ROTH-ELEKTRONIK RE 936-06 - Multi-adapter SSOP28 and TSSOP28 0.65 mm pitch
12.53 EUR
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"Adapter for SSOP28 and TSSOP28
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
"Adapter for SSOP28 and TSSOP28
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for SSOP28 and TSSOP28
- Pitch: 0.65 mm
- Single-row hole spacing: 2.54 mm
- Holes: Ø 1.10 mm with single-hole conductors Ø 2.20 mm
- Two experimental fields with square single-hold conductors (3 x 6) 2.20 x 2.20 mm
- Size: 36.83 x 29.21 mm
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
• Double-sided 35 µm Cu (plated through)
• Solder and component sides with a surface made of chem. gold and a solder resist mask
• Pitch: 0.65 (208 mil)
• Pins: 28
• Hole diameter 1.00 mm
• Size: 13.0 x 23.5 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for SOP28, SOIC28, SOIC28w, HSOP28 and SO28
- Pitch: 1.27 mm
- Single-row hole spacing: 2.54 mm
- Two experimental fields with square single-hold conductors (2 x 4) 2.20 x 2.20 mm
- Size: 36.83 x 26.67 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for SSOP14
- Pitch: 0.65 mm
- Hole diameter 1.00 mm
- Size: 13.02 x 23.50 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for TQFP32 up to 64
- Pitch: 0.8 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 46.99 x 46.99 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for RS232
- Hole spacing: 2.54 mm
- Single-hole conductors Ø 2.20 mm, square pin 1
- Size: 34.29 x 15.40 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for SOT223 with 2.30-mm pitch
- Hole spacing: 2.54 mm
- Single-hole conductor: Ø 2.20 mm
- Shield pad
- Size: 10.80 x 15.55 mm
• Hot air levelled (HAL — lead free)
• 38 x 61 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for TSSOP24 and SSOP24
- Pitch: 0.65 mm
- Single-row hole spacing: 2.54 mm
- Two experimental fields with square single-hold conductors (2 x 3) 2.20 x 2.20 mm
- Size: 31.75 x 19.05 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for TQFP32 up to 100
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 69.85 x 69.85 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for DFN10 and eMSOP10 with 0.50-mm pitch
- Hole spacing: 2.54 mm
- Single-hole conductor: Ø 2.20 mm
- Shield pad
- Size: 12.50 x 12.50 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for TQFP44 and QFP44
- Pitch: 0.8 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 36.20 x 34.29 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFN16
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- Suitable for sockets with a pitch of 7.62 mm
- Size: 13.97 x 21.59 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFN16
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 20.32 x 21.59 mm
- Epoxy fibre-glass FR4 1.50 mm
- Single-sided 35 µm Cu
- Hot dip tin-plated
- Solder resist
- Adapter for 28-pin socket with a pitch of 7.62 mm
- Spacing: 2.54 mm
- 14 three-hole pads and 2 x 14 two-hole pads on each side
- Experimental field with 2.54-mm spacing with 12 x 16 hole pads (Ø 2.20 mm)
- Size: 46.99 x 73.02 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP32 and QFN32
- Pitch: 0.8 mm
- Single-row hole spacing: 2.54 mm
- Suitable for sockets with a pitch of 15.24 mm
- Size: 19.05 x 42.55 mm
- Epoxy fibre-glass FR4 1.50 mm
- Single-sided 35 µm Cu
- Hot dip tin-plated
- Solder resist
- Adapter for 14-pin socket with a pitch of 7.62 mm
- Spacing: 2.54 mm
- Seven three-hole pads and 2 x 7 two-hole pads on each side
- Experimental field with 2.54-mm spacing with 12 x 16 hole pads (Ø 2.20 mm)
- Size: 46.99 x 55.24 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for SDIP64 with 1.778-mm pitch
- Single-hole conductor: Ø 2.20 mm
- Shield pad
- Size: 65.40 x 30.17 mm
• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 37 x 56 soldering pads, Ø 2.1 mm
• Hole pattern 2.50 x 2.50 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for SOT23-10 with 0.50 mm pitch
- Hole spacing: 2.54 mm
- Single-hole conductor: Ø 2.00 mm
- Suitable for sockets with a pitch of 7.62 mm
- Shield pad
- Size: 12.50 x 12.50 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for SOT89 with 1.50-mm pitch
- Hole spacing: 2.54 mm
- Single-hole conductor: Ø 2.20 mm
- Shield pad
- Size: 8.25 x 13.02 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP44 and QFN44
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 34.30 x 34.30 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP56 and QFN56
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 41.91 x 41.91 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFN20
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 20.32 x 21.59 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for LGA16
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- Suitable for sockets with a pitch of 7.62 mm
- Size: 13.97 x 21.59 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP40 and QFN40
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- Suitable for sockets with a pitch of 15.24 mm
- Size: 19.05 x 52.70 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for LGA16
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 20.32 x 21.59 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP32 and QFN32
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 26.67 x 28.57 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFN20
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- Suitable for sockets with a pitch of 15.24 mm
- Size: 19.05 x 27.94 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP40 and QFN40
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 31.75 x 33.66 mm
- Single-sided 35 µm Cu
- Surface: HAL lead-free
- Solder resist
- 37 x 38 single-hole conductors, 2.30 x 2.30 mm
- Spacing: 2.54 mm
- Hole diameter 1.00 mm
- Size: 99.40 x 100.30 mm
- FR4 epoxy resin-based fibre-glass reinforced laminate plates, 1.50 mm, double-sided 35 µm Cu (plated through)
- Solder and component side with a surface of chem. gold and solder resist mask
- Hole diameter 1.00 mm
- Adapter board for 10 different TSSOP
- Pitch 0.65 mm/0.50 mm
- Pre-scored breaking points to separate individual modules
- Size: 58.90 x 120.10 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP32 and QFN32
- Pitch: 0.65 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 26.67 x 28.57 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP32 and QFN32
- Pitch: 0.65 mm
- Single-row hole spacing: 2.54 mm
- Suitable for sockets with a pitch of 15.24 mm
- Size: 19.05 x 42.55 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for TSOP56
- Pitch: 0.635 mm
- Double-row hole spacing: 2.54 mm
- Size: 39.37 x 41.91 mm
Adapter board for 7 different SSOP housings, 14/16/20/24/28 pin, 0.65 mm pitch, 22.5 mil on DIL 208 mil, 48/56 pin, 0.635 mm pitch, 25.7 mil on DIL 300 mil. Surface chem. gold, component sides with solder resist mask, pre-scored breaking points to separate individual modules
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for HSSOP8
- Single-row hole spacing: 2.54 mm
- Hole diameter: 1.10 mm with single-hole conductors Ø 2.10 mm
- Size: 15.88 x 13.97 mm
• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 37 x 58 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
• Connector: 31-pin, DIN 41617
• Single-sided 35 µm Cu
• Organic surface protection (OSP)
• 37 x 58 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
• Connector: 31-pin, DIN 41617
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for HSSOP16
- Single-row hole spacing: 2.54 mm
- Hole diameter: 1.10 mm with single-hole conductors Ø 2.10 mm
- Size: 15.88 x 22.57 mm
