ARCTIC MX-4-8 - Arctic MX-4 thermal compound, 8 g

15.07 EUR
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Multi-award-winning thermal compound
The performance of the ARCTIC MX-4 thermal compound has been tested and featured in numerous independent magazines.
Better than liquid metal
The ARCTIC MX-4 thermal compound consists of carbon microparticles, which results in extremely high thermal conductivity. This ensures that heat can dissipate from the CPU or GPU quickly and efficiently. The outstanding performance of the MX-4 makes it the ideal product for overclockers and enthusiasts.
Easy to apply
The consistency of the MX-4 means application is easy, even for beginners.
EAN: 4895213701662
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Multi-award-winning thermal compound
The performance of the ARCTIC MX-4 thermal compound has been tested and featured in numerous independent magazines.
Better than liquid metal
The ARCTIC MX-4 thermal compound consists of carbon microparticles, which results in extremely high thermal conductivity. This ensures that heat can dissipate from the CPU or GPU quickly and efficiently. The outstanding performance of the MX-4 makes it the ideal product for overclockers and enthusiasts.
Easy to apply
The consistency of the MX-4 means application is easy, even for beginners.
- Thermal conductivity: 8.5 W/m.K
- Viscosity: 870 poise
- Density: 2.50 g/cm³
- Resistance: 3.8 x 1013 O-cm
EAN: 4895213701662
Delivery Cost: 9.95 EUR
Availability: in stock
Delivery Time: 4-5 business days
Condition: new
Comparison of Similar Products

20% better performance
With its improved setup, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The calculation is based on the temperature difference between the cooling base and the heat source (in °C) in relation to the applied heat load (in W), which also results in the unit °C/W. The higher the thermal resistance, the worse the compound is at transferring heat through the TIM layer. As an example, thermal insulators therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low resistance.
Proven quality
We are proud of our thermal compounds. After over 20 years of experience in the PC cooling market and with the goal of offering a first-class product at a fair price, the MX-6 thermal compound was developed. The optimised formula is based on the tried-and-tested MX-4 thermal compound, one of the best-selling thermal compounds in the world. The focus was on a wide variety of applications and easy-to-use consistency.
- Viscosity: 45000 poise
- Density: 2.6 g/cm³
- Operating temperature: -50 - 150°C
- Resistance: 1.8 x 1012 O-cm
- Breakdown voltage: 7.5 kV/mm
- Colour: grey

20% better performance
With its improved setup, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The calculation is based on the temperature difference between the cooling base and the heat source (in °C) in relation to the applied heat load (in W), which also results in the unit °C/W. The higher the thermal resistance, the worse the compound is at transferring heat through the TIM layer. As an example, thermal insulators therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low resistance.
Proven quality
We are proud of our thermal compounds. After over 20 years of experience in the PC cooling market and with the goal of offering a first-class product at a fair price, the MX-6 thermal compound was developed. The optimised formula is based on the tried-and-tested MX-4 thermal compound, one of the best-selling thermal compounds in the world. The focus was on a wide variety of applications and easy-to-use consistency.
- Viscosity: 45000 poise
- Density: 2.6 g/cm³
- Operating temperature: -50 - 150°C
- Resistance: 1.8 x 1012 O-cm
- Breakdown voltage: 7.5 kV/mm
- Colour: grey

The surfaces of processor chips and cooler bases are characterised by microscopic irregularities. The ARCTIC MX-4 thermal compound consists of carbon microparticles, which fill these holes, leading to extremely high thermal conductivity. This ensures that heat is dissipated from the CPU or GPU quickly and efficiently. With its outstanding performance, the MX-4 is an excellent choice for overclockers and enthusiasts, as well as for other applications where thermal transfer is required. The MX-4 fully proves that great performance does not necessarily require a high price.
Easy to apply
The consistency of the MX-4 means application is easy, even for beginners. In the video we show the application possibilities to prevent air pockets between processor and cooler.
Secure application
Unlike metal-oxide-based pastes or liquid metal, the ARCTIC MX-4 is metal-free and non-conductive.

This thermal compound is the ideal choice for overclockers.
Extraordinary performance
ARCTIC MX-4 consists of carbon micro-particles which guarantee extremely high thermal conductivity. This ensures fast and efficient heat dissipation from the CPU or GPU.
Quick and easy to use
ARCTIC MX-4 is a metal-free and non-electrically conductive paste. This minimises the risk of short circuits and offers perfect protection for your computer. Application is also very easy as the consistency is ideal for use on chips.
Super price/performance ratio
In addition to the performance, the price is also absolutely great. This makes ARCTIC MX-4 the best thermal compound on the market.
• Thermal conductivity (W/mK): 8.5
• Viscosity (poise): 870
• Density (g/cm³): 2.5

