RADEMACHER UP 1160EP2 - Dot matrix board, epoxy, 2-sided 160x100mm

19.24 EUR
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Plated-through and glossy tin-plated epoxy dot matrix board with two-sided Cu coating.
Card for very high-quality and highly integrated modules. Double-sided conductor path routing possible.
Dimensions: 100 x 160 mm
Grid: 2.54 mm
Rows of holes: 37
Holes: 1.0 mm
Cu coating: 2 x 35 µ tin-plated and plated-through
Material thickness: 1.5 mm
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Plated-through and glossy tin-plated epoxy dot matrix board with two-sided Cu coating.
Card for very high-quality and highly integrated modules. Double-sided conductor path routing possible.
Dimensions: 100 x 160 mm
Grid: 2.54 mm
Rows of holes: 37
Holes: 1.0 mm
Cu coating: 2 x 35 µ tin-plated and plated-through
Material thickness: 1.5 mm
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products

Soldering pad diameter: 2.2 mm

Premium quality original Bungard base material.
Tested and approved in accordance with MIL, UL, VDE, IEC, NEMA and other regulatory safety standards agencies. The boards are protected with blue protective film that features a black adhesive side.

Premium quality original Bungard base material.
Tested and approved in accordance with MIL, UL, VDE, IEC, NEMA and other regulatory safety standards agencies. The boards are protected with blue protective film that features a black adhesive side.

Premium quality original Bungard base material.
Tested and approved in accordance with MIL, UL, VDE, IEC, NEMA and other regulatory safety standards agencies. The boards are protected with blue protective film that features a black adhesive side.

Exposure times:
30W UV tubes 60 - 90s
1000 W halogen 45 - 70s
250W Nitraphot 12 - 15 mi
500W Nitraphot 6 - 7 mi
At a distance of approx. 30 cm and max. format 150x200, at 25 - 30°C in 25 - 90s depending on how fresh the bath is.
With a fresh ammonium persulphate batch of 40 - 50°C: 5 - 10 minutes. Please see our catalogue for more information on exposure and etching times

• Photo PCBs with new environmentally friendly photo-positive coating (no chlorocarbons)
• Completely uniform application of the photo coating
• Colour photoresist
• Very fine resolution
• With opaque protective film
• Film firmly adheres right up to the edges
• High-quality base material
• Precise dimensional accuracy
• Uniformly high quality from batch to batch
Exposure times:
30-W UV tubes: 60 - 90 s
1000-W halogen bulbs: 45 - 70 s
250-W photo lamps: 12 - 15 min.
500-W photo lamps: 6 - 7 min.
At a distance of approx. 30 cm and max. format of 150x200.
Development times: at 25 - 30°C: in 25 - 90 s, depending on the freshness of the bath.
Etching times: in a freshly made ammonium persulfate bath at a temperature of 40 - 50°C: 5 - 10 minutes. For more information on exposure and etching times, please refer to our main catalogue

• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 37 x 56 soldering pads, Ø 2.1 mm
• Hole pattern 2.50 x 2.50 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm

• Photo PCBs with new environmentally friendly photo-positive coating (no chlorocarbons)
• Completely uniform application of the photo coating
• Colour photoresist
• Very fine resolution
• With opaque protective film
• Film firmly adheres right up to the edges
• High-quality base material
• Precise dimensional accuracy
• Uniformly high quality from batch to batch
Exposure times:
30-W UV tubes: 60 - 90 s
1000-W halogen bulbs: 45 - 70 s
250-W photo lamps: 12 - 15 min.
500-W photo lamps: 6 - 7 min.
At a distance of approx. 30 cm and max. format of 150x200.
Development times: at 25 - 30°C: in 25 - 90 s, depending on the freshness of the bath.
Etching times: in a freshly made ammonium persulfate bath at a temperature of 40 - 50°C: 5 - 10 minutes. For more information on exposure and etching times, please refer to our main catalogue

• Photo PCBs with new environmentally friendly photo-positive coating (no chlorocarbons)
• Completely uniform application of the photo coating
• Colour photoresist
• Very fine resolution
• With opaque protective film
• Film firmly adheres right up to the edges
• High-quality base material
• Precise dimensional accuracy
• Uniformly high quality from batch to batch
Exposure times:
30-W UV tubes: 60 - 90 s
1000-W halogen bulbs: 45 - 70 s
250-W photo lamps: 12 - 15 min.
500-W photo lamps: 6 - 7 min.
At a distance of approx. 30 cm and max. format of 150x200.
Development times: at 25 - 30°C: in 25 - 90 s, depending on the freshness of the bath.
Etching times: in a freshly made ammonium persulfate bath at a temperature of 40 - 50°C: 5 - 10 minutes. For more information on exposure and etching times, please refer to our main catalogue

