FISCHER ELEKTRONIK ICK SMD A 22 SA - Heat sink 22mm 34 K/W black anodised

10.54 EUR
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Specially suited for SMD-components
Low type of construction
Effective heat conduction
Can be directly pasted onto the component
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Specially suited for SMD-components
Low type of construction
Effective heat conduction
Can be directly pasted onto the component
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products


With excellent heat conductivity
Ideal for LF PAK SMD components

With excellent heat conductivity
Ideal for LF PAK SMD components

Width: 6.3 mm
Height: 4.8 mm
Base thickness: 1.0 mm
Length: 17.0 mm
Rth [K/W]: 51
Finish: back anodised / solderable


With excellent heat conductivity
Ideal for LF PAK SMD components

Aluminium, black anodised

Heat sink manufactured in black anodized aluminium



Electrically insulating, adhesive on both sides
- Dimensions: 14 x 14 mm
- Colour: blue
- Delivery format: cut to size
- Storage conditions: +15°C - +30°C, normal storage conditions

Double-sided adhesive thermal conductive foil to replace mechanical connections.
These thermal conductive foils feature
• Good thermal properties
• Two-sided adhesive layer
Total thickness [mm]: 0.127 (± 0.03)
Carrier material, thickness: Polyimide 0.025 mm
Adhesive layer: Acrylate (pressure-sensitive) on both sides
Specific heat resistance: 2.7 mK/W
Thermal conductivity [W/m·K]: 0.37
Holding force (overlapping) [MPa]: 0.86
Holding force (shear force): Al 25°C 0.897 [MPa] / Al 150°C 0.345 [MPa] / Cu 25°C 0.828 [MPa] / Cu 150°C 0.31 [MPa] / Al2O3 25°C 1.17 [MPa] / Al2O3 150°C 0.34 [MPa]
Temperature range: -30 °C - +125°C
Dielectric strength: 5 kV (AC)
Flammability class: UL 94 V-0
The thermal conductive foils are available in 3 different sizes
Included with delivery:
• 1 plate 100x100 mm

Electrically insulating, adhesive on both sides
- Dimensions: 31 x 34 mm
- Colour: blue
- Delivery format: cut to size
- Storage conditions: +15°C - +30°C, normal storage conditions

Electrically insulating, adhesive on both sides
- Dimensions: 35 x 35 mm
- Colour: blue
- Delivery format: cut to size
- Storage conditions: +15°C - +30°C, normal storage conditions

Electrically insulating, adhesive on both sides
- Dimensions: 24 x 27 mm
- Colour: blue
- Delivery format: cut to size
- Storage conditions: +15°C - +30°C, normal storage conditions

Electrically insulating, adhesive on both sides
- Dimensions: 23 x 23 mm
- Colour: blue
- Delivery format: cut to size
- Storage conditions: +15°C - +30°C, normal storage conditions

Electrically insulating, adhesive on both sides
- Dimensions: 43 x 43 mm
- Colour: blue
- Delivery format: cut to size
- Storage conditions: +15°C - +30°C, normal storage conditions

Double-sided adhesive thermal conductive foil to replace mechanical connections.
These thermal conductive foils feature
• Good thermal properties
• Two-sided adhesive layer
Total thickness [mm]: 0.127 (± 0.03)
Carrier material, thickness: Polyimide 0.025 mm
Adhesive layer: Acrylate (pressure-sensitive) on both sides
Specific heat resistance: 2.7 mK/W
Thermal conductivity [W/m·K]: 0.37
Holding force (overlapping) [MPa]: 0.86
Holding force (shear force): Al 25°C 0.897 [MPa] / Al 150°C 0.345 [MPa] / Cu 25°C 0.828 [MPa] / Cu 150°C 0.31 [MPa] / Al2O3 25°C 1.17 [MPa] / Al2O3 150°C 0.34 [MPa]
Temperature range: -30 °C - +125°C
Dielectric strength: 5 kV (AC)
Flammability class: UL 94 V-0
The thermal conductive foils are available in 3 different sizes
Included with delivery:
• 1 plate 200x200 mm

High thermal conductive silicone foils are characterised by the following properties:
• Soft, elastic and compressible
• Very good compensation for unevenness (gap filter)
Material: Gel film
Material thickness [mm]: 1.0
Tolerance: 0.2
Thermal conductivity [W/m·K]: 1.5
Contact resistance: 1*106
Rth [°C in2/W]: 1.02
Hardness: < 49 Shore 00
Stretchability [%]: 100
Dielectric constant: 5.8 [50 Hz] / 5.6 [1 KHz] / 5.5 [1 MHz]
Dielectric strength: 14 kV/mm (AC)
Dielectric loss factor: 0.048 [50 Hz] / 0.015 [1 KHz] / 0.003 [1 MHz]
Flammability class: UL 94 V-0
Included with delivery:
• 1 plate 300x200 mm / covered on both sides with protective film

High thermal conductive silicone foils are characterised by the following properties:
• Soft, elastic and compressible
• Very good compensation for unevenness (gap filter)
Material: Gel film
Material thickness [mm]: 0.5
Tolerance: 0.1
Thermal conductivity [W/m·K]: 1.5
Contact resistance: 1*106
Rth [°C in2/W]: 0.57
Hardness: < 49 Shore 00
Stretchability [%]: 100
Dielectric constant: 5.8 [50 Hz] / 5.6 [1 KHz] / 5.5 [1 MHz]
Dielectric strength: 14 kV/mm (AC)
Dielectric loss factor: 0.048 [50 Hz] / 0.015 [1 KHz] / 0.003 [1 MHz]
Flammability class: UL 94 V-0
Included with delivery:
• 1 plate 300x200 mm / covered on both sides with protective film

Enclosure: DIL-IC
For housing: 14-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 18 mm
Thermal resistance, Rth: 20 K/W
Finish: black anodised

Enclosure: DIL-IC
For housing: 14/16-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 6.3 mm
Thermal resistance, Rth: 54 K/W
Finish: black anodised

23 x 23 x 12.3 mm, for IC type PGA and others

Enclosure: DIL-IC
For housing: 14/16-pin
Width: 6.3 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 19 mm
Thermal resistance, Rth: 46 K/W
Finish: black anodised

34.9 x 12.7 x 50.8 mm, clip mounting
- With solder pins
- For TO220, SOT32, TOP3
- Profile width: 35 mm
- Finish: black anodised
Semiconductor mounted using transistor retaining clip THF104 (must be ordered separately)

35 x 35 x 14 mm, for IC type PGA and others


Separable

Enclosure: DIL-IC
For housing: 18-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 23 mm
Thermal resistance, Rth: 16 K/W
Finish: black anodised

Enclosure: DIL-IC
For housing: 28-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 37 mm
Thermal resistance, Rth: 18.5 K/W
Finish: black anodised

Enclosure: DIL-IC
For housing: 24-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 33 mm
Thermal resistance, Rth: 19.4 K/W
Finish: black anodised

square design
With heat conducting foil, not included in scope of delivery, can be glued directly onto the BGA component
surface black anodized

Width: 19.0 mm
Height: 4.8 mm
Base thickness: 1.0 mm
Length: 13.0 mm
Rth [K/W]: 29
Finish: back anodised / solderable


With excellent heat conductivity
Ideal for D PAK SMD components

PCB mounting with solder pins
Semi-conductor screw mounting

• especially suitable for ball grid arrays
• heatsink dimensions suitable for the respective BGA type
• dimensions (LxWxH): 10 x 10 x 10 mm


With excellent heat conductivity
Ideal for D² PAK SMD components