FISCHER ELEKTRONIK ICK SMD A 22 SA - Heat sink 22mm 34 K/W black anodised

Prodotto
10.54 EUR Browse the detailed sheet with complete information, compare prices and find the features of PRODUCTNAME, proposed at the cost of PRICE CURRENCY; it classifies in the CATEGORY NAME; the sale is managed by SELLER NAME and the production is done by MANUFACTURER NAME.

Specially suited for SMD-components
Low type of construction
Effective heat conduction
Can be directly pasted onto the component

Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new

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  • Colour: blue
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These thermal conductive foils feature
• Good thermal properties
• Two-sided adhesive layer

Total thickness [mm]: 0.127 (± 0.03)
Carrier material, thickness: Polyimide 0.025 mm
Adhesive layer: Acrylate (pressure-sensitive) on both sides
Specific heat resistance: 2.7 mK/W
Thermal conductivity [W/m·K]: 0.37
Holding force (overlapping) [MPa]: 0.86
Holding force (shear force): Al 25°C 0.897 [MPa] / Al 150°C 0.345 [MPa] / Cu 25°C 0.828 [MPa] / Cu 150°C 0.31 [MPa] / Al2O3 25°C 1.17 [MPa] / Al2O3 150°C 0.34 [MPa]
Temperature range: -30 °C - +125°C
Dielectric strength: 5 kV (AC)
Flammability class: UL 94 V-0

The thermal conductive foils are available in 3 different sizes

Included with delivery:
• 1 plate 100x100 mm
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Electrically insulating, adhesive on both sides
  • Dimensions: 31 x 34 mm
  • Colour: blue
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FISCHER ELEKTRONIK WLFT404 35X35 - Heat conducting foil, adhesive on both sides, 35x35 mm FISCHER ELEKTRONIK WLFT404 35X35 - Heat conducting foil, adhesive on both sides, 35x35 mm 13.15 EUR Heat conducting foil, adhesive on both sides
Electrically insulating, adhesive on both sides
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FISCHER ELEKTRONIK WLFT404 24X27 - Heat conducting foil, adhesive on both sides, 24x27 mm FISCHER ELEKTRONIK WLFT404 24X27 - Heat conducting foil, adhesive on both sides, 24x27 mm 11.71 EUR Heat conducting foil, adhesive on both sides
Electrically insulating, adhesive on both sides
  • Dimensions: 24 x 27 mm
  • Colour: blue
  • Delivery format: cut to size
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FISCHER ELEKTRONIK WLFT404 23X23 - Heat conducting foil, adhesive on both sides, 23x23 mm FISCHER ELEKTRONIK WLFT404 23X23 - Heat conducting foil, adhesive on both sides, 23x23 mm 11.09 EUR Heat conducting foil, adhesive on both sides
Electrically insulating, adhesive on both sides
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FISCHER ELEKTRONIK WLFT404 43X43 - Heat conducting foil, adhesive on both sides, 43x43 mm FISCHER ELEKTRONIK WLFT404 43X43 - Heat conducting foil, adhesive on both sides, 43x43 mm 13.77 EUR Heat conducting foil, adhesive on both sides
Electrically insulating, adhesive on both sides
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Double-sided adhesive thermal conductive foil to replace mechanical connections.

These thermal conductive foils feature
• Good thermal properties
• Two-sided adhesive layer

Total thickness [mm]: 0.127 (± 0.03)
Carrier material, thickness: Polyimide 0.025 mm
Adhesive layer: Acrylate (pressure-sensitive) on both sides
Specific heat resistance: 2.7 mK/W
Thermal conductivity [W/m·K]: 0.37
Holding force (overlapping) [MPa]: 0.86
Holding force (shear force): Al 25°C 0.897 [MPa] / Al 150°C 0.345 [MPa] / Cu 25°C 0.828 [MPa] / Cu 150°C 0.31 [MPa] / Al2O3 25°C 1.17 [MPa] / Al2O3 150°C 0.34 [MPa]
Temperature range: -30 °C - +125°C
Dielectric strength: 5 kV (AC)
Flammability class: UL 94 V-0

The thermal conductive foils are available in 3 different sizes

Included with delivery:
• 1 plate 200x200 mm
FISCHER ELEKTRONIK WL FOLIE GEL 10 - Silicone thermal conductive foil, 1.0 mm, 300x200 mm FISCHER ELEKTRONIK WL FOLIE GEL 10 - Silicone thermal conductive foil, 1.0 mm, 300x200 mm 47.99 EUR Enables you to create your individual pre-cut parts for your electrical circuiting.
High thermal conductive silicone foils are characterised by the following properties:

• Soft, elastic and compressible
• Very good compensation for unevenness (gap filter)

Material: Gel film
Material thickness [mm]: 1.0
Tolerance: 0.2
Thermal conductivity [W/m·K]: 1.5
Contact resistance: 1*106
Rth [°C in2/W]: 1.02
Hardness: < 49 Shore 00
Stretchability [%]: 100
Dielectric constant: 5.8 [50 Hz] / 5.6 [1 KHz] / 5.5 [1 MHz]
Dielectric strength: 14 kV/mm (AC)
Dielectric loss factor: 0.048 [50 Hz] / 0.015 [1 KHz] / 0.003 [1 MHz]
Flammability class: UL 94 V-0

Included with delivery:
• 1 plate 300x200 mm / covered on both sides with protective film
FISCHER ELEKTRONIK WL FOLIE GEL 05 - Silicone thermal conductive foil, 0.5 mm, 300x200 mm FISCHER ELEKTRONIK WL FOLIE GEL 05 - Silicone thermal conductive foil, 0.5 mm, 300x200 mm 37.75 EUR Enables you to create your individual pre-cut parts for your electrical circuiting.
High thermal conductive silicone foils are characterised by the following properties:

