ARCTIC MX-4 - Arctic MX-4 thermal compound, 4 g

14.03 EUR
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ARCTIC MX-4 is the latest thermal compound with exceptional thermal conductivity and best consistency to get the maximum from your computer.
This thermal compound is the ideal choice for overclockers.
Extraordinary performance
ARCTIC MX-4 consists of carbon micro-particles which guarantee extremely high thermal conductivity. This ensures fast and efficient heat dissipation from the CPU or GPU.
Quick and easy to use
ARCTIC MX-4 is a metal-free and non-electrically conductive paste. This minimises the risk of short circuits and offers perfect protection for your computer. Application is also very easy as the consistency is ideal for use on chips.
Super price/performance ratio
In addition to the performance, the price is also absolutely great. This makes ARCTIC MX-4 the best thermal compound on the market.
• Thermal conductivity (W/mK): 8.5
• Viscosity (poise): 870
• Density (g/cm³): 2.5
EAN: 4895213701655
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
ARCTIC MX-4 is the latest thermal compound with exceptional thermal conductivity and best consistency to get the maximum from your computer.
This thermal compound is the ideal choice for overclockers.
Extraordinary performance
ARCTIC MX-4 consists of carbon micro-particles which guarantee extremely high thermal conductivity. This ensures fast and efficient heat dissipation from the CPU or GPU.
Quick and easy to use
ARCTIC MX-4 is a metal-free and non-electrically conductive paste. This minimises the risk of short circuits and offers perfect protection for your computer. Application is also very easy as the consistency is ideal for use on chips.
Super price/performance ratio
In addition to the performance, the price is also absolutely great. This makes ARCTIC MX-4 the best thermal compound on the market.
• Thermal conductivity (W/mK): 8.5
• Viscosity (poise): 870
• Density (g/cm³): 2.5
EAN: 4895213701655
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products

The performance of the ARCTIC MX-4 thermal compound has been tested and featured in numerous independent magazines.
Better than liquid metal
The ARCTIC MX-4 thermal compound consists of carbon microparticles, which results in extremely high thermal conductivity. This ensures that heat can dissipate from the CPU or GPU quickly and efficiently. The outstanding performance of the MX-4 makes it the ideal product for overclockers and enthusiasts.
Easy to apply
The consistency of the MX-4 means application is easy, even for beginners.
- Thermal conductivity: 8.5 W/m.K
- Viscosity: 870 poise
- Density: 2.50 g/cm³
- Resistance: 3.8 x 1013 O-cm

The surfaces of processor chips and cooler bases are characterised by microscopic irregularities. The ARCTIC MX-4 thermal compound consists of carbon microparticles, which fill these holes, leading to extremely high thermal conductivity. This ensures that heat is dissipated from the CPU or GPU quickly and efficiently. With its outstanding performance, the MX-4 is an excellent choice for overclockers and enthusiasts, as well as for other applications where thermal transfer is required. The MX-4 fully proves that great performance does not necessarily require a high price.
Easy to apply
The consistency of the MX-4 means application is easy, even for beginners. In the video we show the application possibilities to prevent air pockets between processor and cooler.
Secure application
Unlike metal-oxide-based pastes or liquid metal, the ARCTIC MX-4 is metal-free and non-conductive.

The performance of THE ARCTIC MX-4 thermal grease has been tested and awarded by numerous independent magazines.
Better than liquid metal
THE ARCTIC MX-4 thermal grease consists of carbon microparticles, which lead to an extremely high thermal conductivity. This ensures that heat can be dissipated quickly and efficiently from the CPU or GPU. With its outstanding performance, the MX-4 is the best companion for overclockers and enthusiasts.
Easy To Apply
Thanks to its consistency, the MX-4 is easy to apply even for beginners.
Safe Application
THE ARCTIC MX-4 is a metal-free and non-electrically conductive paste. This minimizes the risk of short circuits and provides perfect protection for your computer. The application is also easy, because the consistency of the paste is ideal for use on chips.
Long Shelf Life
Compared to metal or silicone heat paste, you don't have to compromise with the MX-4. Once applied, it lasts at least 8 years.
Great Value For Money
A high-performance thermal grease for system integrators, which is certainly above expectations due to its low price.
- Thermal conductivity: 8.5 W/(MK)
- Viscosity: 870 poise
- Density: 2.50 g/cm³
- Continuity resistance: 3.8 X 1013 O-cm

