dry wipe.
Assembly aids such as the TG Kapton Insulation Sheet or TG Shield protective lacquer also adhere better to cleaned surfaces. TG cleaning wipes are offered as a practical complete set of 40 cleaning wipes, packaged in ten double packs of two dry wipes and two wet wipes each.
EAN: 4260711991042
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Very good thermal conductivity
- High compressibility
- Easy to use
- Electrically non-conductive
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Very good thermal conductivity
- High compressibility
- Easy to use
- Electrically non-conductive
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
The series is based on the proven minus pad 8 and has been specifically developed to significantly improve thermal conductivity, compressibility and value for money. The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Excellent thermal conductivity
- Outstanding compressibility
- Easy to use
- Electrically non-conductive
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Very good thermal conductivity
- High compressibility
- Easy to use
- Electrically non-conductive
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Very good thermal conductivity
- High compressibility
- Easy to use
- Electrically non-conductive
The easy-to-process and flexible minus pads consist of different components: They are based on a ceramic-silicone formula complex and nano-aluminium oxide. The pads therefore always ensure optimum heat transfer. Even the slightest contact pressure is sufficient for optimal attachment. All pads are environmentally friendly and RoHS-compliant.
- High thermal conductivity
- High compressibility
- Electrically insulating
The series is based on the proven minus pad 8 and has been specifically developed to significantly improve thermal conductivity, compressibility and value for money. The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Excellent thermal conductivity
- Outstanding compressibility
- Easy to use
- Electrically non-conductive
The series is based on the proven minus pad 8 and has been specifically developed to significantly improve thermal conductivity, compressibility and value for money. The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Excellent thermal conductivity
- Outstanding compressibility
- Easy to use
- Electrically non-conductive
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
The series is based on the proven minus pad 8 and has been specifically developed to significantly improve thermal conductivity, compressibility and value for money. The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Excellent thermal conductivity
- Outstanding compressibility
- Easy to use
- Electrically non-conductive
The minus pad 8 is available in three different dimensions – here 120 x 20 mm – as well as in four thicknesses between 0.5 and 2 millimetres, with the pads available already functioning excellently at a very low contact pressure and the thermal conductivity only marginally influenced by the thickness. The choice of the thickness should therefore only depend on the gap to be bridged.
Technical details:
- Dimensions 120 × 20 × 0.5 mm
- Number: 2
- Thermal conductivity: 8 W/(m·K)
- Application temperature: -100 to +200°C
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Very good thermal conductivity
- High compressibility
- Easy to use
- Electrically non-conductive
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Good thermal conductivity
- Lower compressibility
- Easy to use
- Electrically non-conductive
- Outstanding price-performance ratio
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Very good thermal conductivity
- High compressibility
- Easy to use
- Electrically non-conductive
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Very good thermal conductivity
- High compressibility
- Easy to use
- Electrically non-conductive
The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Very good thermal conductivity
- High compressibility
- Easy to use
- Electrically non-conductive
The series is based on the proven minus pad 8 and has been specifically developed to significantly improve thermal conductivity, compressibility and value for money. The thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers and electronic components such as voltage converters and RAM chips.
- Excellent thermal conductivity
- Outstanding compressibility
- Easy to use
- Electrically non-conductive
Kapton Insulation Sheet is supplied in packs of 10 sheets, each containing 5 Kapton adhesive strips. Each individual adhesive strip is 10 mm wide and 60 mm long, with a thickness of 40 µm. It is recommended that the contact surface to which the insulation sheet is adhered be thoroughly cleaned (e.g. isopropanol).
Brief information:
- 50 adhesive strips 10x60 mm
- Thickness of 40 µm
- Electrically insulating
- Max. temp: 280°C
- Breakdown voltage: over 1 kV
- Clean the adhesive surface beforehand!
Kryonaut is also recommended as a top product for critical cooling systems in the industrial sector.
- Specially designed for overclocking
- Excellent thermal conductivity
- No curing
- High long-term stability
- Not electrically conductive
- Ultra-high thermal conductivity
- Increased indium content
- Optimum application thanks to plastic needle
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The fill quantity of one gram of liquid metal is sufficient for far more than 10 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for overclockers or anyone wanting as quiet a system as possible with optimal cooling performance.
