FISCHER ELEKTRONIK WLPK 10 - Thermal compound, silicone-free, ceramic filled, 10-ml syringe
53.41 EUR
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Ceramic-filled, silicone-free thermal compound with high thermal conductivity
Features:
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Ceramic-filled, silicone-free thermal compound with high thermal conductivity
- Especially suitable for silicone-sensitive applications
- No drying, curing or melting of the thermal compound required
- High long-term stability
- Other container sizes and container types (e.g. cans, cartridges) available on request
Features:
- Density: 1.4 g/cm3
- Temperature range: -60°C ... +150°C
- Dielectric strength: not applicable as the compound is conductive
- Thermal conductivity: 10 W/m K
- Solubility in water: insoluble
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
- Silicone-free
Double-sided adhesive thermal conductive foil to replace mechanical connections.
These thermal conductive foils feature
• Good thermal properties
• Two-sided adhesive layer
Total thickness [mm]: 0.127 (± 0.03)
Carrier material, thickness: Polyimide 0.025 mm
Adhesive layer: Acrylate (pressure-sensitive) on both sides
Specific heat resistance: 2.7 mK/W
Thermal conductivity [W/m·K]: 0.37
Holding force (overlapping) [MPa]: 0.86
Holding force (shear force): Al 25°C 0.897 [MPa] / Al 150°C 0.345 [MPa] / Cu 25°C 0.828 [MPa] / Cu 150°C 0.31 [MPa] / Al2O3 25°C 1.17 [MPa] / Al2O3 150°C 0.34 [MPa]
Temperature range: -30 °C - +125°C
Dielectric strength: 5 kV (AC)
Flammability class: UL 94 V-0
The thermal conductive foils are available in 3 different sizes
Included with delivery:
• 1 plate 100x100 mm
Double-sided adhesive thermal conductive foil to replace mechanical connections.
These thermal conductive foils feature
• Good thermal properties
• Two-sided adhesive layer
Total thickness [mm]: 0.127 (± 0.03)
Carrier material, thickness: Polyimide 0.025 mm
Adhesive layer: Acrylate (pressure-sensitive) on both sides
Specific heat resistance: 2.7 mK/W
Thermal conductivity [W/m·K]: 0.37
Holding force (overlapping) [MPa]: 0.86
Holding force (shear force): Al 25°C 0.897 [MPa] / Al 150°C 0.345 [MPa] / Cu 25°C 0.828 [MPa] / Cu 150°C 0.31 [MPa] / Al2O3 25°C 1.17 [MPa] / Al2O3 150°C 0.34 [MPa]
Temperature range: -30 °C - +125°C
Dielectric strength: 5 kV (AC)
Flammability class: UL 94 V-0
The thermal conductive foils are available in 3 different sizes
Included with delivery:
• 1 plate 100x200 mm
Double-sided adhesive thermal conductive foil to replace mechanical connections.
These thermal conductive foils feature
• Good thermal properties
• Two-sided adhesive layer
Total thickness [mm]: 0.127 (± 0.03)
Carrier material, thickness: Polyimide 0.025 mm
Adhesive layer: Acrylate (pressure-sensitive) on both sides
Specific heat resistance: 2.7 mK/W
Thermal conductivity [W/m·K]: 0.37
Holding force (overlapping) [MPa]: 0.86
Holding force (shear force): Al 25°C 0.897 [MPa] / Al 150°C 0.345 [MPa] / Cu 25°C 0.828 [MPa] / Cu 150°C 0.31 [MPa] / Al2O3 25°C 1.17 [MPa] / Al2O3 150°C 0.34 [MPa]
Temperature range: -30 °C - +125°C
Dielectric strength: 5 kV (AC)
Flammability class: UL 94 V-0
The thermal conductive foils are available in 3 different sizes
Included with delivery:
• 1 plate 200x200 mm
High thermal conductive silicone foils are characterised by the following properties:
• Soft, elastic and compressible
• Very good compensation for unevenness (gap filter)
Material: Gel film
Material thickness [mm]: 1.0
Tolerance: 0.2
Thermal conductivity [W/m·K]: 1.5
Contact resistance: 1*106
Rth [°C in2/W]: 1.02
Hardness: < 49 Shore 00
Stretchability [%]: 100
Dielectric constant: 5.8 [50 Hz] / 5.6 [1 KHz] / 5.5 [1 MHz]
Dielectric strength: 14 kV/mm (AC)
Dielectric loss factor: 0.048 [50 Hz] / 0.015 [1 KHz] / 0.003 [1 MHz]
Flammability class: UL 94 V-0
Included with delivery:
• 1 plate 300x200 mm / covered on both sides with protective film
