FISCHER ELEKTRONIK FK235MIL1 - Heat sink, 18.5 mm, aluminium, 16 K/W, TO220
11.29 EUR
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Aluminium heat sink with soldering tag for vertical installation
Solderable surface
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Aluminium heat sink with soldering tag for vertical installation
Solderable surface
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products
Enclosure: DIL-IC
For housing: 14-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 18 mm
Thermal resistance, Rth: 20 K/W
Finish: black anodised
Enclosure: DIL-IC
For housing: 18-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 23 mm
Thermal resistance, Rth: 16 K/W
Finish: black anodised
Suitable for free and forced convection
Easy mounting with heat-conducting adhesive film, heat-conducting adhesive or screw mounting
Aluminium, black anodised
Enclosure: DIL-IC
For housing: 16-pin
Width: 12 mm
Height: 16 mm
Base thickness: 1 mm
Length: 20.5 mm
Thermal resistance, Rth: 18 K/W
Finish: black anodised
Enclosure: DIL-IC
For housing: 14/16-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 6.3 mm
Thermal resistance, Rth: 54 K/W
Finish: black anodised
Enclosure: DIL-IC
For housing: 28-pin
Width: 19 mm
Height: 4.8 mm
Base thickness: 1 mm
Length: 37 mm
Thermal resistance, Rth: 18.5 K/W
Finish: black anodised
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
34.9 x 12.7 x 38.1 mm, screw-down assembly
- With solder pins
- For TO220, SOT32, TOP3
- Profile width: 35 mm
- Finish: black anodised
Semiconductor mounted using M3 screws (holes without thread) or using transistor retaining clip THF104 (must be ordered separately)
Width: 19.0 mm
Height: 4.8 mm
Base thickness: 1.0 mm
Length: 5.0 mm
Rth [K/W]: 56
Finish: back anodised / solderable
Square design with cooling pins
Black anodised surface
Direct PCB mounting via solderable surface
Direct PCB mounting via solderable surface
With excellent heat conductivity
Ideal for D PAK SMD components
With excellent heat conductivity
Ideal for LF PAK SMD components
square design
With heat conducting foil, not included in scope of delivery, can be glued directly onto the BGA component
surface black anodized
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
With excellent heat conductivity
Ideal for LF PAK SMD components
square design
surface black anodized
With heat conducting foil, not included in scope of delivery, can be glued directly onto the BGA component
Direct PCB mounting via solderable surface
Direct PCB mounting via solderable surface
Direct PCB mounting via solderable surface
Direct PCB mounting via solderable surface
2.5 mm thick with handle and PCB holder. For standard-compliant positioning when installing in subrack. Fully anodised. Incl. all screws.
Height: 3HE (128.4 mm)
Width: 6TE (30.1 mm)
Width: 6.3 mm
Height: 4.8 mm
Base thickness: 1.0 mm
Length: 17.0 mm
Rth [K/W]: 51
Finish: back anodised / solderable
Width: 12.6 mm
Height: 6.5 mm
Length: 25 mm
For semi-conductor housing: TO 220
Minimal heat resistance: 32.0 K/W
Semi-conductor mounting method: Screws
Heat sink mounting type: Screws
Surface: Black anodised
Material: AlMgSi0.5
square design
With heat conducting foil, not included in scope of delivery, can be glued directly onto the BGA component
surface black anodized
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
3HE = 128.4 mm
6TE = 30.1 mm
100 x 25 x 100 mm
- Surface: black anodized
- Thermal resistance: 2.0 K/W
With excellent heat conductivity
Ideal for LF PAK SMD components
Heatsink dimensions match the respective BGA type
Arrangement and number of pins selected for optimal air flow
Suitable for forced or free convection
Even heat distribution in the base and the pins in the direction of heat flow
Component mounting with adhesive, adhesive film or clip
Natural aluminium