20% better performance
With its improved setup, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The calculation is based on the temperature difference between the cooling base and the heat source (in °C) in relation to the applied heat load (in W), which also results in the unit °C/W. The higher the thermal resistance, the worse the compound is at transferring heat through the TIM layer. As an example, thermal insulators therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low resistance.
Proven quality
We are proud of our thermal compounds. After over 20 years of experience in the PC cooling market and with the goal of offering a first-class product at a fair price, the MX-6 thermal compound was developed. The optimised formula is based on the tried-and-tested MX-4 thermal compound, one of the best-selling thermal compounds in the world. The focus was on a wide variety of applications and easy-to-use consistency.
- Viscosity: 45000 poise
- Density: 2.6 g/cm³
- Operating temperature: -50 - 150°C
- Resistance: 1.8 x 1012 O-cm
- Breakdown voltage: 7.5 kV/mm
- Colour: grey

The performance of THE ARCTIC MX-4 thermal grease has been tested and awarded by numerous independent magazines.
Better than liquid metal
THE ARCTIC MX-4 thermal grease consists of carbon microparticles, which lead to an extremely high thermal conductivity. This ensures that heat can be dissipated quickly and efficiently from the CPU or GPU. With its outstanding performance, the MX-4 is the best companion for overclockers and enthusiasts.
Easy To Apply
Thanks to its consistency, the MX-4 is easy to apply even for beginners.
Safe Application
THE ARCTIC MX-4 is a metal-free and non-electrically conductive paste. This minimizes the risk of short circuits and provides perfect protection for your computer. The application is also easy, because the consistency of the paste is ideal for use on chips.
Long Shelf Life
Compared to metal or silicone heat paste, you don't have to compromise with the MX-4. Once applied, it lasts at least 8 years.
Great Value For Money
A high-performance thermal grease for system integrators, which is certainly above expectations due to its low price.
- Thermal conductivity: 8.5 W/(MK)
- Viscosity: 870 poise
- Density: 2.50 g/cm³
- Continuity resistance: 3.8 X 1013 O-cm

20% better performance
With its improved setup, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The calculation is based on the temperature difference between the cooling base and the heat source (in °C) in relation to the applied heat load (in W), which also results in the unit °C/W. The higher the thermal resistance, the worse the compound is at transferring heat through the TIM layer. As an example, thermal insulators therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low resistance.
Proven quality
We are proud of our thermal compounds. After over 20 years of experience in the PC cooling market and with the goal of offering a first-class product at a fair price, the MX-6 thermal compound was developed. The optimised formula is based on the tried-and-tested MX-4 thermal compound, one of the best-selling thermal compounds in the world. The focus was on a wide variety of applications and easy-to-use consistency.
- Viscosity: 45000 poise
- Density: 2.6 g/cm³
- Operating temperature: -50 - 150°C
- Resistance: 1.8 x 1012 O-cm
- Breakdown voltage: 7.5 kV/mm
- Colour: grey

This thermal compound is the ideal choice for overclockers.
Extraordinary performance
ARCTIC MX-4 consists of carbon micro-particles which guarantee extremely high thermal conductivity. This ensures fast and efficient heat dissipation from the CPU or GPU.
Quick and easy to use
ARCTIC MX-4 is a metal-free and non-electrically conductive paste. This minimises the risk of short circuits and offers perfect protection for your computer. Application is also very easy as the consistency is ideal for use on chips.
Super price/performance ratio
In addition to the performance, the price is also absolutely great. This makes ARCTIC MX-4 the best thermal compound on the market.
• Thermal conductivity (W/mK): 8.5
• Viscosity (poise): 870
• Density (g/cm³): 2.5

The surfaces of processor chips and cooler bases are characterised by microscopic irregularities. The ARCTIC MX-4 thermal compound consists of carbon microparticles, which fill these holes, leading to extremely high thermal conductivity. This ensures that heat is dissipated from the CPU or GPU quickly and efficiently. With its outstanding performance, the MX-4 is an excellent choice for overclockers and enthusiasts, as well as for other applications where thermal transfer is required. The MX-4 fully proves that great performance does not necessarily require a high price.
Easy to apply
The consistency of the MX-4 means application is easy, even for beginners. In the video we show the application possibilities to prevent air pockets between processor and cooler.
Secure application
Unlike metal-oxide-based pastes or liquid metal, the ARCTIC MX-4 is metal-free and non-conductive.

- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

The Kryonaut thermal compound is supplied in a 1.5-ml syringe with two applicators. Using these applicators, an area measuring 27x27 mm can be coated with an approx. 3-mm drop of paste, so that the syringe lasts for around 15 applications - but of course, this depends on the individual application and skill.
Technical details:
- Quantity: 1.5 ml/5.55g
- Thermal conductivity: 12.5 W/(m·K)
- Density: 3.7g/cm³
- Viscosity: 120 - 170 Pa·s
- Operating temperature: -200 to +350°C

Award-winning performance
NT-H1 has been included with Noctua's premium CPU coolers since 2007 and has been able to prove its outstanding performance in countless test reports. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.