• Photo PCBs with new environmentally friendly photo-positive coating (no chlorocarbons)
• Completely uniform application of the photo coating
• Colour photoresist
• Very fine resolution
• With opaque protective film
• Film firmly adheres right up to the edges
• High-quality base material
• Precise dimensional accuracy
• Uniformly high quality from batch to batch
Exposure times:
30-W UV tubes: 60 - 90 s
1000-W halogen bulbs: 45 - 70 s
250-W photo lamps: 12 - 15 min.
500-W photo lamps: 6 - 7 min.
At a distance of approx. 30 cm and max. format of 150x200.
Development times: at 25 - 30°C: in 25 - 90 s, depending on the freshness of the bath.
Etching times: in a freshly made ammonium persulfate bath at a temperature of 40 - 50°C: 5 - 10 minutes. For more information on exposure and etching times, please refer to our main catalogue

• Photo PCBs with new environmentally friendly photo-positive coating (no chlorocarbons)
• Completely uniform application of the photo coating
• Colour photoresist
• Very fine resolution
• With opaque protective film
• Film firmly adheres right up to the edges
• High-quality base material
• Precise dimensional accuracy
• Uniformly high quality from batch to batch
Exposure times:
30-W UV tubes: 60 - 90 s
1000-W halogen bulbs: 45 - 70 s
250-W photo lamps: 12 - 15 min.
500-W photo lamps: 6 - 7 min.
At a distance of approx. 30 cm and max. format of 150x200.
Development times: at 25 - 30°C: in 25 - 90 s, depending on the freshness of the bath.
Etching times: in a freshly made ammonium persulfate bath at a temperature of 40 - 50°C: 5 - 10 minutes. For more information on exposure and etching times, please refer to our main catalogue

• Photo PCBs with new environmentally friendly photo-positive coating (no chlorocarbons)
• Completely uniform application of the photo coating
• Colour photoresist
• Very fine resolution
• With opaque protective film
• Film firmly adheres right up to the edges
• High-quality base material
• Precise dimensional accuracy
• Uniformly high quality from batch to batch
Exposure times:
30-W UV tubes: 60 - 90 s
1000-W halogen bulbs: 45 - 70 s
250-W photo lamps: 12 - 15 min.
500-W photo lamps: 6 - 7 min.
At a distance of approx. 30 cm and max. format of 150x200.
Development times: at 25 - 30°C: in 25 - 90 s, depending on the freshness of the bath.
Etching times: in a freshly made ammonium persulfate bath at a temperature of 40 - 50°C: 5 - 10 minutes. For more information on exposure and etching times, please refer to our main catalogue

Interface: RS-232
Different baud rates, scrolling, cursor positions, up to 64 interfaces/displays can be addressed at a RS-232, contrast potentiometer, temperature compensation.
Adjustable display and format.
Includes VEE to -3 V
Also for 5 V CMOS level at RS-232 input
Includes connection cable.

- Single-sided 35 µm Cu
- Hot dip tin-plated (HAL lead-free)
- 33 x 55 single-hole conductors 2.20 mm
- Spacing: 2.54 mm
- Hole diameter 1.00 mm
- Connector, 64-pin, DIN 41612, 2.54-mm hole spacing, design C
- Size: 100 x 160 mm

• Single-sided 35 µm Cu
• HAL — lead free
• 3-hole pads
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm

• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 39 wiring tracks each with 61 drill holes
• Hole pattern 2.50 x 2.50 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm

• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 37 x 55 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Connector: 64-pin, DIN 41612, pattern 2.54 mm, design C
• Size: 100 x 160 mm

• Single-sided 35 µm Cu
• Organic surface protection (OSP)
• 33 x 55 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Connector: 64-pin, DIN 41612, pattern 2.54 mm, design C
• Size: 100 x 160 mm

• Double-sided 35 µm Cu (plated through)
• Hot air levelled (HAL — lead free)
• Soldering islands 36 x 55, 2.0 mm²
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Connectors: 32/64/96-pin, DIN 41612, pattern 2.54 mm, design C
• Size: 100 x 160 mm

• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 38 wiring tracks each with 61 drill holes
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm

- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for TQFP32 up to 100
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 69.85 x 69.85 mm

• Single-sided 35 µm Cu
• HAL — lead free
• 38 wiring tracks each with 61 drill holes
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm

• Hot air levelled (HAL — lead free)
• 38 x 61 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm

• Double-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 38 x 61 soldering pads, Ø 2.2 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Size: 100 x 160 mm

- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for QFP/TQFP/LQFP80 up to 100
- Pitch: 0.5 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 69.85 x 69.85 mm

Soldering points in chains of three

- Single-sided 35 µm Cu
- Organic surface protection (OSP)
- 38 conductive tracks 61 holes
- Spacing: 2.54 mm
- Hole diameter 1.00 mm
- Size: 100 x 160 mm

• Photo PCBs with new environmentally friendly photo-positive coating (no chlorocarbons)
• Completely uniform application of the photo coating
• Colour photoresist
• Very fine resolution
• With opaque protective film
• Film firmly adheres right up to the edges
• High-quality base material
• Precise dimensional accuracy
• Uniformly high quality from batch to batch
Exposure times:
30-W UV tubes: 60 - 90 s
1000-W halogen bulbs: 45 - 70 s
250-W photo lamps: 12 - 15 min.
500-W photo lamps: 6 - 7 min.
At a distance of approx. 30 cm and max. format of 150x200.
Development times: at 25 - 30°C: in 25 - 90 s, depending on the freshness of the bath.
Etching times: in a freshly made ammonium persulfate bath at a temperature of 40 - 50°C: 5 - 10 minutes. For more information on exposure and etching times, please refer to our main catalogue

- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chemical: Ni/Au
- Solder resist
- Adapter circuit board for TQFP32 up to 64
- Pitch: 0.8 mm
- Single-row hole spacing: 2.54 mm
- External connection options on the reverse with 0603 SMD pads for each pin
- Resistors or similar components can be mounted directly
- Size: 46.99 x 46.99 mm

The LCS-PS101-2 is a small, handy print server for printers with a USB connection.
The print server makes it easy to connect inkjet, ink, laser or
dot matrix printers to networks with up to 10 or 100 Mbit/s.
The LCS PS is easy to configure and manage via a web interface.
It is the ideal device for flexible use of printers in home environments, as well as smaller to medium sized offices.
Characteristics:
• Windows-based setup program, Web Management, Telnet, HP JetAdmin
• Supports DHCP (client)
• Supports Internet Printing Protocol (IPP)
• Supports SNMP
• Supports firmware upgrade (TFTP)
• Built-in Flash RAM
• Built-in SDRAM
• LED for quick diagnostics
Specifications:
• Standards: IEEE 802.3 and 802.3u
• Chipset: RDC R2886
• Protocols: TCP/IP, IPX, Net BEUI, Apple Talk, LPR, SMB over TCP/IP
Supported operating systems:
Windows 9x/Me/NT/2000/XP/Vista, Mac OS 6.0 and higher, UNIX/Linux, NetWare 3.12 and higher (Bindery/NDS)
Connections:
• 1 x RJ-45 with 10/100 Mbit/s
• 1 x USB 2.0 standard
• Flash RAM: 1 MB
• SDRAM: 2 MB
• Power supply unit: external power supply unit 3.3 V/2 A
• Dimensions: 73.16 x 64.75 x 28.39 mm, 56 g
• Scope of delivery: user manual, CD with software and multilingual guide

• Single-sided 35 µm Cu
• Organic surface protection (OSP)
• 36 x 61 soldering pads, Ø 2.1 mm
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Connector: 32-pin, DIN 41612, pattern 5.08 mm, design D
• Size: 100 x 160 mm

• Single-sided 35 µm Cu
• Hot air levelled (HAL — lead free)
• 37 wiring tracks each with 57 drill holes
• Hole pattern 2.54 x 2.54 mm
• Hole diameter 1.0 mm
• Component side with assembly print
• Connector: 32-pin, DIN 41612, pattern 5.08 mm, design D
• Size: 100 x 160 mm

36 perforated and 4 non-perforated conductor paths, plug and mounting holes: 32-pin, DIN 41612, type B power strip pitch: 5.08mm testing board for communication electr.
Pitch: 2.54 mm

Plug: for 32-pin DIN 41612 pitch: 5.08 mm
Testing board for power electronics, systems/operating equipment