• Soft, elastic and compressible
• Very good compensation for unevenness (gap filter)

Material: Gel film
Material thickness [mm]: 0.5
Tolerance: 0.1
Thermal conductivity [W/m·K]: 1.5
Contact resistance: 1*106
Rth [°C in2/W]: 0.57
Hardness: < 49 Shore 00
Stretchability [%]: 100
Dielectric constant: 5.8 [50 Hz] / 5.6 [1 KHz] / 5.5 [1 MHz]
Dielectric strength: 14 kV/mm (AC)
Dielectric loss factor: 0.048 [50 Hz] / 0.015 [1 KHz] / 0.003 [1 MHz]
Flammability class: UL 94 V-0

Included with delivery:
• 1 plate 300x200 mm / covered on both sides with protective film
FISCHER ELEKTRONIK ICK 14 H - Heat sink, 12 x 16 x 18 mm, for DIL-IC FISCHER ELEKTRONIK ICK 14 H - Heat sink, 12 x 16 x 18 mm, for DIL-IC 10.97 EUR Heat sink for DIL-IC, for gluing on

Enclosure: DIL-IC
For housing: 14-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 18 mm
Thermal resistance, Rth: 20 K/W
Finish: black anodised
FISCHER ELEKTRONIK ICK 14 16 B - Heat sink, 19 x 4.8 x 6.3 mm, for DIL-IC FISCHER ELEKTRONIK ICK 14 16 B - Heat sink, 19 x 4.8 x 6.3 mm, for DIL-IC 10.52 EUR Heat sink for DIL-IC, for gluing on

Enclosure: DIL-IC
For housing: 14/16-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 6.3 mm
Thermal resistance, Rth: 54 K/W
Finish: black anodised
FISCHER ELEKTRONIK ICK 14 16 L - Heat sink, 6.3 x 4.8 x 19 mm, for DIL-IC FISCHER ELEKTRONIK ICK 14 16 L - Heat sink, 6.3 x 4.8 x 19 mm, for DIL-IC 10.49 EUR Heat sink for DIL-IC, for gluing on

Enclosure: DIL-IC
For housing: 14/16-pin
Width: 6.3 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 19 mm
Thermal resistance, Rth: 46 K/W
Finish: black anodised
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34.9 x 12.7 x 50.8 mm, clip mounting
  • With solder pins
  • For TO220, SOT32, TOP3
  • Profile width: 35 mm
  • Finish: black anodised


Semiconductor mounted using transistor retaining clip THF104 (must be ordered separately)
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Enclosure: DIL-IC
For housing: 18-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 23 mm
Thermal resistance, Rth: 16 K/W
Finish: black anodised
FISCHER ELEKTRONIK ICK 28 B - Heat sink, 19 x 4.8 x 37 mm, for DIL-IC FISCHER ELEKTRONIK ICK 28 B - Heat sink, 19 x 4.8 x 37 mm, for DIL-IC 10.86 EUR Heat sink for DIL-IC, for gluing on

Enclosure: DIL-IC
For housing: 28-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 37 mm
Thermal resistance, Rth: 18.5 K/W
Finish: black anodised
FISCHER ELEKTRONIK ICK 24 B - Heat sink, 19 x 4.8 x 33 mm, for DIL-IC FISCHER ELEKTRONIK ICK 24 B - Heat sink, 19 x 4.8 x 33 mm, for DIL-IC 10.77 EUR Heat sink for DIL-IC, for gluing on

Enclosure: DIL-IC
For housing: 24-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 33 mm
Thermal resistance, Rth: 19.4 K/W
Finish: black anodised
FISCHER ELEKTRONIK V ICK BGA35X35 - Heat sink for BGA, 35 x 35 x 6 mm FISCHER ELEKTRONIK V ICK BGA35X35 - Heat sink for BGA, 35 x 35 x 6 mm 11.45 EUR Heat sink, particularly suitable for BGA, Ball Grid Arrays

square design
With heat conducting foil, not included in scope of delivery, can be glued directly onto the BGA component
surface black anodized
FISCHER ELEKTRONIK ICK SMD B13 - Heat sink SMD 19.0 x 4.8 x 13.0 mm, base1 mm FISCHER ELEKTRONIK ICK SMD B13 - Heat sink SMD 19.0 x 4.8 x 13.0 mm, base1 mm 10.74 EUR Heat sink for SMD

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Height: 4.8 mm
Base thickness: 1.0 mm
Length: 13.0 mm
Rth [K/W]: 29
Finish: back anodised / solderable
FISCHER ELEKTRONIK V FK 244-08 DP - Copper heat sink for D PAK, 23x8x10mm FISCHER ELEKTRONIK V FK 244-08 DP - Copper heat sink for D PAK, 23x8x10mm 11.14 EUR Copper heat sink for D PAK

With excellent heat conductivity
Ideal for D PAK SMD components
FISCHER ELEKTRONIK V SK 75-37 STS - Extruded heat sink with solder pins, 32x14x37.5mm FISCHER ELEKTRONIK V SK 75-37 STS - Extruded heat sink with solder pins, 32x14x37.5mm 11.71 EUR Extruded heat sink for TO 220
PCB mounting with solder pins
Semi-conductor screw mounting
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• especially suitable for ball grid arrays
• heatsink dimensions suitable for the respective BGA type
• dimensions (LxWxH): 10 x 10 x 10 mm
FISCHER ELEKTRONIK V FK 244-08 D2P - Copper heat sink for D² PAK, 26x8x10mm FISCHER ELEKTRONIK V FK 244-08 D2P - Copper heat sink for D² PAK, 26x8x10mm 10.97 EUR Copper heat sink for D² PAK

With excellent heat conductivity
Ideal for D² PAK SMD components