20% better performance
With its improved setup, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The calculation is based on the temperature difference between the cooling base and the heat source (in °C) in relation to the applied heat load (in W), which also results in the unit °C/W. The higher the thermal resistance, the worse the compound is at transferring heat through the TIM layer. As an example, thermal insulators therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low resistance.
Proven quality
We are proud of our thermal compounds. After over 20 years of experience in the PC cooling market and with the goal of offering a first-class product at a fair price, the MX-6 thermal compound was developed. The optimised formula is based on the tried-and-tested MX-4 thermal compound, one of the best-selling thermal compounds in the world. The focus was on a wide variety of applications and easy-to-use consistency.
- Viscosity: 45000 poise
- Density: 2.6 g/cm³
- Operating temperature: -50 - 150°C
- Resistance: 1.8 x 1012 O-cm
- Breakdown voltage: 7.5 kV/mm
- Colour: grey

20% better performance
With its improved setup, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The calculation is based on the temperature difference between the cooling base and the heat source (in °C) in relation to the applied heat load (in W), which also results in the unit °C/W. The higher the thermal resistance, the worse the compound is at transferring heat through the TIM layer. As an example, thermal insulators therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low resistance.
Proven quality
We are proud of our thermal compounds. After over 20 years of experience in the PC cooling market and with the goal of offering a first-class product at a fair price, the MX-6 thermal compound was developed. The optimised formula is based on the tried-and-tested MX-4 thermal compound, one of the best-selling thermal compounds in the world. The focus was on a wide variety of applications and easy-to-use consistency.
- Viscosity: 45000 poise
- Density: 2.6 g/cm³
- Operating temperature: -50 - 150°C
- Resistance: 1.8 x 1012 O-cm
- Breakdown voltage: 7.5 kV/mm
- Colour: grey

20% better performance
With its improved setup, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The calculation is based on the temperature difference between the cooling base and the heat source (in °C) in relation to the applied heat load (in W), which also results in the unit °C/W. The higher the thermal resistance, the worse the compound is at transferring heat through the TIM layer. As an example, thermal insulators therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low resistance.
Proven quality
We are proud of our thermal compounds. After over 20 years of experience in the PC cooling market and with the goal of offering a first-class product at a fair price, the MX-6 thermal compound was developed. The optimised formula is based on the tried-and-tested MX-4 thermal compound, one of the best-selling thermal compounds in the world. The focus was on a wide variety of applications and easy-to-use consistency.
- Viscosity: 45000 poise
- Density: 2.6 g/cm³
- Operating temperature: -50 - 150°C
- Resistance: 1.8 x 1012 O-cm
- Breakdown voltage: 7.5 kV/mm
- Colour: grey

This thermal compound is the ideal choice for overclockers.
Extraordinary performance
ARCTIC MX-4 consists of carbon micro-particles which guarantee extremely high thermal conductivity. This ensures fast and efficient heat dissipation from the CPU or GPU.
Quick and easy to use
ARCTIC MX-4 is a metal-free and non-electrically conductive paste. This minimises the risk of short circuits and offers perfect protection for your computer. Application is also very easy as the consistency is ideal for use on chips.
Super price/performance ratio
In addition to the performance, the price is also absolutely great. This makes ARCTIC MX-4 the best thermal compound on the market.
• Thermal conductivity (W/mK): 8.5
• Viscosity (poise): 870
• Density (g/cm³): 2.5

20% better performance
With its improved setup, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The calculation is based on the temperature difference between the cooling base and the heat source (in °C) in relation to the applied heat load (in W), which also results in the unit °C/W. The higher the thermal resistance, the worse the compound is at transferring heat through the TIM layer. As an example, thermal insulators therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low resistance.
Proven quality
We are proud of our thermal compounds. After over 20 years of experience in the PC cooling market and with the goal of offering a first-class product at a fair price, the MX-6 thermal compound was developed. The optimised formula is based on the tried-and-tested MX-4 thermal compound, one of the best-selling thermal compounds in the world. The focus was on a wide variety of applications and easy-to-use consistency.
- Viscosity: 45000 poise
- Density: 2.6 g/cm³
- Operating temperature: -50 - 150°C
- Resistance: 1.8 x 1012 O-cm
- Breakdown voltage: 7.5 kV/mm
- Colour: grey

The surfaces of processor chips and cooler bases are characterised by microscopic irregularities. The ARCTIC MX-4 thermal compound consists of carbon microparticles, which fill these holes, leading to extremely high thermal conductivity. This ensures that heat is dissipated from the CPU or GPU quickly and efficiently. With its outstanding performance, the MX-4 is an excellent choice for overclockers and enthusiasts, as well as for other applications where thermal transfer is required. The MX-4 fully proves that great performance does not necessarily require a high price.
Easy to apply
The consistency of the MX-4 means application is easy, even for beginners. In the video we show the application possibilities to prevent air pockets between processor and cooler.
Secure application
Unlike metal-oxide-based pastes or liquid metal, the ARCTIC MX-4 is metal-free and non-conductive.

- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

The Kryonaut thermal compound is supplied in a 1.5-ml syringe with two applicators. Using these applicators, an area measuring 27x27 mm can be coated with an approx. 3-mm drop of paste, so that the syringe lasts for around 15 applications - but of course, this depends on the individual application and skill.
Technical details:
- Quantity: 1.5 ml/5.55g
- Thermal conductivity: 12.5 W/(m·K)
- Density: 3.7g/cm³
- Viscosity: 120 - 170 Pa·s
- Operating temperature: -200 to +350°C

Award-winning performance
NT-H1 has been included with Noctua's premium CPU coolers since 2007 and has been able to prove its outstanding performance in countless test reports. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.

- Ultra-high thermal conductivity
- Increased indium content
- Optimum application thanks to plastic needle
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The fill quantity of one gram of liquid metal is sufficient for far more than 10 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for overclockers or anyone wanting as quiet a system as possible with optimal cooling performance.

For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.

For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.

- Silicone-free

-Ceramic-based compound containing silicone
-Thermal conductivity of more than 1.066 W/m-K
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.

- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

Uniformly distributed layers of thermal compound with a high thermal conductivity of 13 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!


- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

Uniformly distributed layers of thermal compound with a high thermal conductivity of 13 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!

Uniformly distributed layers of thermal compound with a high thermal conductivity of 11.25 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!

- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

Uniformly distributed layers of thermal compound with a high thermal conductivity of 11.25 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!

Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results, and thanks to the included cleaning wipes, it is just as easy to remove as to apply - an enthusiast-grade paste for the highest demands.
The AM5 Edition also includes the NA-TPG1 thermal paste guard that prevents thermal paste buildup in the cut-outs of the heatspreader of AMD AM5 CPUs - a simple yet highly effective means to keep your AM5 processor clean.

Designed to eliminate the need to struggle with clips to secure your fan to the heat sink. Simply slide the fan down and it's ready to use! Not only is this easy - it also improves RAM access.
Long-term adaptability
With a TDP range of 140 W - 180 W, the G4 Midnight is flexible for your future PC upgrades!
Low noise even at higher speeds
Even with 58.5 CFM airflow, our 600 - 1400 RPM fan has a maximum noise level of 22.5 dBA.
Keep your style
The transparent black fan keeps it in your colour scheme while displaying all the ARGB combinations you might want for your PC.
LGA 1700 mounting kit
The LGA 1700 mounting kit (for IceSLEET® G) is supplied free of charge with the IceSLEET® G3 or G4 series.

Designed to eliminate the need to struggle with clips to secure your fan to the heat sink. Simply slide the fan down and it's ready to use! Not only is this easy - it also improves RAM access.
Long-term adaptability
With a TDP range of 140 W - 180 W, the G4 overclock is flexible for your future PC upgrades!
Low noise even at higher speeds
Even with 58.5 CFM airflow, our 600 - 1400 RPM fan has a maximum noise level of 22.5 dBA.
Optimised heat regulation
The large direct-touch socket completely covers the chipset and ensures maximum heat dissipation.
Brilliant ARGB control function
The ARGB function allows you to customise the colours that light up on your CPU cooler. The 16 ARGB LEDs provide a seamless lighting effect.
LGA 1700 mounting kit
The LGA 1700 mounting kit (for IceSLEET® G) is supplied free of charge with the IceSLEET® G3 or G4 series.


The included spatula makes the thermal compound easy to apply, even for beginners.
- Available in three different quantities: 0.5 g, 1 g and 4 g
- Thermal conductivity: 4 W/mK
- Thermal resistance of 0.095°C*cm2/w
- Viscosity of 4,800,000 mPas (22°C)
- Includes spatula
LC-TG-05G: 0.5 g
LC-TG-1G: 1 g
LC-TG-4G: 4 g

- Bluetooth mode: up to three different Bluetooth devices of your choice can be connected and selected at the touch of a button - ideal when using different devices.
- 2.4-GHz mode with dongle: interference-free, secure transmission and coexistence with other devices.
- Low Latency Mode (LLM) - the super-fast, wireless connection. Ideal for gaming PCs. With a latency of less than 1 ms. Multi-use
- USB cable mode: with the cable, you can also play while charging. Minimum latency and maximum speed!
CHERRY MX 3.0S Wireless - the wireless high-performance gaming keyboard
- Colour fun - RGB illumination options ranging from monochrome to RGB colour effects in over 16 million colours on each single button
- Gaming style - keyboard in high-quality aluminium continuous cast-iron housing
- Intelligent charging technology - carry on gaming even when the keyboard is attached to the USB cable for charging
- Abrasion-resistant keys with 2-component injection moulding
Included in delivery:
- Keyboard
- Nano USB receiver
- USB-A to Micro-USB cable
- Quick-start guide

