RADEMACHER UP 915EP - Lab card, epoxy, 160x100mm, CU 35µ
15.11 EUR
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Lab card 160x100mm
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Lab card 160x100mm
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
Card for very high-quality and highly integrated modules. Double-sided conductor path routing possible.
Dimensions: 100 x 160 mm
Grid: 2.54 mm
Rows of holes: 37
Holes: 1.0 mm
Cu coating: 2 x 35 µ tin-plated and plated-through
Material thickness: 1.5 mm
• Photo PCBs with new environmentally friendly photo-positive coating (no chlorocarbons)
• Completely uniform application of the photo coating
• Colour photoresist
• Very fine resolution
• With opaque protective film
• Film firmly adheres right up to the edges
• High-quality base material
• Precise dimensional accuracy
• Uniformly high quality from batch to batch
Exposure times:
30-W UV tubes: 60 - 90 s
1000-W halogen bulbs: 45 - 70 s
250-W photo lamps: 12 - 15 min.
500-W photo lamps: 6 - 7 min.
At a distance of approx. 30 cm and max. format of 150x200.
Development times: at 25 - 30°C: in 25 - 90 s, depending on the freshness of the bath.
Etching times: in a freshly made ammonium persulfate bath at a temperature of 40 - 50°C: 5 - 10 minutes. For more information on exposure and etching times, please refer to our main catalogue
Plug: for 32-pin DIN 41612 pitch: 5.08 mm
Testing board for power electronics, systems/operating equipment scale printed on one side/PIN assignment
36 perforated and 4 non-perforated conductor paths, plug and mounting holes: 32-pin, DIN 41612, pitch: 5.08mm testing board for communication electr.
For communication electronics, information technology
Testing board for industrial electronics devices/production equipment
33-pin direct connector, 12 pcs. 16-pin IC
• Photo PCBs with new environmentally friendly photo-positive coating (no chlorocarbons)
• Completely uniform application of the photo coating
• Colour photoresist
• Very fine resolution
• With opaque protective film
• Film firmly adheres right up to the edges
• High-quality base material
• Precise dimensional accuracy
• Uniformly high quality from batch to batch
Exposure times:
30-W UV tubes: 60 - 90 s
1000-W halogen bulbs: 45 - 70 s
250-W photo lamps: 12 - 15 min.
500-W photo lamps: 6 - 7 min.
At a distance of approx. 30 cm and max. format of 150x200.
Development times: at 25 - 30°C: in 25 - 90 s, depending on the freshness of the bath.
Etching times: in a freshly made ammonium persulfate bath at a temperature of 40 - 50°C: 5 - 10 minutes. For more information on exposure and etching times, please refer to our main catalogue
Soldering points in chains of three
12 pcs 16-pin IC
Connector: for 2x31pin DIN41617 and 2x32/64/96pin DIN41612
Mounting holes for 19'' housing
Connector: both for 64-pin as well as 96-pin, DIN 41612, type B and C
Potential leads, very low cross-talk.
• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 37 x 56 soldering pads, Ø 2.1 mm
• Hole pattern 2.50 x 2.50 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
36 strip conductors with 56 drill holes. Positional print on the component side.
Plug: for 32-pin DIN 41612 pitch: 5.08 mm
Testing board for power electronics, systems/operating equipment
For communication electronics, information technology
36 perforated and 4 non-perforated conductor paths, plug and mounting holes: 32-pin, DIN 41612, type B power strip pitch: 5.08mm testing board for communication electr.
Pitch: 2.54 mm
2 potential paths
2 potential paths
Exposure times:
30W UV tubes 60-90s
1000W halogenl. 45-70s
250W Nitraphot 12-15min
500W Nitraphot 6- 7min
with approx. 30cm distance and max. format 150x200.
Development times: at 25-30°C in 25-90s depending on the freshness of the bath.
Etching times: At freshly prepared ammonium persulfate bath of 40-50°C: 5-10min.
• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 37 x 58 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
• Connector: 31-pin, DIN 41617
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for TQFP32 up to 64
- Pitch: 0.8 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 46.99 x 46.99 mm
• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• Soldering islands 37 x 55, 2.0 mm²
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
• Connector: 32-pin, DIN 41612, pattern 5.08 mm, design D
• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 37 x 55 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Connector: 64-pin, DIN 41612, pattern 2.54 mm, design C
• Size: 100 x 160 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for TQFP32 up to 100
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 69.85 x 69.85 mm
• Double-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 38 x 61 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
• Double-sided 35 µm Cu (plated through)
• Hot air levelled (HAL — lead free)
• Soldering islands 36 x 55, 2.0 mm²
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Connectors: 32/64/96-pin, DIN 41612, pattern 2.54 mm, design C
• Size: 100 x 160 mm
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP/TQFP/LQFP80 up to 100
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 69.85 x 69.85 mm
For 14- to 40-IN ICs
• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 38 wiring tracks each with 61 drill holes
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 37 x 56 soldering pads, Ø 2.1 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm
• Connectors: 32/64/96-pin, DIN 41612, design C