- Extreme long-term stability
- Outstanding thermal conductivity
- Not electrically conductive
- No curing
- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
''DIRECT DIE FRAME V2'' PRODUCT INFORMATION
The Ryzen Direct Die Frame V2 (DDFV2) is a CPU mounting frame designed specifically for AMD's 7000-series X3D processors, but retains compatibility with non-X3D CPUs. Note that the DDFV2 is not compatible with Ryzen 8000G processors.
It is compatible with both standard Ryzen-7000 processors and X3D CPUs, allowing them to be mounted with this direct-die frame without the integrated heat spreader and without the Socket Actuation Mechanism (SAM).
At the same time, the WireView GPU performs a cable management function, as its ''U'' shape allows optimised cable routing. The PCIe power cables are connected to the WireView GPU in such a way that they can be routed neatly over the backplate of the graphics card. This prevents cable bulges when laying the power cables and simplifies cable management.
- Power consumption measurement
- Power consumption recording
- Optimised cable routing
- Simple assembly
- High level of compatibility
- Extreme long-term stability
- Outstanding thermal conductivity
- Electrically non-conductive
- No hardening over time
- Compatible with Ryzen 7000/8000G/9000 CPUs
- Delidding tool
- Made from aluminium
Why delidding and direct die method with Ryzen 7000?
Delidding involves removing the heat spreader from the processor. With unsoldered processors, delidding is typically used to replace the thermal interface material (TIM) between the CPU die and the heat spreader with high-quality thermal compound or liquid metal before the heat spreader is reinstalled.
- Outstanding thermal conductivity
- Easy application
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow the instructions!
- Ultra-high thermal conductivity
- Increased indium content
- Plastic needle for optimum application
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The five-gram quantity of liquid metal is sufficient for well over 50 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for anyone overclocking or wanting a system as quiet as possible with optimal cooling performance!
Note: The Conductonaut thermal compound must not be used with aluminium coolers!
- High thermal conductivity
- Consistently high performance
- Does not dry out
- Flexible and easy to use
The Thermal Grizzly Carbonaut Pad is a thermal pad made of carbon fibre. Its specially developed polymer gives the thermal pad its flexibility and its ''soft gap filler'' properties. The carbon fibre structure ensures outstanding thermal conductivity. In addition, the Thermal Grizzly Carbonaut has high thermal conductivity, which it can develop even at very low contact pressure. The Thermal Grizzly Carbonaut pad maintains consistent heat transfer performance.
- Optimised thermal conductivity compared to conventional liquid metal
- Increased material compatibility
- Optimal application with metal needle
- Available in 1-g or 5-g syringes
- Attention: Electrically conductive!
- Do not allow to come into contact with aluminium!
At the same time, the WireView GPU performs a cable management function, as its ''U'' shape allows optimised cable routing. The PCIe power cables are connected to the WireView GPU in such a way that they can be routed neatly over the backplate of the graphics card. This prevents cable bulges when laying the power cables and simplifies cable management.
- Power consumption measurement
- Power consumption recording
- Optimised cable routing
- Simple assembly
- High level of compatibility
- Optimised thermal conductivity compared to conventional liquid metal
- Increased material compatibility
- Optimal application with metal needle
- Available in 1-g or 5-g syringes
- Attention: Electrically conductive!
- Do not allow to come into contact with aluminium!
The minus pad extreme silicone-based thermal pad has a kneading-like consistency, allowing it to adapt perfectly to the surface and compensate for even larger differences in height. Thermal Grizzly minus pad extreme is not electrically conductive.
Due to the strong plastic deformation, only one-time installation is recommended. The thermal conductivity has been increased by about 260% compared to minus pad 8, making it perfect for power-intensive applications such as voltage converters and RAM. Even the slightest contact pressure is sufficient for optimal attachment. All pads are environmentally friendly and RoHS-compliant.
- Optimised for overclocking
- Outstanding thermal conductivity
- No curing
The easy-to-process and flexible minus pads consist of different components: They are based on a ceramic-silicone formula complex and nano-aluminium oxide. The pads therefore always ensure optimum heat transfer. Even the slightest contact pressure is sufficient for optimal attachment. All pads are environmentally friendly and RoHS-compliant.
- High thermal conductivity
- High compressibility
- Electrically insulating
- Water cooler for direct-die mounting
- Micro-fin cooler made of nickel-plated copper
- Replaces ILM and heat spreader
- Cover made of acrylic glass and aluminium