- Bluetooth mode: up to three different Bluetooth devices of your choice can be connected and selected at the touch of a button - ideal when using different devices.
- 2.4-GHz mode with dongle: interference-free, secure transmission and coexistence with other devices.
- Low Latency Mode (LLM) - the super-fast, wireless connection. Ideal for gaming PC. With a latency of less than 1 ms. Multi-use
- USB cable mode: with the cable, you can also play while charging. Minimum latency and maximum speed!
CHERRY MX 3.0S Wireless - the wireless high-performance gaming keyboard
- Colour fun - RGB illumination options ranging from monochrome to RGB colour effects in over 16 million colours on each single button
- Gaming style - keyboard in high-quality aluminium continuous cast-iron housing
- Intelligent charging technology - carry on gaming even when the keyboard is attached to the USB cable for charging
- Abrasion-resistant keys with 2-component injection moulding
Included in delivery:
- Keyboard
- Nano USB receiver
- USB-A to Micro-USB cable
- Quick-start guide

- Ultra-high thermal conductivity
- Increased indium content
- Plastic needle for optimum application
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The five-gram quantity of liquid metal is sufficient for well over 50 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for anyone overclocking or wanting a system as quiet as possible with optimal cooling performance!
Note: The Conductonaut thermal compound must not be used with aluminium coolers!

Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results.
The SW (spatula & wipes) edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.

- THERMAL PASTE 5 PACK: Metal-oxide-based compound may help to improve the heat dissipation of CPUs and other computer chips, provides better thermal conductivity than standard thermal compounds with negligible electrical conductivity
- HIGH THERMAL CONDUCTIVITY: Suitable for use at temperatures from -30°C to 180°C, this compound has a thermal conductivity of 3.07 W/m-K at 25°C or higher, ideal for maintenance of workstations or desktop CPUs/GPUs
- PRACTICAL SIZE: Each tube contains 1.5 g of paste (4-6 applications), with a resealable nozzle that prevents it from drying out. The 5 pack is ideal for application to multiple workstations and provides enough compound for 20-30 applications
- CERTIFIED: This thermal compound is CE and RoHS certified, so you can be sure it is safe for its intended use. The mixture contains 50% silicone, 30% carbon and 20% metal oxide.

Description:
The SGM706 microprocessor monitoring circuit reduces the complexity and number of components required to monitor power and control microprocessor activity. It significantly improves system reliability and accuracy compared to separate ICs or discrete components. The SGM706 provides power supply monitoring circuitry that generates a reset output during power-up, shutdown, and brownout. The reset output remains operational even when the VCC is as low as 1 V. An independent watchdog monitoring circuit is also provided. This is activated if the watchdog input is not toggled within 1.6 seconds. In addition, there is a 1.25 V threshold detector for power failure warning, low battery detection, or supplemental power supply monitoring. An active-low manual reset (MR) input is also provided. The SGM706 is available in a green SOIC-8 package. The SGM706-S is available in a green SOIC-8 and MSOP-8 package. They operate over an ambient temperature range of -40? to +85?
Features:
• precision supply voltage monitor.
- 4.65V for SGM706-L
- 4.40V for SGM706-M
- 4.0V for SGM706-J
- 3.08V for SGM706-T
- 2,93V for SGM706-S
- 2.63V for SGM706-R
• Guaranteed RESET valid at VCC = 1V
• 200ms reset pulse width
• Debounced TTL/CMOS compatible manual reset input
• Independent watchdog timer (1.6s) timeout
• Voltage monitoring for power-fail or low-battery warning
• SGM706 is available in a green SOIC-8 package
• SGM706-S is available in a green SOIC-8 and MSOP-8 package
Applications:
• computers
• controllers
• Intelligent Instruments
• Automotive Systems
• Critical µP Power Monitoring

Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results.
The AM5 edition includes the NA-TPG1 thermal paste guard that prevents thermal paste buildup in the cut-outs of the heatspreader of AMD AM5 processors - a simple yet highly effective means to keep your AM5 processor clean.

The included spatula makes the thermal compound easy to apply, even for beginners.
- Available in three different quantities: 0.5 g, 1 g and 4 g
- Thermal conductivity: 4 W/mK
- Thermal resistance of 0.095°C*cm2/w
- Viscosity of 4,800,000 mPas (22°C)
- Includes spatula
LC-TG-05G: 0.5 g
LC-TG-1G: 1 g
LC-TG-4G: 4 g