- Ultra-high thermal conductivity
- Increased indium content
- Optimum application thanks to plastic needle
The Thermal Grizzly Conductonaut high-performance compound is extremely high-yield. The fill quantity of one gram of liquid metal is sufficient for far more than 10 applications. And if a little too much liquid metal has got onto the processor, it can simply be sucked back into the syringe. Correct dosage is therefore very easy to achieve. On average, an amount the size of half a grain of rice is sufficient for a processor. Various web and print magazines have also confirmed the clear supremacy of this unique thermal compound through detailed tests and reviews. Perfect for overclockers or anyone wanting as quiet a system as possible with optimal cooling performance.

For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.

For air or water cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 achieves consistently top results and thanks to the supplied cleaning cloths the paste can be removed as easily as it can be applied - a solution for the highest demands of enthusiasts!
Based on the award winning NT-H1
NT-H2 is based on Noctua's renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Overclockers and hardware enthusiasts around the globe are particularly fond of the NT-H1, making it an established reference for high-quality thermal compounds.

- Silicone-free

-Ceramic-based compound containing silicone
-Thermal conductivity of more than 1.066 W/m-K
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.

- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

Uniformly distributed layers of thermal compound with a high thermal conductivity of 13 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!


- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

Uniformly distributed layers of thermal compound with a high thermal conductivity of 13 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!

Uniformly distributed layers of thermal compound with a high thermal conductivity of 11.25 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!

- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:
- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties

Uniformly distributed layers of thermal compound with a high thermal conductivity of 11.25 W/mK ensure a highly efficient heat transfer that allows higher clock rates and keeps your system in top shape.
No spatula? No problem!
The combination of precision applicator and angled spatula has been designed for ease of use. Easy application with less spillage.
Superior operating temperature
FUZEIce® can handle up to 200°C and lasts for years!

Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results, and thanks to the included cleaning wipes, it is just as easy to remove as to apply - an enthusiast-grade paste for the highest demands.
The AM5 Edition also includes the NA-TPG1 thermal paste guard that prevents thermal paste buildup in the cut-outs of the heatspreader of AMD AM5 CPUs - a simple yet highly effective means to keep your AM5 processor clean.

Designed to eliminate the need to struggle with clips to secure your fan to the heat sink. Simply slide the fan down and it's ready to use! Not only is this easy - it also improves RAM access.
Long-term adaptability
With a TDP range of 140 W - 180 W, the G4 Midnight is flexible for your future PC upgrades!
Low noise even at higher speeds
Even with 58.5 CFM airflow, our 600 - 1400 RPM fan has a maximum noise level of 22.5 dBA.
Keep your style
The transparent black fan keeps it in your colour scheme while displaying all the ARGB combinations you might want for your PC.
LGA 1700 mounting kit
The LGA 1700 mounting kit (for IceSLEET® G) is supplied free of charge with the IceSLEET® G3 or G4 series.

- CPU cores: 8
- Threads: 16
- Max. clock speed: 5.1 GHz
- Base clock speed: 4.2 GHz
- Overall L2 cache: 8 MB
- Overall L3 cache: 16 MB
- Standard power consumption/power consumption: 65 W
- AMD configurable TDP (cTDP): 45 - 65 W
- Processor technology for CPU cores: TSMC 4-nm FinFET
- Unlocked: Yes
- Socket: AM5
- Max. temperature: 95°C
Release: 2024/Q1
Please note!
Not every processor will run on every motherboard, even if they share the same socket size.
In some cases, a BIOS update on the motherboard or even a specific chipset is required.

- CPU cores: 8
- Threads: 16
- GPU cores: 8
- Base clock: 3.8 GHz
- Max. power speed: Up to 4.6 GHz
- Total L2 cache: 4 MB
- Total L3 cache: 16 MB
- Unlocked: Yes
- CMOS: TSMC 7 nm FinFET
- Package: AM4
- PCI Express® version: PCIe® 3.0
- Thermal solution: Wraith Stealth
- Standard power consumption/power consumption: 65 W
- cTDP: 45 - 65 W
- Max. temperature: 95°C


Designed to eliminate the need to struggle with clips to secure your fan to the heat sink. Simply slide the fan down and it's ready to use! Not only is this easy - it also improves RAM access.
Long-term adaptability
With a TDP range of 140 W - 180 W, the G4 overclock is flexible for your future PC upgrades!
Low noise even at higher speeds
Even with 58.5 CFM airflow, our 600 - 1400 RPM fan has a maximum noise level of 22.5 dBA.
Optimised heat regulation
The large direct-touch socket completely covers the chipset and ensures maximum heat dissipation.
Brilliant ARGB control function
The ARGB function allows you to customise the colours that light up on your CPU cooler. The 16 ARGB LEDs provide a seamless lighting effect.
LGA 1700 mounting kit
The LGA 1700 mounting kit (for IceSLEET® G) is supplied free of charge with the IceSLEET® G3 or G4 series.






